• 열처리공학회지
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• 제14권1호
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• pp.17-21
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• 2001

The effects of Cr content above its solubility limit and thermomechanical treatment on tensile strength and electrical conductivity of Cu-Cr alloys were studied to obtain optimum Cr content exhibiting a high tensile strength without degradation of electrical conductivity. The increase in Cr content above the solubility limit increased tensile strength of Cu-Cr alloys without deterioration of the electrical conductivity. The electrical conductivity was not affected by cold rolling. The electrical conductivity of a Cu-3.5%Cr alloy subjected to cold rolling ${\rightarrow}$ aging treatment ($450^{\circ}C{\times}1hr$) ${\rightarrow}$ cold rolling was equal to that of the alloy subjected to cold rolling ${\rightarrow}$ aging treatment. However, the tensile strength of the alloy subjected to the former thermomechanical treatment was superior to that of the alloy subjected to the latter thermomechanical treatment at all the deformation degrees.

• 전기학회논문지
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• 제67권12호
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• pp.1633-1640
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• 2018

Epoxy resin is a polar thermosetting polymer that is widely employed in different branches of industry and everyday life, due to their stable physical and chemical properties. Of all the polymer materials currently being used in the electrical insulation industry, epoxy resin is the most widely used kind, chosen as the base polymer material in the present study. Composites were prepared according to the mixing ratio (MS: MA, 1: 9, 3: 7, 5: 5, 7: 3, 9: 1)of mixture for Heterogeneous Minerals(Micro Silica:MS, Micro Alumina:MA) (MS+MA). We have investigated for AC electrical insulation breakdown characteristics and the dielectric properties (permittivity, dielectric loss, and conductivity) with frequency changes. The electrical AC insulation breakdown performance was improved with the increase of the mixing ratio of MS according to heterogeneous mineral material mixture(MS+MA). As Dielectric properties, the dielectric constant and dielectric loss increased with decreasing frequency and decreased with increasing MS content ratio of heterogeneous mineral mixture. Tensile strength and flexural strength according to the mixing ratio (MS + MA) of epoxy / heterogeneous mineral mixture were studied by mechanical properties. The performance of mechanical tensile and flexural strength was significantly improved as the fill contents ratio of MS increased.

• 한국표면공학회지
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• 제46권1호
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• pp.9-15
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• 2013

The effect of the additionally applied electrical current on the adhesion strength between electroless Cu and polyimide films was investigated. Peel tests were performed after applying electrical current within the range from 0.1 to 100 mA for the duration from 1 to 30 minutes. Sample with more than 1 mA of additional electrical current for 1 minute showed higher adhesion strength than that without additional electrical current. However, samples with 10 mA of additional electrical current for more than 10 miniutes showed the degradation of adhesion strength. Ra and RMS values of the peeled polyimide surface were proportional to the adhesion strength though there were no significant changes in the morphology of the peeled surfaces with varied amount and time-length of additional electrical current. Applying electrical current could increase the density of chemical bonding, which results in increase of the adhesion strength between copper and polyimide. However, in the case of applying additional electrical current for excessive amount or time, the degradation of the adhesion strength owing to the formation of copper oxide at the interface could occur.

• 한국농공학회논문집
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• 제56권1호
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• pp.21-30
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• 2014

The objective of this study is to find the electrical properties of Bottom ash from thermoelectric power plants in Korea. By using Parallel Plate Method, the electrical resistivity and dielectric constant were measured at the frequency from 20 Hz to 10 MHz. Also, unconfined strength test, XRF and sieve analysis were performed for finding the relationship between strength, physiochemical properties and electrical properties. In the result, the change of electrical resistivity and dielectric constant of bottom ash against frequency was similar to that of general soil. The proportion of fine grain in bottom ash had the positive correlation with dielectric constant and negative correlation with electrical resistivity. Chloride and sulfur trioxide were proportional to dielectric constant and the more bottom ash had chloride content, the lower electrical resistivity appeared in bottom ash. Unconfined strength of bottom ashes had a range from 200 kPa to 780 kPa and strength was inverse proportional to electrical resistivity.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.226-229
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• 1999

Epoxy compound has been used as insulation material in electrical equipment for a long time because of its excellent electrical, mechanical and chemical properties. Nowdays, becoming higher voltage system, the properties of interface between epoxy and metal insert become more important. The breakdown voltage of epoxy compound for electric material is variable according to the surface roughness of metal insert. Generally, with metal insert sanding, the adhesion strength is enhanced and the breakdown strength is reduced. But in this study, we knew that the adhesion strength became enhanced but the breakdown strength didn\`t reduced with metal insert sanding. So in this study sanding. So in this study, we suggest the optimum interface condition by adjusting the surface roughness.

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권5호
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• pp.247-251
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• 2004

We report highly improved yield strength of nickel thin film, prepared using electroplating. The micro-scaled nickel cantilever is found to have significantly higher yield strength than bulk nickel. For the yield strength test, the heights of the micro-scaled cantilever were varied up to 60 ${\mu}{\textrm}{m}$ and electrostatic force was used for actuation. Stress of the bent cantilever was estimated using the FEM large deflection model. The yield strength of the thin nickel film is found to be over five times higher than that of the bulk nickel previously published. Results from this study indicate that metal microstructures can be used for MEMS applications requiring large deflection.

• Transactions on Electrical and Electronic Materials
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• 제16권5호
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• pp.260-263
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• 2015

Epoxy/micro-sized alumina composite was prepared and the effects of alumina content on the electrical and mechanical properties were investigated in order to develop an insulation material for gas insulated switchgear (GIS). Nano-sized alumina (average particle size: 30 μm) was also incorporated into the epoxy/micro-sized alumina composite. An electrical insulation breakdown strength test was carried out in sphere-sphere electrodes and the data were estimated by Weibull statistical analysis. Tensile strength was measured at a crosshead speed of 10 mm/min using a universal testing machine. Alumina content was varied from 0 wt% to 70 wt%.). As micro-sized alumina content increased, insulation breakdown strength increased until 40 wt% alumina content and decreased after that content. The tensile strength of a neat epoxy system was 82.2 MPa and that value for 60 wt% alumina content was 91.8 MPa, which was 111.7% higher than inthe neat epoxy system. The insulation breakdown strength of micro-sized alumina (60 wt%)/nano-sized alumina (1 phr) glycerol diglycidyl ether (GDE) (1 phr) composite was 54.2 MPa, which was 116% higher than the strength of the system without nano-sized alumina.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.78-81
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Computers and Concrete
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• 제32권4호
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• pp.373-381
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• 2023

Fly ash, granulated blast furnace slag, marble waste powder, etc. are just some of the by-products of other sectors that the construction industry is looking to include into the many types of concrete they produce. This research seeks to use surrogate machine learning methods to forecast the compressive strength of self-compacting concrete. The surrogate models were developed using Gradient Boosting Machine (GBM), Support Vector Machine (SVM), Random Forest (RF), and Gaussian Process Regression (GPR) techniques. Compressive strength is used as the output variable, with nano silica content, cement content, coarse aggregate content, fine aggregate content, superplasticizer, curing duration, and water-binder ratio as input variables. Of the four models, GBM had the highest accuracy in determining the compressive strength of SCC. The concrete's compressive strength is worst predicted by GPR. Compressive strength of SCC with nano silica is found to be most affected by curing time and least by fine aggregate.

• 한국전기전자재료학회논문지
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• 제31권7호
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• pp.496-501
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• 2018

In this study, we prepared 40, 45, 50, 55, 60, 65, and 70 wt% content composites filled in epoxy matrix for two micro silica and three micro alumina types for use as a GIS heavy electric machine. As a filler type of epoxy composite, micro silica composites showed excellent AC breakdown strength properties compared to micro alumina composites in the case of electrical properties of micro silica and alumina. The electrical breakdown properties of micro silica composites increased with increasing filler content, whereas those of micro alumina decreased with increasing filler content. In the case of mechanical properties, the micro silica composite showed improved tensile strength and flexural strength compared with the micro alumina composite. In addition, mechanical properties such as tensile strength and flexural strength of micro silica and alumina composites decreased with increasing filler content. This is probably because O-H groups are present on the surface of silica in the case of micro silica but are not present on the surface of alumina in the case of micro alumina.