KIEE International Transactions on Electrophysics and Applications

The Korean Institute of Electrical Engineers (대한전기학회)
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Measurement of Yield Strength for Electroplated Nickel Film Using Micro-cantilever

  • Moon, Hyoung-Sik (HMED LAB. Dept. of Electrical, Information and Control Engineering, Hongik University) ;
  • Kim, Jooh-Wan (HMED LAB. Dept. of Electrical, Information and Control Engineering, Hongik University) ;
  • Kim, Young-Min (HMED LAB. Dept. of Electrical, Information and Control Engineering, Hongik University)
  • Published : 2004.10.01
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Abstract

We report highly improved yield strength of nickel thin film, prepared using electroplating. The micro-scaled nickel cantilever is found to have significantly higher yield strength than bulk nickel. For the yield strength test, the heights of the micro-scaled cantilever were varied up to 60 ${\mu}{\textrm}{m}$ and electrostatic force was used for actuation. Stress of the bent cantilever was estimated using the FEM large deflection model. The yield strength of the thin nickel film is found to be over five times higher than that of the bulk nickel previously published. Results from this study indicate that metal microstructures can be used for MEMS applications requiring large deflection.

Keywords

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