• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.242-247
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• 2009

On the Transient Liquid Phase Bonding (TLPB) phenomenon with the MBF-50 insert metal at narrow gap (under 100), it takes long time for the bonding and the homogenizing. Typically, isothermal solidification is controlled by the diffusion of depressed element of B and Si. However, the amount of B and Si in the MBF-50 filler metal is large. This is reason of the long bonding time. Also, the MBF-50 filler metal did not contained Al and Ti which are ${\gamma}^{\prime}$ phases former. This is reason of the long homogenizing time. From the bonding phenomenon with the MBF-50 insert metal, we search main factors on the bonding mechanism and select several insert-metals for using the wide-gap TLPB. New insert-metals contained Al and Ti which are ${\gamma}^{\prime}$ phases former and decrease the B then the MBF-50. When the new insert-metal was used on the TLPB, the bonding time was decreased about 1/10 times and homogenizing heat treatment was no needed. In spite of the without homogenizing, the volume fraction of ${\gamma}^{\prime}$ phases in the boned interlayer was equal to homogenizing heat treated specimen which was TLPB with the MBF-50. Finally, the new insert metal named WG1 for the wide-gap TLPB is more efficient then the MBF-50 filler metal without decreasing the bonding characteristic.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.78-81
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• 2004

A technical performance of the coating depends greatly on the thickness of painting film or coating film. Therefore the confirmed report of the technique to measure accurately is essential to the coating film thickness for the assessment about a coating quality performance. In this paper, two gap sensors - eddy current gap sensor and capacitance gap sensor - which has a different operating principle were used to measure the thickness of a nonmagnetic substance coating film such as paint, enamel or ceramic that was coated on the metallic material. A capacitance gap sensor was used to measure the distance between the sensor head and a coating film and an eddy current gap sensor to measure the distance between the sensor head and a base metal. Then the thickness of a coating film was obtained by the difference of two measurement value. At this result, the suggested dual sensor can measure an arbitrary film thickness to be coated on a base metal as the measurement value of coating thickness exists accurately within the 2％ error.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.127-128
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• 2006

The proposed differential LC cross-coupled VCO is implemented in InGap/GaAs HBT process for an adaptive Global Positioning system(GPS) application. Two filtering capacitors are used at the base of output buffer amplifiers at the both sides of the core m order to improve phase noise characteristics. The VCO produced a phase noise of -133 dBc/Hz at 3MHz offset frequency from the carrier frequency of 1.489GHz and the second harmonic suppression is significantly suppresed up to -49dBc/Hz in simulation result. The three pairs of BC diodes are integrated m the tank circuit to increase the VCO Tunning range.

• Journal of Conservation Science
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• v.25 no.3
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• pp.293-298
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• 2009

We fabricated the gap-filling material for antic-ceramics restoration which were made up polyvinyl butyral (butvar) base and silane system additive in iso-propyl solvent. This was made hardness control possible that user want. And it have very strong adhesion and shear strength properties and is shown the best properties for pigment filling, anti-contractibility, coloring as like epoxy system materials. Particularly, the yellowing and ir-reversibility problem in Epoxy restoration material were finally steadiness. So, there is guarantee in the eternity and stabilization of restoration for antic-celamics. And in order to show the reversible state of the restoration, we successfully dissolve this polyvinyl butyral gap-filling materials in solvent after perfect restoring the Punchong plate from sam-chun temple site subsequently.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.379-382
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• 2002

GaAs has wide band gap, Therefore that malarial can used high Temperature application. in this paper explain to current-voltage characteristics of thermal effect. we experiment on thermal test of current-voltage characteristics and gate leakage current with real device. As a result, we propose a current-volatage characteristics model. that model base on gate leakage current, and gate leakage current influence gate source voltage.

• The Journal of Korean Academy of Prosthodontics
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• v.38 no.3
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• pp.310-320
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• 2000

Statement of the problem. The record base in fabricating procedures of the complete denture, as a temporary form for reproducing denture base, is used to record upper and lower jaw relation and to align artificial teeth and try-in it in the mouth. The accuracy of jaw relation record is affected by the accuracy, stiffness and stability of the record base. So, the accuracy of record base is the most important requirements of jaw relation records. Purpose of study. The purpose of this study was to evaluate the gap that occurred over the palatal area of a maxillary record base fabricated with autopolymerizing resin and light-curing resin. Methods/material. The maxillary record bases were fabricated out of autopolymerizing resin that is used the most frequently in clinics and light-curing resin that attracts special attention for its several merits. The light-curing resin was made by two kinds of polymerization methods, which are one step curing method and multiple step curing method. All record bases were cut in certain positions of the master cast 1 hour and 1 day later after fabrication and the accuracy of the master cast was measured and analyzed with a microscope. Results. A pattern of gap formation between the record base and the maxillary cast was observed in all specimens. According to kinds of resins, autopolymerizing resin was significantly more accurate than light-curing resin. There was no statistical difference according to time lapse, and in all three groups, the maximum discrepancy occurred at the posterior border in the mid-palatal region. Conclusion. The autopolymerizing resin is better than light-curing resin, and multiple step curing method is more accurate than one step curing method when using light-curing resin.

• Journal of Korea Society of Industrial Information Systems
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• v.21 no.2
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• pp.39-44
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• 2016

Using the welding current and voltage signal processing, we have studied the influence that the diameter of the welding wire to the welding quality detection. For the experiments, We have analyzed the signal with respect to large and small artificially a gap between base materials than the welding wire. In this experiment, the 1.2 mm diameter of the welding wire was used, and distance between the welding base materials was respectively 1.0 mm and 2.0 mm. In the welding with a large defect than the diameter of the welding wire it was able to detect a change in the welding current and welding voltage. But it could not detect a change in the welding current and welding voltage in the welding has a small defect than the welding wire diameter.

• Journal of Welding and Joining
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• v.25 no.5
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• pp.45-50
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• 2007

The Ni-base superalloy GTD111 DS is used in the first stage blade of high power land-based gas turbines. Advanced repair technologies of the blade have been introduced to the gas turbine industry over recent years. The effect of the filler metal powder on Transient Liquid Phase bonding phenomenon and tensile mechanical properties was investigated on the GTD111 DS superalloy. At the filler metal powder N series, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid filler metal powder was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solids in the bonded interlayer grew from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The bond strength of N series filler metal powder was over 1000 MPa. and ${\gamma}'$ phase size of N series TLP bonded region was similar with base metal by influence of Ti, Al elements. At the insert metal powder M series, the Si element fluidity of the filler metal was good but microstructure irregularity on bonded region because of excessive Si element. Nuclear of solids formed not only from the base metal near the bonded interlayer but also from the remained filler metal powder in the bonded interlayer. When the isothermal solidification was finished, the content of the elements in the boned interlayer was approximately equal to that of the base metal. But boride and silicide formed in the base metal near the bonded interlayer. And these boride decreased with the increasing of holding time. The bond strength of M series filler metal powder was about 400 MPa.

• Journal of Welding and Joining
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• v.25 no.3
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• pp.64-71
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• 2007

The dissolution phenomenon of the solid phase powder and base metal by liquid phase insert metal during Transient Liquid Phase bonding using the mixed powder composed of the modified GTD111(base metal) powder and the GNi3 (Ni-l4Cr-9.5Co-3.5Al-2.5B) powder was investigated. In case of the mixed powder contains modified GTD111 powder 50wt%, all of the powder was melted by liquid phase at 1423K. At the temperature between solidus and liquidus of GNi3, liquid phase penetrated into the boundary of the modified GTD111 powder and solid particle separated from powder was melted easily because area of reaction was increased. With increasing mixing ratio of the modified GTD111, it needed the higher temperature to melt all of the modified GTD111 powder. During Transient Liquid Phase bonding using the mixed powder composed of the modified GTD111 50wt% and GNi3 50wt% as insert metal, width of the bonded interlayer was increased with increasing bonding temperature by reaction of the base metal and liquid phase in insert metal. Dissolution of the base metal and modified powder by liquid phase progressed all together and after all of the powder was melted nearly, the dissolution of the base metal occurred quickly.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.6
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• pp.504-511
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• 2008

This study evaluated the influence of the strength mismatch of HAZ for a plastic ${\eta}$-factor, which is the principle parameter determining the plastic portion of J-integral to assess the fracture toughness of the weldment. The specimen of tensile and hardness test was manufactured from the piping applying narrow-gap welding, and the mechanical properties of weldment, HAZ and a base metal were obtained. To perform the finite element analysis according to the ratio of strength mismatch, the material properties was chosen with the change of strength using the determination method of Ramberg-Osgood constant. Also, the influence of the strength mismatch of HAZ was determined using finite element analysis by those properties.