• 한국레이저가공학회지
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• 제8권2호
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• pp.21-32
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• 2005

The excimer laser ablation of a polymer occurs by the excitation of chemical bonds to energy levels that are above the dissociation energy. In this process, however, fragmented debris is finally ejected explosively by the scission of bonds and accumulates on the material surface. In the present work, a process for eliminating surface debris contamination generated by the laser ablation of a polymer is developed. The proposed approach for removing surface debris utilizes an erasable ink pasted on a polymide. The ink pasted polyimide is ablated by KrF excimer laser. The surface debris ejected from the polyimide is then combined with the ink layer on the polymer. Finally, both the surface debris and the ink layer are removed using adhesive tape or alcohol solvent. The results suggest that the erasable ink method is a simple, low cost, and extremely effective debris eliminating process.

• 한국생산제조학회지
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• 제25권6호
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• pp.421-425
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• 2016

Micro-EDM is one of the recent fine-machining technologies. Micro-EDM is widely used in precision processes because products manufactured via EDM are free from workpiece hardness. However, the debris produced during the process cause many problems such as reduced precision of the process. The first solution of this problem involves using the milling hole process. Micro-EDM hole process involves an electrode moving rapidly in the vertical direction via a servo system to disperse debris. However, this process can cause reduced work efficiency owing to contact between the electrode and workpiece. In this study, ultrasonic vibration is added to micro-EDM channel machining. Ultrasonic vibration removes the debris during machining and enables precision machining. Consequently, a clean work environment for the subsequent processes is maintained.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 추계학술발표대회 논문집
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• pp.128-132
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• 2006

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355nm and 80MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow rate, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repetition rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20{\mu}m$ and $10{\mu}m$ at more than 500mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed of laser material process.

• 반도체디스플레이기술학회지
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• 제6권1호
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• pp.11-15
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• 2007

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355 nm and 80 MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using a laser with UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repletion rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20\;{\mu}m$ and $10\;{\mu}m$ at more than 500 mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed in laser material process.

• 천문학회보
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• 제46권2호
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• pp.56.3-56.3
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• 2021

In a ΛCDM universe, most galaxies are believed to evolve by mergers and accretions. The debris resulting from such processes remains faint and/or diffuse structures, such as tidal streams and stellar halos. Although these structures are a good indicator of the recent mass assembly history of galaxies, they have the disadvantage of being difficult to observe due to their low surface brightness (LSB). To recover these LSB features by reducing the photometric uncertainties introduced by the optics system, we attempt to develop an optimized telescope, called a linear astigmatism free-three mirror system, that minimizes the loss and scattering of light within the telescope. With that prototype, we observe NGC 5907, known as a nearby galaxy with a fabulous loop structure(s), to inspect its performance. After a dedicated data reduction process, including flat-fielding with dark sky flat and sky subtraction, our observation reaches a 1σ surface brightness limit of μlim,r ≃ 28.3 mag arcsec-2 in 10×10 arcsec boxes. We finally identify a single tidal stream that is likely the remnant of a nearly disrupted galaxy. This finding emphasizes that the capability of LSB detection with our telescope is comparable to that of much larger telescopes.

• International Journal of Precision Engineering and Manufacturing
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• 제9권4호
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• pp.3-10
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• 2008

Micro-electrical discharge machining (micro-EDM) is an effective method for machining all types of conductive materials regardless of hardness. Since micro-EDM is an electro-thermal process, the energy supplied by the pulse generator is an important factor in determining the effectiveness of the process. In this study, an investigation was conducted on the micro-EDM of tungsten carbide (WC) to compare the performance of transistor and resistance/capacitance (RC) pulse generators in obtaining the best quality micro-hole. The performance was measured by the machining time, material removal rate, relative tool wear ratio, surface quality, and dimensional accuracy. The RC generator was more suited for minimizing the pulse energy, which is a requirement for fabricating micro-parts. The smaller-sized debris formed by the low-discharge energy of RC micro-EDM could be easily flushed away from the machined zone, resulting in a surface free of burrs and resolidified molten metal. The RC generator also required much less time to obtain the same quality micro-hole in WC. Therefore, RC generators are better suited for fabricating micro-structures, producing good surface quality and better dimensional accuracy than the transistor generators, despite their higher relative tool wear ratio.

• 한국해양환경ㆍ에너지학회지
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• 제4권3호
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• pp.74-80
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• 2001

최근 연안 해역에서의 대규모 어업 활동과 경제개발로 인한 전반적인 산업화 현장의 확대, 그리고 생활 수준의 향상에 따른 여가 활동의 증가 등 다양한 요인에 의해 해저면의 침적폐기물, 폐각류, 오염 퇴적물 등 각종 오염 물질의 배출이 해양 자체의 정화 능력을 넘어서는 심각한 상태에 처해 있는 실정이다 이러한 해저면 폐기물을 그대로 방치해 두게 되면 시간이 경과함에 따라 저서 생태계의 교란을 초래하게 된다. 따라서, 해저면 폐기물에 의한 해양 생태계의 교란을 예방하고, 오염된 해양 환경을 복원하기 위해서는 해저면에 대한 수중침적 폐기물 실태조사를 실시하여 오염실태를 파악하고, 이들 관련자료를 체계적으로 관리 운영함으로서 효율적인 폐기물 수거 방안의 수립을 지원할 수 있는 체계를 갖추어야 한다. 이의 일환으로 본 연구에서는 항 내 수중침적 폐기물의 실태를 파악하기 위한 조사 방법을 확립하고, 이를 토대로 국내 연안의 주요 항만 및 어항에 대한 항 내 수중침적 폐기물 분포 현황을 조사하였다.

• 한국분말재료학회지
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• 제7권1호
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• pp.12-18
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• 2000

Effects of the microstrucrure of rapidy solidified Al-Pb-Cu-Mg alloys on the wear investigated. In order to overcome the miscility gap between Al and pb under equilibrium conditions, both in the solid and the liquid states, the alloy were rapidy solidifies to produce them in a segregation-free condition. Although the Pb particles showed relatively fine dispersion in the Al matrix in all the alloys by this process. the Al-16Pb alloy was found to have the most favorable microstructure with discretre with discrete Pb particles of abount 0.5 ${\mu}$m in size. With the addition of Cu and Cu-Mg to Al-16Pb, cellular structures were newly formed; not seen in the binary Al-Pb alloy. Wear properties of the Al-Pb binary alloys measured as a function of the sliding speen, sliding distance, and applied load showed that the Al-16Pb alloy has the best wear resistance, as expected from the fine microstructural features in this alloy. The were resistance of the alloy containing Cu-and Cu-Mg was higher than that of the Al-16Pvb alloy, due to matrix strengthening by precipitation hardeing. The wear mechanism was identified by examining the traces and wear debris.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.430-430
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• 2007

In general, polyimides (PIs) are used in liquid crystal displays (LCDs) as alignment layer of liquid crystals (LCs). Up to date, the rubbing alignment technique has been widely used to align liquid crystals on the PI surface, which is suitable for mass-production of LCDs because of its simple process and high productivity. However, this method has some disadvantages. Rubbed PI surfaces include the debris left by the cloth and the generation of electrostatic charges during rubbing process. Therefore, rubbing-free techniques for LC alignment are strongly required in LCD technology. In this experiment, PI was uniformly coated on indium-tin-oxide electrode substrates to form LC alignment layers using a spin-coating method and the PI layers were subsequently imidized at 433 K for 1 h. The thickness of the PI layer was set at 50 nm. The LC alignment layer surfaces were exposed to an $Ar^+$ ion-beam under various ion-beam energies. The antiparallel cells and twisted-nematic (TN) cells for the measurement of pretile angle and electro-optical characteristics were fabricated with the cell gap of 60 and $5\;{\mu}m$, respectively. The LC cells were filled with nematic LC (NLC, MJ001929, Merck) and were assembled. The NLC alignment capability on ion-beam-treated PI was observed using photomicroscope and the pretilt angle of the NLC was measured by the crystal-rotation method at room temperature. Voltage-transmittance (V-T) and response time characteristics of the ion-beam irradiated TN cell were measured by a LCD evaluation system.

• KSBB Journal
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• 제15권4호
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• pp.366-369
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• 2000

택서스속 식물세포인 Taxus chinensis 배양에서 식물세포, 세포조각 및 여액에 있는paclitaxel 의 분포는 paclitaxel 생 산량에 의존하였다. 즉, 여액에 녹을 수 있는 paclitaxel에 힌계가 있기 때문에 발효조에서의 생산량이 적을 경우 여 액 에 녹아 있는 paclitaxel양은 상대 적 으로 증가하여 수율 증가 측면에서 이를 반드시 회수하여야 한다. 여러가지 종 류의 흡착제 중에서 HP20 (stylene, high porous polymer)의 경우 흡착 및 탈착 효율이 좋고 가격도 저렴하여 가장 경 제적인 흡착제 임을 알 수 있었다. 식물세포와 세포조각이 포함되어 있는 배양액의 경우 흡착효율이 상당히 떨어져 10 g/l흡착제로 3일 동안 반응시켜도 여액내 paclitaxel은 여 전히 잔존함을 알 수 있었다 데칸터 여 액, 식불세포만 제 거된 배양액의 경우에는 흡착효율이 향상되어 5 g/l흡착제 처리로 1일 정도면 배양액내 paclitaxel이 완전히 흡착됨을 말 수 있었다. 또한 고속원심분리기 여액, 식물세포와 세 포조각이 제거된 여액의 경우 3 g/l흡착제 처리로 1일 정 도면 여 액내 paclitaxel이 완전히 흡착되 어 여 액내 paclitaxel 을 완전히 회수할 수 있었다. 이상의 결과로부터 여액에 녹아 있는 paclitaxel 회수를 위하여 식물세포와 세포조각을 미리 제거한 여액, 즉 고체 함량을 줄인 여액이 더욱 효과 적임을 알 수 있었다.