• Advances in aircraft and spacecraft science
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• 제11권1호
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• pp.83-103
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• 2024

Adhesive bonding is currently widely used in many industrial fields, particularly in the aeronautics sector. Despite its advantages over mechanical joints such as riveting and welding, adhesive bonding is mostly used for secondary structures due to its low peel strength; especially if it is simultaneously exposed to temperature and humidity; and often presence of bonding defects. In fact, during joint preparation, several types of defects can be introduced into the adhesive layer such as air bubbles, cavities, or cracks, which induce stress concentrations potentially leading to premature failure. Indeed, the presence of defects in the adhesive joint has a significant effect on adhesive stresses, which emphasizes the need for a good surface treatment. The research in this field is aimed at minimizing the stresses in the adhesive joint at its free edges by geometric modifications of the ovelapping part and/or by changing the nature of the substrates. In this study, the finite element method is used to describe the mechanical behavior of bonded joints. Thus, a three-dimensional model is made to analyze the effect of defects in the adhesive joint at areas of high stress concentrations. The analysis consists of estimating the different stresses in an adhesive joint between two 2024-T3 aluminum plates. Two types of single lap joints(SLJ) were analyzed: a standard SLJ and another modified by removing 0.2 mm of material from the thickness of one plate along the overlap length, taking into account several factors such as the applied load, shape, size and position of the defect. The obtained results clearly show that the presence of a bonding defect significantly affects stresses in the adhesive joint, which become important if the joint is subjected to a higher applied load. On the other hand, the geometric modification made to the plate considerably reduces the various stresses in the adhesive joint even in the presence of a bonding defect.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.159-159
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• 2010

We conducted bum-in test by current stress to evaluate acceleration reliability characteristics about p-resistivity influence of GaN-based light-emitting diodes. The LEDs used in this study are the polarization field-induced LED(PF-LED) having low p-resistivity and the highly resistive LED(HR-LED) having high p-resistivity. The result of high stress experiment shows that current crowding phenomenon is occurred from the center of between p-bonding pad and n-bonding pad to either electrodes. In addition, series resistance and optical power decrease dramatically. These results means that the resistance of between p-bonding pad and p-GaN affect reliability. That's why we need to consider the ohmic contact of p-bonding pad when design the high efficiency and high reliability LEDs.

• Restorative Dentistry and Endodontics
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• 제35권1호
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• pp.30-39
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• 2010

본 연구에서는, 삼차원 유한요소분석법을 이용하여 복합레진 및 도재 라미네이트로 전치부 치간이개를 폐쇄할 때, 치간이개의 간격과 수복방법이 수복물의 접착계면에서의 응력분포에 미치는 영향을 비교하였다. 복합레진 혹은 도재 라미네이트로 수복된 모습의 유한요소모델을 형성하여 접착계면에서의 von Mises stress 분포 양태를 분석하였다. 수복형태는 크게 네 가지 범주를 고려하였다. Type I, 복합레진으로 인접면을 최소한으로 수복하는 경우; Type II, 치아 삭제 없이 복합레진으로 순면의 절반까지 수복하는 경우; Type III, 치아삭제 후복합레진으로 순면의 2/3까지 수복하는 경우; Type IV, 도재 라미네이트로 수복하는 경우 이 실험의 한계 내에서 다음과 같은 결론을 내릴 수 있었다. 모든 수복형태에 대해 치간이개 간격이 넓어질수록 접착계면에서 발생하는 최대응력 값은 증가하였으며, 도재 라미네이트로 치간이개 부위를 수복한 경우(Type IV)가 복합레진으로 수복한 경우(Type I, II, III)에 비해 높은 최대응력값을 나타내었다. 그러나 치간이개 간격이 넓어질수록 도재 라미네이트와 복합레진에서 발생하는 최대응력값의 차리는 감소하였으며, 치간이개 간격의 증가에 따른 최대응력값의 증가율은 도재 라미네이트가 복합레진으로 수복하는 경우보다 낮았다.

• 비파괴검사학회지
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• 제15권2호
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• pp.357-363
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• 1995

CFRP 복합 재료를 접착 접합한 single-lap 및 double-lap 접합 시험편의 disbond 크기를 초음파 C-scan 및 simulated stress wave를 이용하여 정량적으로 평가하고자 하였다. 초음파 C-scan 시험을 통해 인공 결함의 크기가 확인된 시험편을 사용하여, 접합부를 통과한 응력파의 주파수를 변화시키면서 peak amplitude를 측정하여 주파수 응답성을 구하였으며, 이를 분석한 결과 두 적층판의 두께 방향 기본 공진 및 3차 공진 주파수에서 peak amplitude가 극값을 보이며, 접합 면적에 비례함을 관측할 수 있었다. 이 결과로 표준시험편만 준비된다면 결함의 정량적 평가 및 현장 적용에도 이용할 수 있을 것으로 기대된다.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.69-73
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• 2008

본 연구에서는 리드-온-칩 패키징 기술을 이용한 반도체 제품에서 디바이스의 패드의 위치가 온도변화로 인한 신뢰성 문제에 대단히 중요하다는 것을 보여준다. 컴퓨터를 이용한 이론적 계산 및 실험을 통해 패시베이션 파손으로 대변되는 신뢰성 문제가 디바이스의 코너 부위에 위치한 패턴에서 가장 심하게 발생할 수 있다는 것을 보여준다. 따라서, 패시베시션 파손 등으로 인한 디바이스의 신뢰성 저하를 예방하기 위해서는 취약한 패드 부위는 다바이스의 테두리 부위보다는 중앙부위에 위치하도록 설계하는 것이 바람직하다는 것을 본 연구에서는 지적하고 있다.

• 접착 및 계면
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• 제21권1호
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• pp.20-26
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• 2020

Single lap-shear joints (SLJ) specimens with and without partial round fillets were fabricated to measure the average shear strength of adhesives. The effects of the length of the adherend on the SLJ specimens were also investigated. An epoxy adhesive was used to bond aluminum alloy. Tensile tests were performed on the adhesive bulk specimens to measure the mechanical properties. The finite element analysis (FEA) method was used to measure the adhesive stress distributions, i.e., the peel and shear stresses, on the bonded part. The experimental results revealed that the specimen consisting short length of adherend and without the partial round fillets exhibited the smallest average shear strength of adhesive among the investigated specimens. FEA revealed that the low average shear strength for the specimen with a short adherend length was caused by high stress concentrations on the adhesive at the edge of the bonded part.

• 한국생산제조학회지
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• 제21권3호
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• pp.439-445
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• 2012

The stress singularity for the excess adhesive on interface of adhesively bonded joint was investigated by using the 2-dimensional elastic boundary element method (BEM). To establish a reasonable strength evaluation method and a fracture criterion for the excess adhesive of interface in adhesively bonded joint, it is necessary to evaluate fracture parameters with various bonding conditions. Under the variations of adhesively bonded thickness (h) and diameter (d) for the excess adhesive, a stress analysis was performed, and from the results, the stress singularity index (${\lambda}$) and the stress singularity factor (${\Gamma}$) were calculated. The variations have a great influences on the stress singularity for the excess adhesive of interface in adhesively bonded joint, and the ${\Gamma}$ is reduced as the "h" and "d" increase.

• 센서학회지
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• 제13권4호
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• pp.264-269
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• 2004

This paper describes on an advanced technology of 3C-SiC/Si(100) wafer direct bonding using PECVD oxide to intermediate layer for SiCOI(SiC-on-Insulator) structure because it has an attractive characteristics such as a lower thermal stress, deposition temperature, more quick deposition rate and higher bonding strength than common used poly-Si and thermal oxide. The PECVD oxide was characterized by ATR-FTIR. The bonding strength with variation of HF pre treatment condition was measured by tensile strength measurement system. After etch-back using TMAH solution, roughness of 3CSiC surface crystallinity and bonded interface was measured and analyzed by AFM, XRD, and SEM respectively.

• 소성∙가공
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• 제16권2호
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• pp.138-143
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• 2007

Superplastic forming/diffusion bonding (SPF/DB) processes were analyzed using a 3-D rigid visco-plastic finite element method. A constant-triangular element based on membrane approximation and an incremental theory of plasticity are employed for the formulation. The coulomb friction law is used for interface friction between tool and material. Pressure-time relationship for a given optimal strain rate is calculated by stress and pressure values at the previous iteration step. In order to improve the contact searching, hierarchical search algorithm has been applied and implemented into the code. Various geometries including sandwich panel and 3 sheet shape for 3-D SPF/DB model are analyzed using the developed program. The validity fer the analysis is verified by comparison between analysis and results in the literature.

• Advanced Composite Materials
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• 제16권1호
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• pp.31-44
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• 2007

The purpose of this study is to improve the examining and understanding of the bonding behavior of Fiber Reinforced Polymer (FRP) sheets bonded to concrete blocks and steel plates under fatigue loading. First, a series of experimental investigations is summarized in the paper. The fatigue behavior of bonding surface between FRP sheets and concrete is finally characterized by the conducted P-S-N diagram representing the relationship among the probability of FRP debonding (P), the bond stress amplitudes (S), and the number of cycles (N) at debonding on a semi-logarithmic scale. The different debonding modes for various fracturing surface are also investigated and evaluated.