• Journal of the Korean Chemical Society
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• v.21 no.4
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• pp.246-255
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• 1977

The adsorption of methylmethacylate on layer silicates containing various interlayer cations has been studied by means of infrared spectroscopy and X-Ray. Several characteristic carbonyl bands of adsorbed methylmethacrylate appeared differently at the region of 1723∼1547$cm^{-1}$depending on the species of cation and the dehydration temperature. The carbonyl stretching band shifted about 190$cm^{-1}$ to lower frequencies has been observed only for polyvalent cations, which has been attributed to $>C=O{\cdot}{\cdot}{\cdot}M^{n+}$ complex formation. The band appeared at 1703∼1640$cm^{-1}$ is responsible for hydrogen bonding between carbonyl oxygen and cationic water or cationic hydroxyl group, and the degree of shift indicates good correlation with the polarizing power of the interlayer cations. However, the band appeared at 1723$cm^{-1}$ has not been correlated with the species of cation but assigned to the carbonyl stretching which reacted with the surface hydroxyl group. On the basis of interlamellar spacing, it is suggested that the molecular plane of MMA molecule is parallel to silicate layers.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.31 no.1
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• pp.31-38
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• 1999

Adsorption of polymeric flocculants and dry strength agents onto the surface of papermaking fibers is critical for their effective utilization since the polymeric substances not adsorbed on fibers or fines keep recirculating in the papermaking system to cause various operational difficulties and loss of raw materials. Problems associated with the unadsorbed polymeric substances generate great attention because unprecedent interests in utilization of recycled papers and papermaking system closure. In this study, to understand the effects of recycling on the adsorption propensity of cationic polyacryamide (PAM) dry strength resin onto hardwood bleached kraft pulp fibers and fines a systematic approach was followed. Never dried bleached hardwood kraft pulp was recycled in two different ways. In mode one recycling experiment never dried pulp was beaten then recycled three times by employing simple drying and disintegrating steps. In mode two recycling experiment beating of the recycled pulp was carried out after each recycling step. Adsorption of cationic PAM on fibers and fines was evaluated employing Kjeldahl nitrogen analysis method. The influence of recycling on water retention value, carboxyl content, sheet density and tensile strength of the pulp was examined. As the number of recycling increased, water retention value of the fiber was reduced due to hornification and this in turn caused a decrease in adsorption of cationic PAM. On the other hand, the carboxyl content of the recycled fibers increased because of the oxidation of fibers occurred during drying, and this caused an increase in adsorption of cationic PAM. Because of these two opposing factors the adsorption of the cationic PAM on the recycled fibers decreased and then increased slightly at third recycling step. Increase of PAM adsorption, however, did not provide did not provide and strength improvement for the recycled pulp fibers indicating greater influence of the honification on interfiber bonding.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.40 no.4
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• pp.328-336
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• 2004

This paper describes the effect of loading rate, specimen geometries and material properties for ModeⅠ and Mode Ⅱ interlaminar fracture toughness of hybrid composite by using double cantilever beam (DCB) and end notched flexure (ENF) specimen. In the range of loading rate 0.2~20mm/min, there is found to be no significant effect of loading rate with the value of critical energy release rate (Gc).The value of Gc for variation of initial crack length are nearly similar values when material properties are CF/CF and GF/GF, however, the value of Gc are highest with the increasing intial crack length at CF/GF. The SEM photographs show good fiber distribution and interfacial bonding of hybrid composites when the moulding is the CF/GF.

• Journal of the Korean Society of Safety
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• v.26 no.2
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• pp.13-19
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• 2011

The magnetic polishing is the useful method to finish using magnetic power of magnet. That method is one of precision polishing techniques and has an aim of the clean technology using for the pure of gas and inside of the clean pipe. The magnetic abrasive polishing method is not so common for machine that it is not spreaded widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper deals with development of the magnetic abrasive using Sr-Ferrite. In this development, abrasive grain GC used to resin bond fabricated low temperature. And Sr-Ferrite of magnetic abrasive powder fabricated that Sr-Ferrite was crused into 200 mesh. The XRD analysis result show that only GC abrasive and Sr-Ferrite crystal peaks detected which explains resin bond was not any more chemical reaction. From SEM analysis it is found that GC abrasive and Sr-Ferrite were strong bonding with each other by bond. The magnetic polishing is performed by polishing the surface of pipe by attracting magnetic abrasives with magnetic fields. This can be widely applied for finishing machinery fabrications such as various pipes and for other safety processes. In this paper, we could have investigated in to the changes of the movement of magnetic abrasive grain. In reference to this result, we could have made the experiment which is set under the condition of the magnetic flux density, polishing velocity according to the form of magnetic brush.

• Polymer(Korea)
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• v.29 no.4
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• pp.392-398
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• 2005

Self-assembled multilayer thin films of poly(ethylene-alt-maleic anhydride) (PEMAh) and poly(4-vinyl pyridine) (P4VP) were fabricated by layer-by-layer (LbL) sequential adsorption. Fourier transform infrared (FT-IR) spectroscopic analysis of the self-assembled PEMAh/P4VP multilayer films confirms that the driving forces for the multilayer buildup are the intermolecular hydrogen bonding and electrostatic interactions. The linear increase of absorption peak of P4VP at 256 nm with increasing number of PEMAh/P4VP bilayers indicates that the multilayer buildup is an uniform assembling process. We also investigate the effects of polyelectrolyte concenhation variation of the dipping solution and pH variation of the PEMAh solution on the multilayer film formation. Thickness. adsorbed polyelectrolyte mass and surface roughness of the multilayer films were measured by UV-visible spectroscopy, quartz crystal microbalance (QCM), and atomic force microscopy (AFM), respectively.

• Korean Journal of Materials Research
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• v.10 no.7
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• pp.459-463
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• 2000

Direct use of negative ions for modification of materials has opened new research such as charging-free ion implantation and new materials syntheses by pure kinetic bonding reactions. For these purposes, a new solid-state ce-sium ion source has been developed in the laboratory scale. In this paper, diamond like carbon(DLC) films were prepared on silicon wafer by a negative cesium ion gun. This system does not need any gas in the chamber; deposition occurs under high vacuum. The ion source has good control of the C- beam energy(from 80 to 150eV). The result of Raman spectrophotometer shows that the degree of diamond-like character in the films, $sp^3$ fraction, increased as ion beam energy increases. The nanoindentation hardness of the films also increases from 7 to 14 GPa as a function of beam energy. DLC films showed ultra-smooth surface(Ra~1$\AA$)and an impurity-free quality.

• Journal of the Korean Wood Science and Technology
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• v.42 no.2
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• pp.163-171
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• 2014

Environmental issues about indoor air quality have been increased and focused on volatile organic compounds (VOCs) caused cancer, asthma, and skin disease. Reducing VOCs has been attempted in many different methods such as using environmentally friendly materials and air cleaner or purifier. Charcoal is well known material for absorbing VOCs. Therefore, carbonized board from medium density fiberboard has been developed. We assumed that the source of carbonized boards can be any type of wood-based panels. In this study, carbonized boards were manufactured from oriented strand board (OSB) at 400, 600, 800, and $1000^{\circ}C$. Each carbonized OSB (c-OSB) was evaluated and determined physiomechanical characteristics such as exterior defects, dimensional shrinkage, modulus of elasticity, and bending strength. No external defects were observed on c-OSBs at all carbonizing conditions. As carbonizing temperature increased, less porosity between carbonized wood fibers was observed by SEM analysis. The higher rate of dimensional shrinkage was observed on c-OSB at $1000^{\circ}C$ (66%) than c-OSB at 400, 600, and $800^{\circ}C$ (47%, 58%, and 63%, respectively). The densities of c-OSBs were lower than original OSB, but there was no significant different among the c-OSBs. The bending strength of c-OSB increased 1.58 MPa (c-OSB at $400^{\circ}C$) to 8.03 MPa (c-OSB at $1000^{\circ}C$) as carbonization temperature increased. Carbonization temperature above $800^{\circ}C$ yielded higher bonding strength than that of gypsum board (4.6 MPa). In conclusion, c-OSB may be used in sealing and wall for decorating purpose without additional artwork compare to c-MDF which has smooth surface.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.3
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• pp.169-174
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• 1994

The reaction layer formed at interface between matrix and fiber has significant effects on the mechanical properties and behaviors of deformation m FRM. In this study, the mechanical properties and interfacial behaviors according to surface finishing on the fibers and according to heat treatment in FRM were investigated. FRM was fibricated by diffusion bonding method. In W/Al alloy composite and W/Al composite, W of which was coated with $WO_3$, the heat treatment was carried out thermal cycling method from 373K to 673K. In W/Al composite, W of which was coated with $WO_3$, growth of interface layer was hardly occured in spite of the increasing various thermal cycles. It was exhibited that oxidized W/Al composite were higher strength than non-oxidezed W/Al composite with the increasing thermal cycles. The compounds of fiber/matrix interface were analyzed into $WAl_{12}$, $WAl_7$, and $AlWO_3$, respectivly. Therefore the interfacial compounds of fiber/matrix seriously affected the mechanical properties and behaviors of deformation in FRM.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.106-106
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• 2000

반도체 소자가 미세화 됨에 따라 게이트 유전막으로 사용되는 SiO2의 박막화가 요구되나, boron penetration에 의한 Vt shift, 게이트 누설전류, 다결정 실리콘 게이트의 depletion effect 그리고 quantum mechanical effect 때문에 ~20 급에서 한계를 나타내고 있다. 이에 0.1$\mu\textrm{m}$이상의 design rule을 갖는 logic이나 memory 소자에서 요구되어지는 ~10 급 게이트 산화막은 SiO2(K=3.9)를 대신하여 고유전율을 갖는 재료의 채택이 필수 불가결하게 되었다. 고유전 박막 재료를 사용하면, 두께를 두껍게 해도 동일한 inversion 특성이 유지되고 carrier tunneling 이 덜하여 등가 산화막의 두께를 줄일 수 있다. 이러한 고유전박막 재료중 가장 활발히 연구되고 있는 재료는 Ta2O5, Al2O3, STO 그리고 BST 등이 있으나 Ta2O5, STO, BST 등은 실리콘 기판과 직접 반응을 한다는 문제를 가지고 있으며, Al2O3는 유전율이 낮의 재료가 최근 주목받고 있다. 본 실험에서는 ZrO2, HfO2 또는 그 silicates 등의 재료가 최근 주목 받고 있다. 본 실험에서는 ZrO2 박막의 증착조건에 따른 물리적, 전기적 특성 변화에 대하여 연구하였다. RCA 방식으로 세정한 P-type (100) 실리콘 기판위에 reactive DC sputtering 방법으로 압력 5mtorr, power 100~400W, 기판온도는 100-50$0^{\circ}C$로 변화시켜 ZrO2 박막을 증착한 후 산소와 아르곤 분위기에서 400-80$0^{\circ}C$, 10-120min으로 열처리하였다. 증착직후의 시편들과 열처리한 ZrO2 박막의 미세구조와 전기적 특성 변화를 관찰하였다. 우선 굴절율(RI)를 이용해 ZrO2 박막의 밀도를 예측하여 power와 기판온도에 따라 이론값 2.0-2.2 에 근접한 구조를 얻은 후 XRD, XPS, AFM, 그리고 TEM을 사용하여 ZrO2 박막의 chemical bonding, surface roughness 그리고 interfacial layer의 특성을 관찰하였다. 그리고 C-V, I-V measurement를 이용해 capacitance, 유전율, 누설전류 등의 전기적 특성을 관찰해 최적 조건을 설정하였다.