• ETRI Journal
• /
• v.27 no.1
• /
• pp.89-94
• /
• 2005

This paper describes a low-loss, compact, 40-channel arrayed waveguide grating (AWG) which utilizes a monolithically integrated spot-size converter (SSC) for lowering the coupling loss between silica waveguides and standard single-mode fibers. The SSC is a simple waveguide structure that is tapered in both the vertical and horizontal directions. The vertically tapered structure was realized using a shadow-mask etching technique. By employing this technique, the fabricated, 40-channel, 100 GHz-spaced AWG with silica waveguides of 1.5% relative index-contrast showed an insertion-loss figure of 2.8 dB without degrading other optical performance.

• Macromolecular Research
• /
• v.15 no.7
• /
• pp.633-639
• /
• 2007

A variety of NMR techniques were applied to the micro-chemical structural characterization of polyanilines prepared via an efficient synthetic method in a self-stabilized dispersion medium in which the polymerization was conducted in a heterogeneous organic/aqueous biphasic system without any stabilizers. Here, the monomer and growing polymer chain were shown to function simultaneously as a stabilizer, imparting compatibility for the dispersion of the organic phase, and as a form of flexible template in an aqueous reaction medium. Polymerizations predicated on this concept generated polyanilines with a low defect content: solution state $^{13}C-NMR$ and solid $^{13}CDD/CP/MAS$ spectroscopy indicated that the synthesized HCPANi and its soluble derivative, HCPANi-t-BOC, evidenced distinctly different NMR spectra with fewer side peaks, as compared to conventionally prepared PANis, and the complete structural assignments of the observed NMR peaks could be determined via the combination of both 1D and 2D techniques. Ortho-linked defects in HCPANi were estimated to be as low as 7%, as shown by a comparison of the integration of the carbonyl carbon resonance peaks.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.169-172
• /
• 2009

We developed ultra-accelerated quantum chemical molecular dynamics and characterization simulators for study and design of plasma display panel (PDP) related materials. By use of these simulators, realistic structure of PDP materials is drawn on the computer. Furthermore, based on the structures, various properties such as secondary electron emission coefficient are successfully evaluated. In this report, we will discuss the theoretical secondary electron emission coefficient for several protecting layer materials and the effect of surface structure on the properties based on the result of atomistic simulations.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.563-564
• /
• 2006

Recently, CMP (Chemical Mechanical Polishing) is one of very important processing in semiconductor technology because of large integration and application of design role. CMP is a planarization process of wafer surface using the chemical and mechanical reactions. One of the most important components of the CMP system is the polishing pad. During the CMP process, the pad itself becomes smoother and glazing. Therefore it is necessary to have a pad conditioning process to refresh the pad surface, to remove slurry debris and to supply the fresh slurry on the surface. A diamond disk use during the pad conditioning. There are diamonds on the surface of diamond disk to remove slurry debris and to polish pad surface slightly, so density, shape and size of diamond are very important factors. In. this study, we characterized diamond disk with 9 kinds of sample.

• Journal of the Korean institute of surface engineering
• /
• v.57 no.3
• /
• pp.140-154
• /
• 2024

As the trend towards miniaturization in semiconductor integration process, the limitations of interconnection metals such as copper, tungsten have become apparent, prompting research into the emergence of new materials like cobalt and emphasizing the importance of studying the corresponding process conditions. During the chemical mechanical polishing (CMP) process, corrosion inhibitors are added to the slurry, forming passivation layers on the cobalt surface, thereby playing a crucial role in controlling the dissolution rate of the metal surface, enhancing both removal rate and selectivity. This review investigates the understanding of the cobalt polishing process and examines the characteristics and behavior of corrosion inhibitors, a type of slurry additive, on the cobalt surface. Among the corrosion inhibitors examined, benzotriazole (BTA), 1,2,4-triazole (TAZ), and potassium oleate (PO) all improved surface characteristics through their interaction with cobalt. These findings provide important guidelines for selecting corrosion inhibitors to optimize CMP processes for cobalt-based semiconductor materials. Future research should explore combinations of various corrosion inhibitors and the development of new compounds to further enhance the efficiency of semiconductor processes.

• Tribology and Lubricants
• /
• v.40 no.2
• /
• pp.67-70
• /
• 2024

Chemical mechanical planarization (CMP) is an essential process for ensuring high integration when manufacturing semiconductor devices. CMP mainly requires the use of polyurethane-based polishing pads as an ultraprecise process to achieve mechanical material removal and the required chemical reactions. A diamond disk performs pad conditioning to remove processing residues on the pad surface and maintain sufficient surface roughness during CMP. However, the diamond grits attached to the disk cause uneven wear of the pad, leading to the poor uniformity of material removal during CMP. This study investigates the pad wear rate profile according to the swing motion of the conditioner during swing-arm-type CMP conditioning using deep learning. During conditioning, the motion of the swing arm is independently controlled in eight zones of the same pad radius. The experiment includes six swingmotion conditions to obtain actual data on the pad wear rate profile, and deep learning learns the pad wear rate profile obtained in the experiment. The absolute average error rate between the experimental values and learning results is 0.01%. This finding confirms that the experimental results can be well represented by learning. Pad wear rate profile prediction using the learning results reveals good agreement between the predicted and experimental values.

• Fire Science and Engineering
• /
• v.31 no.1
• /
• pp.18-25
• /
• 2017

Each country tries to prevent major industrial accidents at industrial sites, such as fire and explosion as well as poisoning incidents, and regulation of the management of chemicals is being enhanced in all sectors. In particular, in the case of laboratories, a variety of chemicals have been developed and handled in accordance with the development of science and technology. On the other hand, the accident probability at laboratories is higher than at industrial sites, because many different kinds of chemicals are handled in the laboratory but in very small amounts and chemical, physical, and biological studies have been carried out in limited spaces. Recently, the accident probability at laboratories was found to be higher as convergence/integration studies were carried out beyond the academic arena. Therefore, in this study, a survey of chemical management was conducted to prevent accidents due to chemicals targeting the laboratory safety coordinator using the FGI (focus group interview) method. The building plan of a chemical management system was suggested based on the results of the survey.

• Journal of the Korean Electrochemical Society
• /
• v.10 no.2
• /
• pp.94-103
• /
• 2007

The transition of interconnection metal from aluminum alloy to copper has been introduced to meet the requirements of high speed, ultra-large scale integration, and high reliability of the semiconductor device. Since copper, which has low electrical resistivity and high resistance to degradation, has different electrical and material characteristics compared to aluminum alloy, new related materials and processes are needed to successfully fabricate the copper interconnection. In this review, some important factors of multilevel copper damascene process have been surveyed such as diffusion barrier, seed layer, organic additives for bottom-up electro/electroless deposition, chemical mechanical polishing, and capping layer to introduce the related issues and recent research trends on them.

• Journal of Korean Society of Environmental Engineers
• /
• v.28 no.10
• /
• pp.1082-1089
• /
• 2006

This study describes a methodology to develop a environmental and geographical information system for managing a national scale which is supports the environmental fate modeling. This system was developed via the integration of environmental and geographical information database(DB) and the DB usage software. For the sound environmental management, the DB were constructed by extracting the geometrical figures-such as points, polylines, and/or polygons-based on the geographical information previously developed in Korea. Then it was connected with the environmental information. Based on the Visual Basic Complier, the software can be a useful tool for visualizing the DB, for searching the environmental & geographical information, and supporting the environmental fate modeling.

• ETRI Journal
• /
• v.25 no.2
• /
• pp.73-80
• /
• 2003

This paper describes an effective method for forming silicon oxide on silica-on-silicon platforms, which results in excellent characteristics for hybrid integration. Among the many processes involved in fabricating silica-on-silicon platforms with planar lightwave circuits (PLCs), the process for forming silicon oxide on an etched silicon substrate is very important for obtaining transparent silica film because it determines the compatibility at the interface between the silicon and the silica film. To investigate the effects of the formation process of the silicon oxide on the characteristics of the silica PLC platform, we compared two silicon oxide formation processes: thermal oxidation and plasma-enhanced chemical vapor deposition (PECVD). Thermal oxidation in fabricating silica platforms generates defects and a cristobalite crystal phase, which results in deterioration of the optical waveguide characteristics. On the other hand, a silica platform with the silicon oxide layer deposited by PECVD has a transparent planar optical waveguide because the crystal growth of the silica has been suppressed. We confirm that the PECVD method is an effective process for silicon oxide formation for a silica platform with excellent characteristics.