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Analysis of Stress Singularity for the Excess Adhesive of Interface in Adhesively Bonded Joint

접착이음의 계면덧살에 대한 응력특이성 해석

  • 정남용 (숭실대학교 기계공학과) ;
  • 박철희 (인천대학교(제물포 캠퍼스))
  • Received : 2011.08.08
  • Accepted : 2012.01.27
  • Published : 2012.06.15

Abstract

The stress singularity for the excess adhesive on interface of adhesively bonded joint was investigated by using the 2-dimensional elastic boundary element method (BEM). To establish a reasonable strength evaluation method and a fracture criterion for the excess adhesive of interface in adhesively bonded joint, it is necessary to evaluate fracture parameters with various bonding conditions. Under the variations of adhesively bonded thickness (h) and diameter (d) for the excess adhesive, a stress analysis was performed, and from the results, the stress singularity index (${\lambda}$) and the stress singularity factor (${\Gamma}$) were calculated. The variations have a great influences on the stress singularity for the excess adhesive of interface in adhesively bonded joint, and the ${\Gamma}$ is reduced as the "h" and "d" increase.

Keywords

References

  1. Yuuki, R., and Xu, J. Q., 1992, "Stress Based Criterion for an Interface Crack Kinking out of the Interface in Dissimilar Materials," Eng. Frac. Mech., Vol. 41, No. 5, pp. 635-644. https://doi.org/10.1016/0013-7944(92)90150-D
  2. Yang, Y. Y., Munz, D., and Sckuhr, M. A., 1997, "Evaluation of the Plastic Zone an Elastic-Plastic Dissmilar Materials Joint," Eng. Frac. Mech., Vol. 56, No. 5, pp. 691-710. https://doi.org/10.1016/S0013-7944(96)00121-X
  3. Chung, N. Y., Yuuki, R., Ishikawa, H., and Nakano, S., 1992, "Evaluation of Fracture Toughness by Energy Release Rate for Interface Crack in Adhensively Bonded Joints," Transaction of the KSME, Vol. 24, No. 9, pp. 2174-2182.
  4. Park, C. H., and Chung, N. Y., 2007, "Analyses of Stress Singularities on Bonded Interfaces in the IC Package by Using Boundary Element Method," Transaction of the KSMTE, Vol. 16, No. 6, pp. 94-102.
  5. Paul, E. W. L., and Martin, L. D., 1999, "Stress Intensities at Interface Corner in Anistropic Bibaterials," Eng. Frac. Mech., Vol. 62, No. 4, pp. 555-575. https://doi.org/10.1016/S0013-7944(99)00005-3
  6. Munz, D., and Yang, 1992, "Stress Singularities at the Interface in Bonded Dissimilar Materials Under Mechanical and Thermal Loading," Journal of Applied Mechanics, Vol. 59, No. 5, pp. 857-861. https://doi.org/10.1115/1.2894053
  7. Chung, N. Y., and Park, C. H., 2009, "Analyses of Fracture Parameters and Prediction of Crack Propagation Path on Delamination in the LSI Package", Transaction of the KSMTE, Vol. 18, No. 4, pp. 401-409.
  8. Slama, M., and Hasebe, N., 1996, "Stress Concentration Factors at an Elliptical Hole on the Interface Between Bonded Dissimilar Half-planes under Bending Moent," J. Appl. Mech., Vol. 63, No. 3, pp. 7-14. https://doi.org/10.1115/1.2787213
  9. Sung, J. C., Liou, J. Y., and Lin, Y. Y., 1996, "Some Phenomena of Cracks Perpendicular to an Interface Between Dissimilar Orthotropic Materials," Transactions of the ASME, Vol. 63, No. 5, pp. 190-203. https://doi.org/10.1115/1.2787197
  10. Chung, N. Y., and Park, C. H., 2006, "Establishment of Fracture Criterion on Friction Welded Dissimilar Materials," Transaction of the KSAE, Vol. 14, No. 5, pp. 164-171.
  11. Chung, N. Y., and Song, C. H., 1996, "Prediction of Propagation Path for the Interface Crack in Bonded Dissimilar Materials," Transaction of the KSAE, Vol. 4, No. 3, pp. 112-121.
  12. Chung, N. Y., Lee, M. D., and Kang, S. K., 2000, "Evaluation of Fracture Toughness by Energy Release Rate for Interface Crack in Adhensively Bonded Joints," Transaction of the KSME, Vol. 24, No. 9, pp. 2174-2182.
  13. Bogy, D. B., 1975, "The Plane Solution for Jointed Dissimilar Elastic Semistrips under Tensions," J. Appl. Mech., Vol. 42, No. 2 pp. 93-98.
  14. Dunders, J., 1969, "Discussion of Edge-Bonded Dissimilar Orthogonal Elastic Wedges under Normal and Shear Loading," J. Appl. Mech., Vol. 36, No. 3, pp. 650-652. https://doi.org/10.1115/1.3564739

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