• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.18-23
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• 2016

QFN (Quad Flat No-leads Package) is one of the SMD (Surface Mount Device). Since there is no lead in QFN, there are many defects on solder. Therefore, we propose an efficient mechanism for QFN solder defect detection at this paper. For this, we employ Convolutional Neural Network (CNN) of the Machine Learning algorithm. QFN solder's color multi-layer images are used to train CNN. Since these images are 3-channel color images, they have a problem with applying to CNN. To solve this problem, we used each 1-channel grayscale image (Red, Green, Blue) that was separated from 3-channel color images. We were able to detect QFN solder defects by using this CNN. In this paper, it is shown that the CNN is superior to the conventional multi-layer neural networks in detecting QFN solder defects. Later, further research is needed to detect other QFN.

• Korean Journal of Materials Research
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• v.19 no.12
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• pp.699-702
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• 2009

Due to the importance of the SiGe/Si heterostructure in the fields of thermoelectric and electronic applications, SiGe/Si heterostructures have been extensively investigated. For practical applications, thermal stability of the heterostructure during the thermoelectric power generation or fabrication process of electronic devices is of great concern. In this work, we focused on the effect of thermal annealing on the defect configuration in the SiGe/Si heterostructure. The formation mechanism of planar defects in an annealed SiGe/Si heterostructure was investigated by transmission electron microscopy. Due to the interdiffusion of Si and Ge, interface migration phenomena were observed in annealed heterostructures. Because of the strain gradient in the migrated region between the original interface and the migrated interface, the glide of misfit dislocation was observed in the region and planar defects were produced by the interaction of the gliding misfit dislocations. The planar defects were confined to the migrated region, and dislocation pileup by strain gradient was the origin of the confinement of the planar defect.

• Journal of the Korean Society of Safety
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• v.17 no.4
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• pp.52-60
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• 2002

Failure criterion is a parameter to represent the resistance to failure of locally wall thinned pipe, and it depends on material characteristics, defect geometry, applied loading type, and failure mode. Therefore, accurate prediction of integrity of wall thinned pipe requires a failure criterion adequately reflected the characteristics of defect shape and loading in the piping system. In the present study, the finite element analysis was performed and the results were compared with those of pipe experiment to develop a sound criterion for failure of internally wall thinned pipe subjected to combined pressure and bending loads. By comparing the predictions of failure to actual failure load and displacement, an appropriate criterion was investigated. From this investigation, it is concluded that true ultimate stress criterion is the most accurate to predict failure of wall thinned pipe under combined loads, but it is not conservative under some conditions. Engineering ultimate stress estimates the failure load and displacement reasonably for al conditions, although the predictions are less accurate compared with the results predicted by true ultimate stress criterion.

• Design & Manufacturing
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• v.9 no.2
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• pp.1-5
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• 2015

Recently, as small-sized display products such as mobile phones and digital cameras have become lighter and smaller, the size of electric signal delivery part, connector for the mobile display products, also, needs to become smaller, so high-density integration like shortening the distance between signal delivery media, conductors is necessary. With the micro and high-density integration of the connector, it is necessary to maintain contact to a certain degree for keeping intensity and delivering electric signal smoothly to prevent a defect with a specific impact. Accordingly, this study carried out a structural analysis according to the operating mechanisms of 0.16CHP Class Bottom Contact FPC Connector and 0.24CHP Class BTB Connector mostly used in small-sized mobile display products such as mobile phones and digital cameras. As a result of the analysis, both connectors had lower than 997MPa, yield strength of connector material C5240-XSH, so it is judged that permanent plastic deformation would not occur, and that a contact force between the connector and FPC film occurs to a certain degree, so that there would not be any defect in electric signal delivery.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.1
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• pp.109-115
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• 2004

The spatter and porosity could be occurred during$CO_2$CW laser welding of Primer- coated steel for shipbuilding. This study has suggested an alternative idea by examining of weld-defect formation mechanism. The primer-coated plate induced the spatter humping bead and porosity and these are main part of the welding defect. attributed to the powerful vaporizing pressure of primer attached on the base metal The zinc of Primer has a boiling point that is the lower temperature than melting point of steel zinc vapor will build up at the interface between the two sheets and this tends to deteriorate the quality of the weld by ejecting weld material from lap position or leaving porosity. Therefore introducing a small gap clearance in the lap position. the zinc vapor could escape through it and sound weld beads can be acquired. In conclusion, we suggested the occurred and prevented mechanism of weld defects with searching the factor.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2005.11a
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• pp.267-270
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• 2005

Finite element model of pressurized water reactor internals were obtained using ANSYS software package to analyze dynamic characteristics. The pressure vessel, hold-down ring, alinement key, core support barrel(CSB), upper guide structure(UGS) and fluid gap were fully modeled using structural solid element(SOLID45) and fluid element(FLUID80) which is one of element types. Also modal analysis using the above finite element model has been performed. As a result, it was found that the fundamental beam mode natural frequency of the CSB were 8.2 Hz, the shell mode one 14.5 Hz. To verify the Finite Element Analysis(FEA), we compare the analysis result with experimental data that is obtained from the plant IVMS(internal Vibration Monitoring System). The experimental results are good agreement with the FEA model.

• Journal of The Korean Society of Agricultural Engineers
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• v.63 no.5
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• pp.27-38
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• 2021

The physical condition assessment criteria of fill dam safety inspection are now weakly regulated and inappropriate for small agricultural reservoirs since these criteria have fundamental backgrounds suitable for large-scale dams. This study proposes the degree (critical values) of defects for the quantitative condition assessment of the embankment in order to prepare the condition assessment criteria for a small reservoir with a storage capacity of less than one (1) million cubic meters. The critical values of defects were calculated by applying the method that considers the size ratios based on the dimensional data of reservoirs, and the method of statistical analysis on the measured values of the defect degree which extracted from comprehensive annual reports on reservoir safety inspection. In comparison with the current criteria, the newly proposed critical values for each condition assessment item of the reservoir embankment are presented in paragraphs 4 and 6 of the conclusion. In addition, this study presents a method of displaying geometric figures to clarify the rating classification for condition assessment items with the two defect indicators.

• Maxillofacial Plastic and Reconstructive Surgery
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• v.42
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• pp.18.1-18.9
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• 2020

Background: Bone grafting has been considered the gold standard for hard tissue reconstructive surgery and is widely used for large mandibular defect reconstruction. However, the midface encompasses delicate structures that are surrounded by a complex bone architecture, which makes bone grafting using traditional methods very challenging. Three-dimensional (3D) bioprinting is a developing technology that is derived from the evolution of additive manufacturing. It enables precise development of a scaffold from different available biomaterials that mimic the shape, size, and dimension of a defect without relying only on the surgeon's skills and capabilities, and subsequently, may enhance surgical outcomes and, in turn, patient satisfaction and quality of life. Review: This review summarizes different biomaterial classes that can be used in 3D bioprinters as bioinks to fabricate bone scaffolds, including polymers, bioceramics, and composites. It also describes the advantages and limitations of the three currently used 3D bioprinting technologies: inkjet bioprinting, micro-extrusion, and laserassisted bioprinting. Conclusions: Although 3D bioprinting technology is still in its infancy and requires further development and optimization both in biomaterials and techniques, it offers great promise and potential for facial reconstruction with improved outcome.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.4
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• pp.307-312
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• 2019

Transient earth voltage (TEV) signals propagate on metal surfaces when partial discharge (PD) occurs due to the deterioration of insulation performance in the operation of gas-insulated switchgears (GIS). A TEV sensor has advantages of high sensitivity and convenient installation for detecting PD defects. However, the TEV sensor depends on imports in domestic and detailed studies have not been conducted. In this study, a sensor was designed and fabricated by the TEV principle and its response characteristics were evaluated for detecting PD defects, which were simulated as protrusion on conductor (POC), protrusion on enclosure (POE), and free moving particle (FMP) defects. Finally, the PD-induced TEV signals were measured and phase-resolved partial discharge (PRPD) patterns were analyzed to identify the type of defect.

• Annual Conference of KIPS
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• 2010.04a
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• pp.369-372
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• 2010

평판 디스플레이(flat panel display)의 크기가 커짐에 따라 다양한 기판을 이용한 제조 방법이 개발되고 있다. 디스플레이 제조 공정 중 기판의 결함을 찾아서 분류하는 검사 시스템은 최종 제품의 품질을 결정하는 매우 중요한 부분이다. 본 연구는 머신비전 기술을 이용하여 불투명하고 반사율이 높은 기판 표면의 결함을 찾아내고, 이 결함을 스크래치(scratch), 흑결함(dark defect), 백결함(white defect)으로 분류하는 장치를 구현하는데 목적이 있다. 이를 구현하기 위해 본 논문에서는 정밀 스테이지(stage)와 라인 카메라(line CCD camera)을 이용한 광학계를 활용하여 검사 시스템을 구현하였다. 구축된 시스템을 이용하여 취득한 이미지를 12 개의 영역으로 등분하여 각각의 국부 영역에 대한 문턱값 연산(thresholding)을 적용함으로써 조명의 불균일을 의한 검출 에러율을 획기적으로 낮추었다. 간단한 컴퓨터비전 알고리듬의 채용으로도 검사 시스템의 구현이 가능함을 보였다.