• Composites Research
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• v.31 no.1
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• pp.30-36
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• 2018

The curing behavior of glass fiber reinforced epoxy prepregs based on Bisphenol-A (BPA) was studied by differential scanning calorimetry (DSC). The total heat of reaction(${\Delta}H_{total}=280.3J/g$) was determined based on the results of the dynamic heating scanning experiments. Isothermal experiments were carried out at $110{\sim}130^{\circ}C$, and it was observed that the maximum conversion and the maximum reaction rate were increased as temperature increased. Also Kamal equation was applied to analyze autocatalytic reaction of epoxy prepregs. The higher temperatures, the greater reaction rate constants ($k_1$, $k_2$). Theoretical values were calculated by these reaction rate constants and compared with experimental values. And it was confirmed that they were in reasonable agreement. At the beginning of the reaction, the experimental data and theoretical prediction were shown the same tendency, but at the end of reaction, the experimental data were smaller than theoretical predicted values due to reaction rates controlled by diffusion.

• Proceedings of the Korean Fiber Society Conference
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• 1996.04a
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• pp.64-68
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• 1996

PP-EVOH(poly(vinyl alchol-co-ethylene)) blends were prepared by the mixing of polypropylene and poly(vinyl alcohol-co-ethylene) containing 38mol% of ethylene units (EVOH38) at melt state above PP melting temperature. The materials were characterized by using dynamic mechanical thermal analysis (DMTA), differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and contact angle measurement to detemine the glass transition, meltin, decomposition temperatures, and wettability respectively. From the results, PP-EVOH(poly(vinyl alcohol-co-ethylene)) blends exgibits partial miscibility.

• Polymer(Korea)
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• v.24 no.3
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• pp.358-365
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• 2000

Miscibility itnd thermal behavior of blends of synthetic biodegradable aliphatic polyester (Bionolle) with poly(epichlorohydrin) (PECH) were investigated by a differential scanning calorimetry (DSC), a dynamic mechanical thermal analyzer (DMTA) and a rotational rheometer. Observed both single glass transition temperatures from the DSC in agreement with the Fox equation and single T$_{g}$ changes as a function of composition from the DMTA indicate that these blend mixtures are miscible. In addition, the miscibility of this blend system was also observed from the single curve of the Cole-Cole Plot of log G′($\omega$) vs. log C"($\omega$) from the dynamic test using a rotational rheometer. This was further verified from the cryogenically fractured surface of BDP/PECH blends by scanning electron microscopy.

• Polymer(Korea)
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• v.25 no.1
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• pp.15-24
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• 2001

In this study, the effects of different glycol molar ratios of unsaturated polyester(UPE) resins on the curing behaviors were investigated. The cross linking process was checked or monitored by differential scanning calorimetry(DSC) and by viscoelastic properties of rigid-body pendulum model. The knife-edge from which the pendulum is suspended, is immersed in a reaction mixture, and the change of the viscoelastic behavior brings on those of the period(T) and logarithmic decrement(${\Delta}$) of the damped free oscillations of the pendulum. The values of T and ${\Delta}$ obtained are related to the dynamic modulus(E') and modulus loss(E'). The information on the viscoelastic behavior of unsaturated polyester(UPE) resins during the curing process are shown to illustrate the usefulness of the techniques. As the content of NPG in a propylene glycol(PG)/NPG glycol mixture increased, both the cycle time during cure and the change of damping during cure of UPE resin decreased.

• Polymer(Korea)
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• v.24 no.1
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• pp.105-112
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• 2000

Using a commercial epoxy/carbon fiber composite prepreg (DMS 2224) as a model system, the cure kinetics of vitrifying thermoset system were analyzed by isothermal and dynamic-heating experiments. Focusing on the processing condition of high performance composite systems, a phenomenological kinetic model was developed by using differential scanning calorimetry (DSC) and reaction kinetics theories. The model system exhibited a limited degree of cure as a function of isothermal temperature seemingly due to the diffusion-controlled reaction rates. The diffusion-controlled cure reaction was incorporated in the development of the kinetic model, and the model parameters were determined from isothermal experiments. The first order reaction was confirmed from the characteristic shape of isothermal cure thermograms, and the activation energy wes 78.43 kJ/mol. Finally, the proposed model was used to predict a complex autoclave thermal condition, which was composed of several isothermal and dynamic-heating stages.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.220-221
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• 2007

Recently, imprint lithography have received significant attention due to an alternative technology for photolithography on high performance microelectronic devices. In this work, we investigated thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various curing agent and spherical filler were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), rheometer and universal test machine(UTM).

• Transactions of Materials Processing
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• v.24 no.2
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• pp.101-106
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• 2015

Recently, silicone is being used for LED chip lens due to its good thermal stability and optical transmittance. In order to predict residual stresses, which cause optical birefringence and mechanical warpage of silicone, a finite element analysis was conducted for the curing of silicone during molding. For the analysis of the curing process, a dynamic cure kinetics model was derived based on the results of a differential scanning calorimetry (DSC) testing and applied to the material properties for finite element analysis. Finite element simulation results showed that a step cure cycle reduced abrupt reaction heat and showed a decrease in the residual stresses.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.207-208
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• 2007

Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).

• Polymer(Korea)
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• v.34 no.4
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• pp.306-312
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• 2010

Triphenylvinylsilane (TPVS) containing vinyl acetate (VAc), butyl acrylate (BA), and Nmethylolacrylamide (NMA) copolymers were prepared by emulsion polymerization. The polymerization was performed at $80^{\circ}C$ in the presence of auxiliary agents and ammonium peroxodisulfate (APS) as the initiator. Sodium dodecyl sulphate (SDS) and Arkupal N-300 were used as anionic and nonionic emulsifiers, respectively. The resulting copolymers were characterized by using Fourier transform infrared spectroscopy (FTIR), gel permeation chromatography (GPC), and dynamic light scattering (DLS). Thermal properties of the copolymers were studied by using thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The morphology of copolymers was also investigated by scanning electron microscopy (SEM) and then the effects of silicone concentrations on the properties of the TPVS-containing VAc-acrylic emulsion copolymers were discussed. The obtained copolymers have high solid content (50%) and can be used in weather resistant emulsion paints as a binder.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.134-137
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• 2001

The cure kinetics of a cycloalipatic epoxy / anhydride / Co(II) system for a no-flow underfill encapsulant, has been studied by using a differential scanning calorimetry(DSC) under isothermal and dynamic conditions over the temperature range of $160^{\circ}C ~220^{\circ}C$. The kinetic analysis was carried out by fitting dynamic/isothermal heating experimental data to the kinetic expressions to determine the reaction parameters, such as order of reaction and reaction constants. Diffusion-controlled reaction has been observed as the cure conversion increases and successfully analyzed by incorporating the diffusion control term into the rate equation. The prediction of reaction rates by the model equation corresponded well to experimental data at all temperature.