• 한국표면공학회지
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• 제28권2호
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• pp.67-76
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• 1995

The microstructure of 95wt.%Pb/5wt.%Sn and 63wt.%Sn/37wt.%Pb solders for flip chip bonding process has been characterized. Solders were deposited by thermal evaporation and reflowed in the conventional furnace or by rapid thermal annealing(RTA) process. As-deposited films show columnar structure. The microstructure of furnace cooled 63Sn/37Pb solder shows typical lamellar form, but that of RTA treated solder has the structure showing an uniform dispersion of Pb-rich phase in Sn matrix. The grain size of 95Pb/5Sn solder reflowed in the furnace is about $5\mu\textrm{m}$, but the grain size of RTA treated solder is too small to be observed. The microstructure in 63Sn/37Pb solder bump shows the segregation of Pb phase in the Sn rich matrix regardless of reflowing method. The 63Sn/37Pb solder bump formed by RTA process shows more uniform microstructure. These result are related to the heat dissipation in the solder bump.

• 한국전자파학회:학술대회논문집
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• 한국전자파학회 2005년도 종합학술발표회 논문집 Vol.15 No.1
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• pp.137-140
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• 2005

A frequency synthesizer of 10 GHz $\sim$ 11 GHz for FMCW radar is designed and implemented by the form of indirect frequency synthesizer of a single loop structure. The synthesizer uses a high speed digital PLL chip. It is difficult to divide directly by using a program counter of PLL chip because the output frequency of VCO is 10 GHz $\sim$ 11 GHz, so we lower the frequency to 625 MHz $\sim$ 687.5 MHz by using a prescaler, and then divide the frequency by the program counter. The output frequency sweep of VCO from 10 GHz to 11 GHz is measured.

• 한국정밀공학회지
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• 제21권4호
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• pp.202-209
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• 2004

Quality control is essential to the final product in BGA-type PCB fabrication. So, many automatic vision systems have been developed to achieve speedy, low cost and high quality inspection. A multiple threshold selection algorithm is a very important technique for machine vision based inspection. In this paper, an inspected image is modeled by using fuzzy sets and then the parameters of specified membership functions are estimated to be in maximum fuzzy entropy with the probability of the fuzzy sets, using the exhausted search method. Fuzzy c-partitions with the estimated parameters are automatically generated, and then multiple thresholds are selected as the crossover points of the fuzzy sets that form the estimated fuzzy partitions. Several experiments related to flip chip BGA images show that the proposed algorithm outperforms previous ones using both entropy and variance, and also can be successfully applied to AVI systems.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2002년도 ICCAS
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• pp.36.4-36
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• 2002

$\textbullet$ A FPGA-based One-chip position controller with the PCI interface was developed. $\textbullet$ The peripherals of the existent controller can be implemented in one FPGA device. $\textbullet$ For this purpose, the high capacity FPGA device was used. $\textbullet$ PCI controller was merged into the position controller by using the PCI controller of core form. $\textbullet$ The developed position controller used only one FPGA device to achieve the required function. $\textbullet$ By doing this, the overall system can be simplified. $\textbullet$ The noise and power dissipation problems can be minimized and it has the advantage in the price.

• 한국마린엔지니어링학회:학술대회논문집
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• 한국마린엔지니어링학회 2005년도 후기학술대회논문집
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• pp.208-209
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• 2005

A frequency synthesizer of 10 GHz ${\sim}$ 11 GHz for FMCW radar is designed and implemented by the form of indirect frequency synthesizer of a single loop structure. The synthesizer uses a high speed digital PLL chip. It is difficult to divide directly by using a program counter of PLL chip because the output frequency of VCO is 10 GHz ${\sim}$ 11 GHz, so we lower the frequency to 625 MHz ${\sim}$ 687.5 MHz by using a prescaler, and then divide the frequency by the program counter. The output frequency sweep of VCO from 10 GHz to 11 GHz is measured.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권1호
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• pp.1-6
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• 2002

A new closed-form expressions to calculate frequency-dependent distributed inductance and the associated distributed series resistance of single interconnect on a lossy silicon substrate (CMOS technology) are presented. The proposed analytic model for series impedance is based on a self-consistent field method and the vector magnetic potential equation. It is shown that the calculated frequency-dependent distributed inductance and the associated resistance are in good agreement with the results obtained from rigorous full wave solutions and CAD-oriented equivalent-circuit modeling approach.

• JSTS:Journal of Semiconductor Technology and Science
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• 제5권4호
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• pp.249-254
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• 2005

This paper presents a system-on-a-chip (SOC) design for digital TV. The single LSI incorporates almost all essential parts such as CPU, ISO/IEC 11172/13818 system/audio/video decoders, a video post-processor, a graphics/OSD processor and a display processor. It has analog IP's inside such as video DACs, an audio PLL, and a system PLL to reduce the system-level implementation cost. Descramblers and Smart Card interface are included to support widely used conditional access systems. The video decoder can decode two video streams simultaneously. The DSP-based audio decoder can process various audio coding specifications. The functional blocks for video quality enhancement also form outstanding features of this SoC. The SoC supports world-wide major DTV services including ATSC, ARIB, DVB, and DIRECTV.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.23-34
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• 2013

Over the past several decades in the microelectronics industry, devices have gotten smaller, thinner, and lighter, without any accompanying degradation in quality, performance, and reliability. One permanent and deniable trend in packaging as well as wafer fabrication industry is system integration. The proliferating options for system integration, recently, are driving change across the overall semiconductor industry, requiring more investment in developing, ramping and supporting new die-, wafer- and board-level solution. The trend toward 3D system integration and miniaturization in a small form factor has accelerated even more with the introduction of smartphones and tablets. In this paper, the key issues and state of the art for system integration in the packaging process are introduced, especially, focusing on ease transition to next generation packaging technologies like through silicon via (TSV), 3D wafer-level fan-out (WLFO), and chip-on-chip interconnection. In addition, effective solutions like fine pitch copper pillar and MEMS packaing of both advanced and legacy products are described with several examples.

• Journal of Welding and Joining
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• 제22권3호
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• pp.62-68
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• 2004

The strip Au bumps are bonded using longitudinal ultrasonic far the electronic package. Au bumps on the chip and substrate are aligned in a crossed shape, and the ultrasonic is imposed on the chip to form the solid-state bond between the Au bumps. Deformed bump shapes are calculated using the finite element method, and the bond strength is measured experimentally. The crossed strip Au bumps are deformed similar to the saddle, which provides larger contact surface area and higher friction force. Compared with the previous bonding method between the Au bump and planar pad, higher bond strength is obtained using the crossed strip bumps.