• Title/Summary/Keyword: chip thickness

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Detection of QTL for Carcass Quality on Chromosome 6 by Exploiting Linkage and Linkage Disequilibrium in Hanwoo

  • Lee, J.H.;Li, Y.;Kim, J.J.
    • Asian-Australasian Journal of Animal Sciences
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    • v.25 no.1
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    • pp.17-21
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    • 2012
  • The purpose of this study was to improve mapping power and resolution for the QTL influencing carcass quality in Hanwoo, which was previously detected on the bovine chromosome (BTA) 6. A sample of 427 steers were chosen, which were the progeny from 45 Korean proven sires in the Hanwoo Improvement Center, Seosan, Korea. The samples were genotyped with the set of 2,535 SNPs on BTA6 that were imbedded in the Illumina bovine 50 k chip. A linkage disequilibrium variance component mapping (LDVCM) method, which exploited both linkage between sires and their steers and population-wide linkage disequilibrium, was applied to detect QTL for four carcass quality traits. Fifteen QTL were detected at 0.1% comparison-wise level, for which five, three, five, and two QTL were associated with carcass weight (CWT), backfat thickness (BFT), longissimus dorsi muscle area (LMA), and marbling score (Marb), respectively. The number of QTL was greater compared with our previous results, in which twelve QTL for carcass quality were detected on the BTA6 in the same population by applying other linkage disequilibrium mapping approaches. One QTL for LMA was detected on the distal region (110,285,672 to 110,633,096 bp) with the most significant evidence for linkage (p< $10^{-5}$). Another QTL that was detected on the proximal region (33,596,515 to 33,897,434 bp) was pleiotrophic, i.e. influencing CWT, BFT, and LMA. Our results suggest that the LDVCM is a good alternative method for QTL fine-mapping in detection and characterization of QTL.

In situ Microfluidic Method for the Generation of Uniform PEG Microfiber (PEG 마이크로 섬유 제조를 위한 마이크로플루이딕 제조방법)

  • Choi, Chang-Hyung;Jung, Jae-Hoon;Lee, Chang-Soo
    • Korean Chemical Engineering Research
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    • v.48 no.4
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    • pp.470-474
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    • 2010
  • In this study, we presents a simple microfluidic approach for generating uniform Poly(ethylene glycol)(PEG) microfiber. Elongated flow pattern of monomer induced by sheath flow of immiscible oil as continuous phase is generated in Y-shape junction and in situ polymerization by UV exposure. For uniform microfiber, we investigate the optimized flow condition and draw phase diagram as function of Ca and Qd. At the region for stable elongated flow pattern, the microfiber generated in microfluidic chip is very uniform and highly reproducible. Importantly, the thickness of microfibers can be easily controlled by flow rate of continuous and disperse phase. We also demonstrate the feasibility for biological application as encapsulating FITC-BSA in PEG microfiber.

Formation and Properties of Electroplating Copper Pillar Tin Bump on Semiconductor Process (반도체공정에서 구리기둥주석범프의 전해도금 형성과 특성)

  • Wang, Li;Jung, One-Chul;Cho, Il-Hwan;Hong, Sang-Jeen;Hwang, Jae-Ryong;Soh, Dea-Wha
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2010.10a
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    • pp.726-729
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    • 2010
  • Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N thermo-compression process. Through the simulation work, it was proved that when the CPTB decreased in its size, it was largely affected by the copper oxidation.

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The Vibration Measurement of Boring Process by Using the Optical Fiber Sensor at inside of Boring Bar (광섬유 센서의 보링 바 삽입에 의한 진동측정)

  • Song, Doo-Sang;Hong, Jun-Hee;Guo, Yang-Yang
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.6
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    • pp.709-715
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    • 2011
  • Chattering in cutting operations are usually a cumbersome part of the manufacturing process in mechanical. Particular, machining performance such as that of the boring process is limited by cutting condition at the movable components. Among various sources of chatter vibration, detrimental point in cutting condition is found a mechanical condition on overhang. It limits cutting speed, depth, surface roughness and tool wear failure as result because the all properties are varying with the metal removal process. In this case, we have to observe the resonance frequencies of a boring bar for continuous cutting. In the established research, boring bar vibration of cutting system has been measured with the aid of accelerometer. However, the inherent parameters of internal turning operations are severely limit for the real time monitoring on accelerometers. At this point, this paper is proposed other method for real time monitoring during continuous cutting with optical fiber at the inside of boring bar. This method has been used a plastic fiber in the special jig on boring bar by based on experimental modal analysis. In this study, improvement of monitoring system on continuous internal cutting was attempted using optical fiber sensor of inside type because usually chattering is investigated experimentally measuring the variation in chip thickness. It is demonstrated that the optical fiber sensor is possibility to measure of chattering with real time in boring process.

Imaging of self-assembled monolayers by surface plasmon microscope (표면 플라즈몬 현미경을 이용한 자기조립 단분자막의 이미징)

  • 표현봉;신용범;윤현철;양해식;김윤태
    • Korean Journal of Optics and Photonics
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    • v.14 no.1
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    • pp.97-102
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    • 2003
  • Multi-channel images of 11-MUA(11-Mercaptoundecanoic acid) and 11-MUOH(11-Mercaptoundecanol) self-assembled monolayers were obtained by using two-dimensional surface plasmon resonance (SPR) absorption. The patterning process was simplified by exploiting direct photo-oxidation of thiol bonding (photolysis) instead of conventional photolithography. Sharper images were resolved by using a white light source in combination with a narrow bandpass filter in the visible region, minimizing the diffraction patterns on the images. The line profile calibration of the image contrast caused by different resonance conditions at each point on the sensor surface (at a fixed incident angle) enables us to discriminate the monolayer thickness in nanometer scale. Furthermore, there is no signal degradation such as photo bleaching or quenching, which are common in the detection methods based on fluorescence.

Formation of high uniformity solder bump for wafer level package by tilted electrode ring (경사진 전극링에 의한 웨이퍼레벨패키지용 고균일도의 솔더범프 형성)

  • Ju, Chul-Won;Lee, Kyung-Ho;Min, Byoung-Gue;Kim, Seong-Il;Lee, Jong-Min;Kang, Young-Il;Han, Byung-Sung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.366-369
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    • 2003
  • The vertical fountain plating system with the point contact has been used in semiconductor industry. But the plating shape in the opening of photoresist becomes gradated shape, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. So, we designed the tilted electrode ring contact to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha$-step. A photoresist was coated to a thickness of $60{\mu}m$ and vias were patterned by a contact aligner After via opening, solder layer was electroplated using the fountain plating system and the tilted electrode ring contact system. In $\alpha$-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were ${\pm}16%,\;{\pm}3.7%$ respectively. In this study, we could get high uniformity bumps by the tilted electrode ring contact system. So, tilted electrode ring contact system is expected to improve workability and yield in module process.

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Electric Fuel Sender Apparatus for the Vehicles Using CPW Transmission Line (CPW 전송선을 이용한 전자식 자동차용 연료 센더 장치)

  • Son Tae-Ho
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.4 s.107
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    • pp.380-386
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    • 2006
  • Electric fuel sender fur the vehicle fuel gauge system was designed and fabricated based on the CPW(Co-Planer Waveguide) transmission line theory. It is applied on this system that characteristic impedance of RF transmission line can be varied by the surrounded material of the line. By the characteristic impedance owing the level of gasoline or diesel fuel in vehicle fuel tank, CPW line has corresponding reflected signal as much as changed impedance. Detected signal is amplified, and delivered to fuel indicator into cluster unit on dash board. Conventional floating mechanical buoy level gauge has several defects as low reliability and high break down rate by mechanical operation, and has not good linearity for the fuel level difference. CPW line with electric circuits are constructed on 1.6 mm thickness epoxy substrate, and measurement shows that this system has more accurate level and better linearity than conventional mechanical system. New electric fuel sender which has good productivity with long lifetime and low-in-cost by the SMT chip assembling could be replaced this system with conventional floating buoy system.

Thermal Characteristics of the design on Residential 13.5W COB LED Down Light Heat Sink (주거용 13.5W COB LED 다운라이트 방열판 설계에 따른 열적 특성 분석)

  • Kwon, Jae-hyun;Lee, Jun-myung;Kim, Hyo-jun;Kang, Eun-young;Park, Keon-jun
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.7 no.1
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    • pp.20-25
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    • 2014
  • There are several severe problems for LED device, the next generation's economy green lighting: as the temperature increases, the lamp efficiency decreases; if the temperature is over $80^{\circ}C$, the lifetime of lighting decreases; Red Shift phenomenon that wavelength of spectrum line moves toward long wavelength occurs; and optical power decreases as $T_j$ increases. Thus, Heat sink design that can minimize the heat of LED device is currently in progress. While the thermal resistance of COB Type LED was reduced by direct coupling of LED chip to the board, residential 13.5W requires Heat sink in order resolve heat issue. This study designed Heat Sink suitable for residential 13.5W COB LED down-light and selected the optimum Fin thickness through flow simulation that packaged the designed Heat Sink and 13.5W COB. And finally it analyzed and evaluated the thermal modes using contacting thermometer.

Fabrication of a Pressure Difference Type Gas Flow Sensor using ICP-RIE Technology (ICP-RIE 기술을 이용한 차압형 가스유량센서 제작)

  • Lee, Young-Tae;Ahn, Kang-Ho;Kwon, Yong-Taek;Takao, Hidekuni;Ishida, Makoto
    • Journal of the Semiconductor & Display Technology
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    • v.7 no.1
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    • pp.1-5
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    • 2008
  • In this paper, we fabricated pressure difference type gas flow sensor using only dry etching technology by ICP-RIE(inductive coupled plasma reactive ion etching). The sensor's structure consists of a common shear stress type piezoresistive pressure sensor with an orifice fabricated in the middle of the sensor diaphragm. Generally, structure like diaphragm is fabricated by wet etching technology using TMAH, but we fabricated diaphragm by only dry etching using ICP-RIE. To equalize the thickness of diaphragm we applied insulator($SiO_2$) layer of SOI(Si/$SiO_2$/Si-sub) wafer as delay layer of dry etching. Size of fabricated diaphragm is $1000{\times}1000{\times}7\;{\mu}m^3$ and overall chip $3000{\times}3000{\times}7\;{\mu}m^3$. We measured the variation of output voltage toward the change of gas pressure to analyze characteristics of the fabricated sensor. Sensitivity of fabricated sensor was relatively high as about 1.5mV/V kPa at 1kPa full-scale. Nonlinearity was below 0.5%F.S. Over-pressure range of the fabricated sensor is 100kPa or more.

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A fiber optic surface plasmon resonance (SPR) sensorusing cyclic olefin copolymer (COC) polymer prism (Cyclic olefin copolymer (COC) 폴리머 프리즘을 사용한 광섬유 기반 표면 플라즈몬 공명 (SPR) 바이오 센서)

  • Yun, Sung-Sik;Lee, Soo-Hyun;Ahn, Chong-H.;Lee, Jong-Hyun
    • Journal of Sensor Science and Technology
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    • v.17 no.5
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    • pp.369-374
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    • 2008
  • A novel fiber optic surface plasmon resonance (SPR) sensor using cyclic olefin copolymer (COC) prism with the spectral modulation is presented. The SPR sensor chip is fabricated using the SU-8 photolithography, Ni-electroplating and COC injection molding process. The sidewall of the COC prism is partially deposited with Au/Cr (45/2.nm thickness) by e-beam evaporator, and the thermal bonding process is conducted for micro fluidic channels and optical fibers alignment. The SPR spectrum for a phosphate buffered saline (0.1.M PBS, pH.7.2) solution shows a distinctive dip at 1300.nm wavelength, which shifts toward longer wavelength with respect to the bovine serum albumin (BSA)concentrations. The sensitivity of the wavelength shift is $1.16\;nm{\cdot}{\mu}g^{-1}{\cdot}{\mu}l^{-1}$. From the wavelength of SPR dips, the refractive indices (RI) of the BSA solutions can be theoretically calculated using Kretchmann configuration, and the change rate of the RI was found to be $2.3{\times}10^{-5}RI{\cdot}{\mu}g^{-1}{\cdot}l^{-1}$. The realized fiber optic SPR sensor with a COC prism has clearly shown the feasibility of a new disposable, low cost and miniaturized SPR biosensor for biochemical molecular analyses.