• Journal of IKEEE
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• v.17 no.3
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• pp.260-266
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• 2013

The open bit line is vulnerable to noise compared to the folded bit line when read/write for the DRAM. According to the increasing DRAM densities, the core circuit operating conditions is exacerbated by the noise when it comes to the open bit line 6F2(F : Feature Size) structure. In this paper, the interference effects were analyzed by the data patterns between the bit line by experiments. It was beyond the scope of existing research. 68nm Tech. 1Gb DDR2, Advan Tester used in the experiments. The noise effects appears the degrade of internal operation margin of DRAM. This paper investigates sense amplifier power line splits by experiments. The noise can be improved by 0.2ns(1.3%)~1.9ns(12.7%), when the sense amplifier power lines split. It was simulated by 68nm Technology 1Gb DDR2 modeling.

• Journal of IKEEE
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• v.20 no.2
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• pp.167-170
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• 2016

Replica bit-line technique is used for making enable signal of sense amplifier which accurately tracks bit-line of SRAM. However, threshold voltage variation in the replica bit-line circuit changes the cell current, which results in variation of the sense amplifier enable time, $T_{SAE}$. The variation of $T_{SAE}$ makes the sensing operation unstable. In this paper, in addition to conventional replica bit-line delay ($RBL_{conv}$), dual replica bit-line delay (DRBD) and multi-stage dual replica bit-line delay (MDRBD) which are used for reducing $T_{SAE}$ variation are briefly introduced, and the maximum possible number of on-cell which can satisfy $6{\sigma}$ sensing yield is determined through simulation at a supply voltage of 0.6V with 14nm FinFET technology. As a result, it is observed that performance of DRBD and MDRBD is improved 24.4% and 48.3% than $RBL_{conv}$ and energy consumption is reduced which 8% and 32.4% than $RBL_{conv}$.

• Journal of IKEEE
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• v.5 no.1 s.8
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• pp.43-51
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• 2001

As the density of memories increases, unwanted interference between cells and coupling noise between bit-lines are increased. And testing high-density memories for a high degree of fault coverage can require either a relatively large number of test vectors or a significant amount of additional test circuitry. So far, conventional test algorithms have focused on faults between neighborhood cells, not neighborhood bit-lines. In this paper, a new test algorithm for neighborhood bit-line sensitive faults (NBLSFs) based on the NPSFs(Neighborhood Pattern Sensitive Faults) is proposed. And the proposed algorithm does not require any additional circuit. Instead of the conventional five-cell or nine-cell physical neighborhood layouts to test memory cells, a three-cell layout which is minimum size for NBLSFs detection is used. Furthermore, to consider faults by maximum coupling noise by neighborhood bit-lines, we added refresh operation after write operation in the test procedure(i.e.,$write{\rightarrow}\;refresh{\rightarrow}\;read$). Also, we show that the proposed algorithm can detect stuck-at faults, transition faults, coupling faults, conventional pattern sensitive faults, and neighborhood bit-line sensitive faults.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.4
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• pp.74-84
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• 2003

Conventional test algorithms do not effectively detect faults by word-line and bit-line coupling noise resulting from the increase of the density of memories. In this paper, the possibility of faults caused by word-line coupling noise is shown, and new fault model, WLSFs(Word-Line Sensitive Fault) is proposed. We also introduce the algorithm considering both word-line and bit-line coupling noise simultaneously. The algorithm increases probability of faults which means improved fault coverage and more effective test algorithm, compared to conventional ones. The proposed algorithm can also cover conventional basic faults which are stuck-at faults, transition faults and coupling faults within a five-cell physical neighborhood.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.6
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• pp.1-8
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• 2000

In this paper, design of sense amplifier for a flash memory minimizing bit line disturbance due to common bit line is presented. There is a disturbance problem at output modes by using common bit line, when the external devices access an internal flash memory. This phenomenon is resulted form hot carrier between floating gates and bit lines by thin oxide thickness. To minimize bit line disturbance, lower it line voltage is required and need sense amplifier to detect data existence in lower bit line voltage. Proposed circuits is operated at lower bit line voltage and we fabricated a embedded flash memory MCU using 0.6u technology.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.266-269
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• 2000

As the device geometry continuously shrink down less than sub-quarter micrometer, DRAM makers are going to replace conventional tungsten-polycide with tungsten bit-line structure in order to reduce the chip size and use it as a local interconnection. In this paper we showed low resistance and leakage tungsten bit-line process with various RTP(Rapid Thermal Process) temperature. As a result we obtained that major parameters impact on tungsten bit-line process are RTP Anneal temperature and BF2 ion implantation dopant. These tungsten bit-line process are promising to fabricate high density chip technology.

• IEIE Transactions on Smart Processing and Computing
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• v.5 no.5
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• pp.310-318
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• 2016

Emerging technologies such as the Internet of Things (IoT) and the Advanced Driver Assistant System (ADAS) often have image transmission functions with tough constraints, like low power and/or low delay, which require that they adopt line-based, low memory compression methods instead of existing frame-based image compression standards. Bit rate control in the conventional frame-based compression systems requires a lot of hardware resources when the scope of handled data falls at the frame level. On the other hand, attempts to reduce the heavy hardware resource requirement by focusing on line-level processing yield uneven image quality through the frame. In this paper, we propose a bit rate control that maintains consistency in image quality through the frame and improves the legibility of text regions. To find the line characteristics, the proposed bit rate control tests each line for ease of compression and the existence of text. Experiments on the proposed bit rate control show peak signal-to-noise ratios (PSNRs) similar to those of conventional bit rate controls, but with the use of significantly fewer hardware resources.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.6
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• pp.17-24
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• 2004

This paper describes a novel bit line structure to minimize coupling noise induced by coupling capacitance between bit lines. In DRAMs coupling capacitance is inherently present bit lines. As in submicron process the bit line space gets narrower. bit line coupling capacitance increases and this increased coupling capacitance sharply raises cross-talk noise. In this paper using different layers of metal for adjacent bit lines has been tested to reduces cross-talk noise and a novel bit line structure capable of reducing capacitance is introduced and verified.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.12
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• pp.31-38
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• 2010

This paper presents the design of a graphic memory for QVGA-scale LCD Driver IC (LDI). The graphic memory is designed based on the pseudo-SHAM for the purpose of small area, and the memory cell structure is designed using a bit line partitioning method to improve sensing characteristics and drivabilties in the line-read operation. Also, a collision protection circuit using C-gate is designed to control collisions between read/write operations and self-refresh/line-read operations effectively. The graphic memory circuit has been designed in transistor level using $0.18{\mu}m$ CMOS technology library and the operations of the graphic memory have been verified using Hspice. The results show that the bit-bitb line voltage difference, ${\Delta}V$ increases by 40%, the charge sharing time between bit and bitb voltages $T_{CHGSH}$ decreases by 30%, and the current during line-read decreases by 40%.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.5
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• pp.375-381
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• 2001

As the device geometry continuously shrink down less than sub-quarter micrometer, DRAM makers are going to replace conventional tungsten-polycide bit-line with tungsten bit-line structure in order to reduce the chip size and use it as a local interconnection. In this paper we showed low resistance tungsten bit-line fabrication process with various RTP(Rapid Thermal Process) temperature and additional ion implantation. As a result we obtained that major parameters impact on tungsten bit-line process are RTP Anneal temperature and BF$_2$ ion implantation dopant. These tungsten bit-line process are promising to fabricate high density chip technology.