Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2006.06a
- /
- Pages.563-564
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- 2006
The Characterization of the Conditioner Disks with Various Diamond Shapes
다이아몬드 형상에 따른 컨디셔너 디스크의 특성 평가
- Kim, Kyu-Chae (Hanyang University) ;
- Kang, Young-Jae (Hanyang University) ;
- Yu, Young-Sam (Hanyang University) ;
-
Park, Jin-Goo
(Hanyang University)
;
- Won, Young-Man (Sae-Sol Diamond Co.) ;
- Oh, Kwang-Ho (Sae-Sol Diamond Co.)
- 김규채 (한양대학교 재료화학공학부) ;
- 강영재 (한양대학교 재료화학공학부) ;
- 유영삼 (한양대학교 재료화학공학부) ;
-
박진구
(한양대학교 재료화학공학부)
;
- 원영만 (새솔다이아몬드) ;
- 오광호 (새솔다이아몬드)
- Published : 2006.06.22
Abstract
Recently, CMP (Chemical Mechanical Polishing) is one of very important processing in semiconductor technology because of large integration and application of design role. CMP is a planarization process of wafer surface using the chemical and mechanical reactions. One of the most important components of the CMP system is the polishing pad. During the CMP process, the pad itself becomes smoother and glazing. Therefore it is necessary to have a pad conditioning process to refresh the pad surface, to remove slurry debris and to supply the fresh slurry on the surface. A diamond disk use during the pad conditioning. There are diamonds on the surface of diamond disk to remove slurry debris and to polish pad surface slightly, so density, shape and size of diamond are very important factors. In. this study, we characterized diamond disk with 9 kinds of sample.