• Macromolecular Research
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• 제17권11호
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• pp.842-849
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• 2009

Polycarbonate (PC)/sulfonated polystyrene (SPS) ionomer/organoclay nanocomposites were prepared by a solution intercalation process using the SPS ionomer as a compatibilizer. The effect of an organoclay on the melt crystallization behavior of the ionomer compatibilized PC were examined by differential scanning calorimetry (DSC). The melt crystallization behavior of PC was dependent on the extent of organoclay dispersion. The effect of the ionomer loading and cation size on intercalation/exfoliation efficiency of the organoclay in PC/SPS ionomer matrix was also studied using wide angle X-ray diffraction (WAXD) and transmission electron microscopy (TEM). Dispersion of the organically modified clay in the polymer matrix improved with increasing ionomer compatibilizer loadings and cation size. The SPS ionomer compatibilized PC/organoclay nanocomposite showed enhanced melt crystallization compared to the SPS ionomer/PC blend. Well dispersed organoclay nanocomposites showed better crystallization than the poorly dispersed clay nanocomposites. These nanocomposites also showed better thermal stability than the SPS ionomer/PC blend.

• 한국염색가공학회지
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• 제27권1호
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• pp.11-17
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• 2015

Recently, super fiber reinforced composite materials are widely used in many industries due to high mechanical properties. In this study, 2 different types of composite materials were manufactured in order to compare their mechanical properties. Carbon and Aramid fibers were used for reinforcement materials and Bisphenol-A type epoxy resin was for matrix. Two kinds of fiber-reinforced materials were manufactured by RIM(Resin Injection Molding) method. Before manufacturing composite materials, the optimal manufacturing and curing process condition were established and the ratio of reinforcement to epoxy resin was discussed. FT-IR analysis was conducted to clarify the structure of epoxy resin. Thermal and mechanical property test were also carried out. The cross-section of composite materials was observed using a scanning electron microscope(SEM).

• 한국조명전기설비학회지:조명전기설비
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• 제5권2호
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• pp.77-83
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• 1991

비스페놀 A형 에폭시 수지에 $SiO_2$를 충진한 에폭시 복합재료의 단시간 절연파괴 특성을 충진제 첨가 함량의 변화, 주위온도(상온~[$190^{\circ}C$])의 변화 및 인가 전원의 종류별로 연구, 검토하였다. 연구결과, 절연파괴강도는 충진제 함량의 증가에 대해 일반적으로 감소하는 경향을 보였으며, 입자간 중심거리 d가 충진제함량이 증가함에 따라 감소하여 평균입자간격이 [$7.5\mu\textrm{m}$]이하가 되면 절연파괴 강도가 거의 일정한 값이 됨을 확인하였다. 또한, 교류전압을 인가하는 경우는 고온영역 ([$130^{\circ}C$]) 이상에서 충진된 에폭시수지가 무충진 에폭시수지보다 절연파괴강도가 증가하였다.

• 한국염색가공학회지
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• 제30권3호
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• pp.180-189
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• 2018

To study the effect of stereoisomeric structures of curing agents on curing behaviors, thermal and mechanical properties of epoxy resins, DGEBA(diglycidyl ether of bisphenol A) epoxy resin and 3,3'- and 4,4'-DDS(diaminodiphenyl sulfone) curing agents were selected. The curing initiation temperature and activation energy of DGEBA/3,3'-DDS was lower than DGEBA/4,4'-DDS. DGEBA/3,3'-DDS has a faster curing rate and higher degree of cure than DGEBA/4,4'-DDS, suggesting that 3,3'-DDS has higher reactivity than 4,4'-DDS. Tensile strength and fracture toughness of DGEBA/3,3'-DDS was lower than those of DGEBA/4,4'-DDS, indicating that mechanical properties of the epoxy resin can be different only by the stereoisomeric difference in chemical structure of the curing agent.

• 공업화학
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• 제10권4호
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• pp.615-619
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• 1999

스테아릴트리메틸암모늄 이온만 삽입된 몬모릴로나이트는 나노복합재료를 형성하지 못하였다. 그러나 스테아릴트리메틸암모늄과 m-페닐렌디암모늄 염이 함께 삽입된 몬모릴로나이트와 diglycidyl ether of bisphenol A(DGEBA)와 가열하면 중합반응이 일어나 폴리에테르-몬모릴로나이트의 나노복합재료를 합성하였다. 합성한 나노복합재료를 XRD과 TEM을 통하여 에폭시 메트릭스내의 몬모릴로나이트의 실리케이트층이 한층 균일하게 분산되어 있음을 확인하였다. 그리고 각각의 실리케이트 층간거리는 $250{\sim}500{\AA}$ 정도였다.

• 공업화학
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• 제5권4호
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• pp.737-742
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• 1994

유리섬유/탄소섬유/에폭시 수지 hybrid 복합재료의 파괴에너지를 파괴메카니즘 측면에서 연구하였다. 에폭시 수지 매트릭스는 DGEBA(diglycidyl ether of bisphenol A)-MDA(4,4'-methylene dianiline)-SN(succinonitrile)-HQ(hydroquinone)를 사용하였다. 섬유강화 복합재료의 파괴에너지를 연구한 결과, 유리섬유와 매트릭스의 계면에서는 post debond friction energy가 가장 크게 나타났으며, debonding energy와 pull-out energy는 비슷한 값을 나타내었다. 탄소섬유와 매트릭스의 계면에서 파괴가 일어나는 경우에는 pull-out energy가 가장 큰 영향을 나타내었다.

• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Journal of Information Display
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• 제12권1호
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• pp.23-27
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• 2011

The correlation between the temporal and spatial variations of the elastic constant and temperature change was examined for a light guide plate (LGP) adopted in the edge-lit light-emitting-diode backlight for mobile applications, using the micro- Brillouin light scattering method. The velocity of sound and the elastic constant $C_{11}$ of an LGP made from bisphenol-A polycarbonate (PC) were investigated as functions of temperature, time, and position on the LGP. The temporal variation of $C_{11}$ exhibited an exponential decay, while the spatial variation of $C_{11}$ reflected the temperature distribution on the LGP. The glass transition temperature of the PC LGP was found to be located at $155^{\circ}C$. The result showed that systematic transformation between the elastic property and the temperature is possible and that the temperature distribution on the bulk LGP can be accurately probed via the present experiment method, without using any special temperature measurement equipment.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.479-482
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• 1999

Cured epoxy resins are extensively used for the electrical insulation in high-voltage equipments. The bisphenol A-based epoxy resins lured with azine show, especially, good thermal properties and mechanical resistances. For the technical and economic reasons, varing amount of inorganic fillers are added to endow the required special properties. In the large generators and motors of power plants, epoxy insulation is disclosed to the harsh conditions like the superheated steam and abrupt temperature variation. Hygrothermal aging at elevated temperatures tends to induce degradation in epoxy resins. To predict the effect of this degradation in DGEBA/MDA/SN/zeolite system, we proceeded the forced moisture absorption experiment using the autoclave. The thermal properties of the untreated and treated specimens were analyzed by DSC and TGA under the nitrogen flowing condition. The moisture absorption results showed a weight increase during hygrothermal aging at 1207. At the initial aging period, the system leaded to more or less postcuring but more prolonged environmental aging leaded the discoloration of specimen and lowering the T$_{g}$./.

• 한국분말재료학회지
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• 제15권2호
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• pp.119-124
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• 2008

To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.