Structural Analysis of High-Density Mobile Micro-Connector

초소형 고집적 모바일 커넥터부품 구조해석

  • Jeon, Yong-Jun (Mold&Dies Technology R&D Group, Korea Institute of Industrial Technology) ;
  • Shin, Kwang-Ho (Mold&Dies Technology R&D Group, Korea Institute of Industrial Technology) ;
  • Heo, Young-Moo (Mold&Dies Technology R&D Group, Korea Institute of Industrial Technology)
  • 전용준 (한국생산기술연구원 금형기술실용화연구그룹) ;
  • 신광호 (한국생산기술연구원 금형기술실용화연구그룹) ;
  • 허영무 (한국생산기술연구원 금형기술실용화연구그룹)
  • Accepted : 2015.05.28
  • Published : 2015.06.12

Abstract

Recently, as small-sized display products such as mobile phones and digital cameras have become lighter and smaller, the size of electric signal delivery part, connector for the mobile display products, also, needs to become smaller, so high-density integration like shortening the distance between signal delivery media, conductors is necessary. With the micro and high-density integration of the connector, it is necessary to maintain contact to a certain degree for keeping intensity and delivering electric signal smoothly to prevent a defect with a specific impact. Accordingly, this study carried out a structural analysis according to the operating mechanisms of 0.16CHP Class Bottom Contact FPC Connector and 0.24CHP Class BTB Connector mostly used in small-sized mobile display products such as mobile phones and digital cameras. As a result of the analysis, both connectors had lower than 997MPa, yield strength of connector material C5240-XSH, so it is judged that permanent plastic deformation would not occur, and that a contact force between the connector and FPC film occurs to a certain degree, so that there would not be any defect in electric signal delivery.

Keywords

References

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