Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2006.06a
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- Pages.565-566
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- 2006
The Effect of Citric Acid on Copper Chemical Mechanical Polishing
구연산이 Copper Chemical Mechanical Polishing에 미치는 영향
- Jung, Won-Duck (Department of Precision & Mechanical Engineering in PNU) ;
- Park, Boum-Young (Department of Precision & Mechanical Engineering in PNU) ;
- Lee, Hyun-Seop (Department of Precision & Mechanical Engineering in PNU) ;
- Lee, Sang-Jic (Department of Precision & Mechanical Engineering in PNU) ;
- Chang, One-Moon (Department of Precision & Mechanical Engineering in PNU) ;
- Park, Sung-Min (Department of Precision & Mechanical Engineering in PNU) ;
- Jeong, Hae-Do (School of Mechanical Engineering in PNU)
- 정원덕 (부산대학교 정밀기계공학과) ;
- 박범영 (부산대학교 정밀기계공학과) ;
- 이현섭 (부산대학교 정밀기계공학과) ;
- 이상직 (부산대학교 정밀기계공학과) ;
- 장원문 (부산대학교 정밀기계공학과) ;
- 박성민 (부산대학교 정밀기계공학과) ;
- 정해도 (부산대학교 기계공학부)
- Published : 2006.06.22
Abstract
Slurry used in metal chemical mechanical polishing normally consists of an oxidizer, a complexing agent, a corrosion inhibitor and an abrasive. This paper investigates effects of citric acid as a complexing agent for Cu CMP with