• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.5
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• pp.150-156
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• 2017

This study tests the characteristics of heat radiation by applying the pin-height variables to 30-W LED floodlights. The angle of the heat sink enables us to identify the characteristics of the heat radiation based on the temperature distribution. The results of the study are as follows. When the heat sinks are set towards the ground, the heat transfer decreases in speed only to expands the temperature distribution, which adversely affects the characteristics of heat radiation and expands the temperature distribution of PCB with the LED chip. We verify that the characteristics of heat radiation are adversely affected when the height of the cooling pin decreases and the heat radiation area decreases, which impedes the heat transfer and increases the temperature distribution on the heat sink.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.7 no.1
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• pp.20-25
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• 2014

There are several severe problems for LED device, the next generation's economy green lighting: as the temperature increases, the lamp efficiency decreases; if the temperature is over $80^{\circ}C$, the lifetime of lighting decreases; Red Shift phenomenon that wavelength of spectrum line moves toward long wavelength occurs; and optical power decreases as $T_j$ increases. Thus, Heat sink design that can minimize the heat of LED device is currently in progress. While the thermal resistance of COB Type LED was reduced by direct coupling of LED chip to the board, residential 13.5W requires Heat sink in order resolve heat issue. This study designed Heat Sink suitable for residential 13.5W COB LED down-light and selected the optimum Fin thickness through flow simulation that packaged the designed Heat Sink and 13.5W COB. And finally it analyzed and evaluated the thermal modes using contacting thermometer.

• Journal of the Korean Ceramic Society
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• v.41 no.8
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• pp.573-577
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• 2004

We have synthesized a Eu$^{2＋}$-activated Sr$_3$MgSi$_2$ $O_{8}$ blue phosphor and investigated an attempt to develop blue LEDs by combining it with a InGaN blue LED chip (Len=405 nm). The InGaN-based Sr$_3$MgSi$_2$ $O_{8}$：Eu LED Lamp shows two bands at 405 nm and 460 nm. The 405 nm emission band is due to a radiative recombination from a InGaN active layer. This 405 nm emission was used as an optical transition of the Sr$_3$MgSi$_2$ $O_{8}$：Eu phosphor. The 460 m emission band is ascribed to a radiative recombination of Eu$^{2＋}$ impurity ions in the Sr$_3$MgSi$_2$ $O_{8}$ host matrix. As a consequence of a preparation of W blue LED Lamp using the Sr$_3$MgSi$_2$ $O_{8}$：Eu blue phosphor, the highest luminescence efficiency was obtained at the ration of epoxy/blue phosphor(1/0,202). At this time, the CIE chromaticity was x=0.1417 and y=0.0683.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.10-14
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• 2019

In this study, we synthesized two $Y_3Al_5O_{12}:Ce^{3+}$ phosphors ($7{\mu}m$-sized and $2{\mu}m$-sized YAG) with different sizes by controlling particles sizes of starting materials of the phosphors for white LED. In the smaller one ($2{\mu}m$-sized YAG), its photoluminescence intensity in the reflective mode was 63 % that of the bigger one ($7{\mu}m$-sized YAG); the quantum efficiencies were 93 % and 70 % for the smaller and the bigger ones. Two kinds of white LED packages with the same color coordinates were fabricated with a blue package (chip size $53{\times}30$) and two phosphors. The luminous flux of the white LED package with the smaller YAG phosphor was 92 % of that with the bigger one, indicating that the quantum efficiency of phosphor dispersed inside LED package was higher than that of the pure powder. It was consistently confirmed by the optical simulation (LightTools 6.3). It is notable according to the optical simulation that the white LED with the smaller phosphor showed 24 % higher luminous efficiency. If the smaller one had the same quantum efficiency as the bigger one (~93 %). Therefore, it can be suggested that the higher luminous efficiency of white LED can be possible by reducing the particle size of the phosphor along with maintaining its similar quantum efficiency.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.15 no.2
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• pp.189-194
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• 2015

In this study, the heat radiation performance of COB LED according to the structure of thermoelectric device were compared. Thermoelectric device of the sheet copper structure and ceramic structure were used for bonding with the heating part of the COB LED. The temperature distribution in the bonding part of the thermoelectric device of COB LED was measured with a contact-type thermometer. The temperature variation of the thermoelectric device was measured by inputting the currents of 0.1A, 0.3A, 0.5A, and 0.7A. When 0.7A was applied, the temperature of the bonding part where there was a heat aggregation phenomenon of the COB LED was $59^{\circ}C$ for thermoelectric device of the sheet copper structure and $67^{\circ}C$ for the thermoelectric device of the ceramic structure. Therefore, the sheet copper thermoelectric device whose temperature was lower by $9^{\circ}C$ showed better heat radiation performance than those of the ceramic structure.

• Journal of the Korea Safety Management & Science
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• v.20 no.3
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• pp.21-26
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• 2018

This paper describes result of a study on safety against a fire of charging cable for mobile phone for vehicle. Combustion on the USB cable in the car was happened while driving. Gas coming from the burning USB cable could be a reason which can make a secondary car accident since the driver also can be embarrassed while driving. In order to prevent a secondary car accident connected on the road, to research a reason why USB cable can emit gas and be burned in charging. We did simulation test with abnormal fault condition for the electronic component on the board in the USB cable. So we get the result from abnormal fault condition simulation test, for instance, shorted test for output terminal of 8 pin switch, shorted test for chip resistor after thermal aging in the condition $25^{\circ}C$, 93 % RH during 48 hours. To analysis the result of all test, Combustion on the USB cable was not the 8 pin but other electrical component such as a chip resistor. Therefore we guess that the reason for USB cable combustion in charging in a car was not 8 pin and a LED but another defective component.

• Design & Manufacturing
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• v.15 no.4
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• pp.32-36
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• 2021

In this study, the cause of the decrease in transmittance of the outer lens among the causes of the decrease in the amount of light in the automobile headlamp was identified, and the improvement method was selected to determine the effect. The causes of defects that lower the transmittance of the outer lens are divided into a moisture problem and a haze problem. The moisture problem is caused by the temperature difference between the inside and the outside of the head lamp, and the haze problem occurs when the heat inside the head lamp evaporates the haze component contained in the plastic material and attaches it to the outer lens. In order to improve the haze problem that occurs in plastic raw materials, the structures of the bulb light source type headlamp and the LED chip light source type headlamp were analyzed. Among them, the housing material of the LED chip light source type headlamp, which is structurally prone to haze gas, was selected as the test target. In the mass-production injection process of the housing, the drying process was selected as a method to minimize haze gas without adding a separate production process. After extracting a sample every drying time at a constant drying temperature, the sample was put into a haze tester and the residual amount of haze gas was measured. As a result, it was confirmed that the residual amount of Haze gas in the material decreased as the drying time increased.

• Journal of information and communication convergence engineering
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• v.18 no.3
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• pp.201-206
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• 2020

This paper presents a new method for controlling the current of lighting LEDs without current sensors. This method can be used as backup against LED current sensor faults. LED lighting requires a circuit with a constant current in order to maintain the same brightness when the ambient temperature changes. Therefore, we propose a new current estimation method to provide backup in case of current sensor faults based on the calculation of the inductor current. In the fabricated circuit, the average current changes from 144.03 mA to 155.97 mA when the ambient temperature changes from 0℃ to 60℃. The application of this study can enable the fabrication of a driving IC for LEDs in the form of a single chip without sensing resistors. This is expected to reduce the complexity of the peripheral circuit and enable precise feedback control.

• Transactions of Materials Processing
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• v.24 no.2
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• pp.101-106
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• 2015

Recently, silicone is being used for LED chip lens due to its good thermal stability and optical transmittance. In order to predict residual stresses, which cause optical birefringence and mechanical warpage of silicone, a finite element analysis was conducted for the curing of silicone during molding. For the analysis of the curing process, a dynamic cure kinetics model was derived based on the results of a differential scanning calorimetry (DSC) testing and applied to the material properties for finite element analysis. Finite element simulation results showed that a step cure cycle reduced abrupt reaction heat and showed a decrease in the residual stresses.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.398-398
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• 2012

GaN 기반의 InGaN/GaN 다중양자우물(MQW) 구조의 발광다이오드는 다양한 파장대의 가시광을 방출하는 소자로 교통 신호등, 디스플레이, LCD backlight, 일반 조명까지 넓게 응용되고 있다. 그러나, 이러한 응용을 위해서는 전류 주입 효율, 내부양자효율, 광추출 효율을 개선하는 연구를 통한 발광 다이오드의 광효율을 높이는 연구가 필수적이다. 최근 많은 연구 개발에 의해 내부양자효율은 크게 향상 되었지만, 광추출 효율은 GaN (n=2.4)와 공기 (n=1)의 굴절률 차이에 의해 아직까지 낮은 실정이다. 광추출 효율을 개선하기 위해 반사전극, 전방향 반사전극, 표면 거칠기, Chip 성형 등의 기술이 제안되고 있다. 본 연구는 LED의 광추출 효율을 높이기 위해 다양한 모양의 Hydrothermal 법에 의해 성장된 ZnO 나노 구조 및 나노스피어 리소그라피를 통한 폴리스티렌 나노 구체의 주기적인 배열에 따른 특성을 연구하였다.