• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.374-375
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• 2006

This paper describes anodic bonding characteristics of MCA to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with the same properties were deposited on MCA under optimum RF sputter conditions (Ar 100 %, input power $1\;W/cm^2$). After annealing at $450^{\circ}C$ for 1 hr, the anodic bonding of MCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in $110^{-6}$ Torr vacuum condition. Then, the MCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation and simulation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity being 0.05-0.08 %FS. Moreover, any damages or separation of MCNSi bonded interfaces did not occur during actuation test. Therefore, it is expected that anodic bonding technology of MCNSi-wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

• Journal of the Korean Recycled Construction Resources Institute
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• v.11 no.4
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• pp.433-439
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• 2023

In this study, the bonding performance of repair materials was evaluated on concrete repair surface to develop concrete repair materials based on UHPC (Ultra High Performance Concrete) which has high mechanical and durability performance. The ten test variables were applied considering the roughness and wet condition of the concrete surface subject to repair, the addition of polymer, and the use PP and PVA fibers in repair materials. The addition of the polymer caused a significant decrease in strength, which was thought to be due to the effect of the additional super plasticizer used to adjust workability. Also, flow was reduced by up to 13.8 % with the use of plastic-based fibers. As a result of evaluating the bond strength of the repair material considering the condition of the surface subject to repair, it was thought that in the case of using UHPC-based repair material, high bonding performance could be secured without any additional surface treatment as long as the surface of the base material was sound. In addition, UHPC-based repair materials showed high bonding performance even when the attachment surface was wet. In the future, research will be conducted on shot-crete application and gradient pouring for the development of UHPC-based repair materials, and continuous improvement in the repair material mixing property will be carried out to ensure economic efficiency and performance as a concrete structural repair material.

• The KIPS Transactions:PartA
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• v.12A no.7 s.97
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• pp.627-636
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• 2005

This paper presents a PC cluster-based distributed video on demand (VOD) server that minimizes the load of the interconnection network by adopting channel bonding-based MVIA and the interval cache algorithm Video data is distributed to the disks of each server node of the distributed VOD server and each server node receives the data through the interconnection network and sends it to clients. The load of the interconnection network increases because of the large volume of video data transferred. We adopt two techniques to reduce the load of the interconnection network. First, an Msupporting channel bonding technique is adopted for the interconnection network. n which is a user-level communication protocol that reduces the overhead of the TCP/IP protocol in cluster systems, minimizes the time spent in communicating. We increase the bandwidth of the interconnection network using the channel bonding technique with MThe channel bonding technique expands the bandwidth by sending data concurrently through multiple network cards. Second, the interval cache reduces traffic on the interconnection network by caching the video data transferred from the remote disks in main memory Experiments using the distributed VOD server of this paper showed a maximum performance improvement of $30\%$ compared with a distributed VOD server without channel bonding-based MVIA and the interval cache, when used with a four-node PC cluster.

• Proceedings of the KAIS Fall Conference
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• 2010.11a
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• pp.470-473
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• 2010

Graphene, consisting of a single layer of carbon in a two-dimensional lattice, has been emerging as a fascinating material with many unique physical, chemical and mechanical properties. In this study, graphenes were prepared by a chemical method. To develop high performance polymer nanocomposites reinforced by graphenes, adequate dispersion of the fillers and strong interfacial bonding between the fillers and the polymer matrix are essential. The purpose of this study was to examine the influence of introducing amine groups on the surfaces of graphenes. FT-IR spectroscopy, SEM were used to confirm the functionalization. Epoxy nanocomposites comprising the graphenes were prepared and their characteristics were investigated by DSC, DMA and TMA. Fracture surfaces of the nanocomposites were investigated by SEM. The functionalized graphenes induced strong interfacial bonding than the pristine graphenes and resulted in considerable improvements in the performance of the nanocomposites.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2019.05a
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• pp.65-66
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• 2019

In this study, flexural strength and impact resistance were evaluated to investigate the fiber length effect of amorphous metallic fiber. As a result, in the case of 30AFRCC, cutoff behavior due to excellent bonding performance by large specific surface area has greatly influence on the flexural and impact resistance performance. In the case of 15AFRCC, the bonding efficiency is relatively low, because the specific surface area is smaller than that of 30AFRCC and the number of fiber is large, so the effect of improving the flexural and impact resistance performance is smaller than that of 30AFRCC.

• Proceedings of the Korea Concrete Institute Conference
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• 2004.11a
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• pp.813-816
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• 2004

This study was performed to investigate bonding performance of epoxy resins for repairing of cracks in concrete, as a part of project to establish quality control standard for epoxy resins. In the slant shear strength test for hard and soft type epoxy, hard type was higher about 3 times than soft one. From the results, it is thought that hard type is suitable for load carrying. Injection of epoxy resin in the notch made flexural strength increase about $47\%$ over the specimen that epoxy resin is not injected. There were no differences in bonding performances with viscosity. Application of epoxy resin on the wet concrete surface made slant shear strength decrease about $46\%$, but similar performance to the case of application on the dry surface appeared by using epoxy resin for wet condition.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.759-762
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• 2000

Present transistors which have vertical structure show increased parasitic capacitance characteristics in accordance with the increase of non-active base area and collector area, consequently have disadvantage for high speed switching performance. In this paper, a horizontal structure transistor which has minimized parasitic capacitance in virtue of SDB(Silicon Direct Bonding) wafer and oxide sidewall isolation utilizing silicon trench technology is presented. Its structural characteristics were designed by ATHENA(SUPREM4), the process simulator from SILVACO International, and its performance was proven by ATLAS, the device simulator from SILVACO International. The performance of the proposed horizontal structure transistor was certified through the VCE-lC characteristics curve, $h_{FE}$ -IC characteristics, and GP-plot.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.1156-1161
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• 2006

This study is to evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital $LabView^{TM}$ measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module.

• Journal of Magnetics
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• v.6 no.2
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• pp.73-76
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• 2001

A double rectangular spiral type inductor has been fabricated by using FeTaN films. The inductor is composed of internal coils sandwiched by magnetic layers. Characteristics of inductor performance are investigated with an emphasis on planarization of magnetic films. In the absence of the planarization process, the grating topology of the upper magnetic films over the coil arrays degrades the soft magnetic properties and the inductor performance. It also induces a longitudinal magnetic anisotropy with the easy axis aligned to the magnetic flux direction. This alignment prevents the upper magnetic films from contributing to the total induction. Glass bonding is a viable method for achieving a completely planar inductor structure. The planar inductor with glass bonding shows excellent performance: inductance of 1.1 $\mu H$, Q factor of 7 (at 5 MHz), and the current capability up to 100 mA.

• The Journal of the Acoustical Society of Korea
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• v.33 no.2
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• pp.102-110
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• 2014

The effect of a bonding layer on the performance of a quarter-wave (${\lambda}/4$) mode PVDF ultrasound transducer having not only a piezoelectric layer but also a non-piezoelectric layer between two electrodes was analyzed. The equivalent circuit of a transmission line model by Kikuchi et al.[Sound of IEICE, 55-A, 331-338 (1981)] was introduced for the analysis. The validity of the model was confirmed by comparison with a KLM model for three postulated adhesion cases of a $80{\mu}m$ thick piezoelectric PVDF film to a copper (Cu) backer. The pulse-echo responses of five PVDF transducers, each fabricated with a different thickness ($5{\mu}m{\sim}20{\mu}m$) of the bonding layer, were measured and the results were compared with those by simulation. The two results were in good agreement with each other and it was noted that the effect of the bonding layer on the performance of the transducer could be analyzed by the Kikuchi model. In detail, the $20{\mu}m$ bonding layer decreased the center frequency and the bandwidth by about 19.7 % and 25.0 %, respectively, and increased the insertion loss by 57.2 %.