• Journal of Surface Science and Engineering
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• v.56 no.3
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• pp.180-184
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• 2023

Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm². Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.

• Journal of Korea Foundry Society
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• v.8 no.4
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• pp.429-436
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• 1988

The influences of some casting conditions on bonding ratio and state at bonding zone of stainless steel-cast iron dual tube produced by centrifugal casting process were investigated to estimate fabrication technics. 1) Bonding ratio is increasing such as increasing of inner surface temperature of outer metal(stainless steel STS 304), if pouring temperature of inner metal (cast iron) is constant. 2) The more pouring temperature of inner metal (cast iron) increase, the more bonding ratio increase when inner surface temperature of outer metal (cast iron) is constant. 3) As the mold rotary speed is increase, the hatching area of bonding map (perfect bonding area) goes down to the low pouring temperature of inner metal. 4) In order to predict bonding state of two different metal, we are able to make and use the bonding map about casting conditions such as inner surface temperature of outer metal, pouring temperature of inner metal and mold rotary speed.

• Transactions of Materials Processing
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• v.7 no.1
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• pp.66-71
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• 1998

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

• Journal of the Korean Academy of Esthetic Dentistry
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• v.23 no.2
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• pp.58-69
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• 2014

In case of esthetic restorative procedure with zirconia restoration, we have to use resin cement because of not only just for retention but also esthetic reason. In such a clinical situation, we have to consider two bonding interfaces, one is tooth surface to resin cement and the other is zirconia surface to resin cement. There is well established bonding protocol between tooth surface to resin cement, but bonding protocol of zirconia surface to resin cement is still controversial. In scientific point of view, there are two mechanism for bonding of zirconia restoration.. One is mechanical retention and the other is chemical adhesion. However, we have three different options for bonding of zirconia restoration in clinical situation; 1) Tribo-chemical coating with silica and silane coupling agent 2) Zirconia primer with phosphate chemistry 3) Self-adhesive resin cement with phosphate chemistry.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1480-1481
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• 2008

In this paper, we present surface treatments for achieving bonds between PMMA and PDMS substrates. Silane primer is used for the formation of hydroxyl group on PMMA surfaces. The formed hydroxyl groups enhance the bonding strength of PDMS-PMMA substrates without channel clogging and structure deformation. The bonding strength on the different surface treatments (include oxygen plasma, 3-APTES, and corona discharge) is evaluated to find optimal bonding condition. The maximum bonding strength at the optimal surface treatment is over 300 kPa. The surface treatment using silane primer can be used to the bonding process of Micro-TAS and Lab-on-a-Chip.

• Restorative Dentistry and Endodontics
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• v.23 no.1
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• pp.413-423
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• 1998

Dental ceramics exhibit excellent esthetic property, compressive strength, chemical durability, biocompatibility and translucency. This study evaluated the shear bond strength of composite resin to the new heat-pressed ceramic material (IPS-Empress System) depending on the surface treatments and bonding agents. The surface treatments were etching with 4.0% hydrofluoric acid, application of silane, and the combination of the two methods. Composite resin was bonded to ceramic with four kinds of dentin bonding agents(All-Bond 2, Heliobond, Scotch bond Multi-purpose and Tenure bonding agents). The ceramic specimen bonded with composite resin was mounted in the testing jig, and the universal testing machine(Zwick 020, Germany) was used to measure the shear bond strength with the cross head speed of 0.5 mm/min. The results obtained were as follows 1. The mean shear bond strength of the specimens of which the ceramic surface was treated with the combination of hydrofluoric acid and silane before bonding composite resin was significantly higher than those of the other surface treatment groups(p<0.05). 2. In the case of All-Bond 2 and Scotchbond Multi-purpose bonding agent group, the surface treatment methods did not influenced significantly on the shear bond(p>0.05). 3. Of the four bonding agents tested, the shear bond strength of Heliobond was significantly lower than those of other bonding agents regardless of the surface treatment methods(p<0.05). 4. The highest shear bond strength($12.55{\pm}1.92$ MPa) was obtained with Scotchbond Multipurpose preceded by the ceramic surface treatment with the combination of 4% hydrofluoric acid and silane.

• Journal of Surface Science and Engineering
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• v.54 no.5
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• pp.207-212
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• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• Restorative Dentistry and Endodontics
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• v.22 no.1
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• pp.470-478
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• 1997

The purpose of this study was to investigate the effects of moistening mechods of dentin on the morphologic states of hybrid layers and on the interfacial bond strength between dentin and composite. Specimens were divided into 6 groups based on the surface moistening methods and materials used. After the dentin surface was conditioned with 10 % phoporic acid and irrigated: 1. The dentin surface was dried. Then bonding agent and composite were applied. 2. The dentin surface was blot-dryed. Then primer, bonding atent and composite were applied. 3. The dentin surface was dryed first. Within 20 seconds, the surface was rewetted, then primer, bonding agent and composite were applied. 4. The dentin surface was dryed. Then primer, bonding agnent and composite were applied. 5. The dentin surface was dryed first. Atter 24hrs, the surface was rewetted, and then primer, bonding agent and composite were applied. 6. The surface was conditioned with NaOCl for 5min. Then primer, bonding agent and composite were applied. To reveal the hybrid layer, scanning electron microscopy was used after the samples were ion beam etched. The shear bond strength of each group was tom pared by ANOVA. In groups 2, 3 and 4, the hybrid layer was clearly visible, but the width was more limited in group 4. In group 1 and 5, the hybrid layer was not found, and a gap was formed between dentin and composite. In group 6, the hybrid layer was not found, but the interface between the dentin and composite was intimate. The shear bond strength of each group was as follows: Group 1 : 4MPa, Group 2 : 14MPa, Group 3 : 12MPa, Group 4 : 14MPa, Group 5 : 5MPa, Group 6 : 9MPa.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.28-28
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• 2010

The secondary barrier of cargo containment for membrane LNG tank is composed of composite materials such as rigid triplex (rigid secondary barrier, RSB) and flexible triplex (flexible secondary barrier, FSB). RSB and FSB are adhered to each other using an epoxy adherent and the quality of the secondary barrier depends on the bonding strength between them. The bonding strength between RSB and FSB is greatly influenced by the surface condition of RSB prior to joining. In this study, the effect of surface condition prior to joining on the joint strength and the fracture mode occurred between RSB and FSB have been examined in order to establish a proper surface treatment method for improving the bonding strength at the temperature of $-170^{\circ}C$.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1501_1502
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• 2009

Plasma treatment time was optimized to maximize the bonding strength between silicon and quartz. Bonding strength between the silicon and quartz is related to a surface energy which can be calculated by contact angle measurement. It was found that optimized time to get maximized surface energy was 15 sec. Silicon and quartz wafers were treated with $O_2$ plasma under different time splits and then bonded together. Bonding strength of the bonded wafers was measured by shear test. It was verified that the highest bonding strength was obtained when the silicon and quartz wafers were treated for 15 seconds. The maximum bonding strength exceeded the fracture strength of silicon.