• 한국결정성장학회지
• /
• 제10권4호
• /
• pp.337-343
• /
• 2000

사파이어 ($\alpha$-Al$_2$O$_3$) 단결정에 있어 prism plane slip {11$\bar{2}$0}1/3{$\bar{1}$120} 전위속도를 에치-피트 방법으로 측정하였다. 전위속도 측정시 온도범위는 $1150^{\circ}C$에서 $1400^{\circ}C$까지 였으며, 응력범위는 140 MPa에서 250 MPa까지였다. 얻어진 전위속도의 온도 및 응력 의존성에 대해 검토하였다. 전위속도의 온도의존성을 이용하여 prism plane slip 전위속도를 위한 활성화에너지를 구하였으며, 그 값은 대략 4.2$\pm$0.4 eV이었다. 또한, 전위속도의 응력의존성을 나타내는 응력지수 m은 4.5$\pm$0.8이었다. 한편, 전위속도 측정을 통해 사파이어 단결정에서 basal 면이 3-fold 대칭을 가진다는 사실을 재확인하였다.

• 한국재료학회지
• /
• 제10권11호
• /
• pp.784-788
• /
• 2000

The Vickers microhardness was measured on the basal (0001) plane of sapphire single crystals in the temperature range from 25$^{\circ}C$to 1000$^{\circ}C$. The substructure surrounding the indents was investigated using selective chemical polishing and etching, optical microscopy, and trasmission electron microscopy (TEM). At room temperature, cracks were predominant, and at intermediate temperatures (400$^{\circ}C$and 600$^{\circ}C$), extensive rhombohedral twinning was observed. On the other hand, at higher temperatures, prism plane slip bands on prism plane {1120}(원문참조) were dominant in the microstructure. TEM observations revealed that the dislocation substructure at the vicinity of the indents consisted of fairly straight dislocations lying in basal and/or prism planes and aligned along the <1100> and <1120> directions. The details of the glide dissociation of perfect <110> screw dislocations into three collinear 1/3<1100> partials on the prism plane and the Peierls potential for sapphire single crystals were discussed.

• 한국재료학회지
• /
• 제26권11호
• /
• pp.656-661
• /
• 2016

4H- and 6H-SiC grown by physical vapor transport method were investigated by transmission electron microscopy (TEM). From the TEM diffraction patterns observed along the [11-20] zone axis, 4H- and 6H-SiC were identified due to their additional diffraction spots, indicating atomic stacking sequences. However, identification was not possible in the [10-10] zone axis due to the absence of additional diffraction spots. Basal plane dislocations (BPDs) were investigated in the TEM specimen prepared along the [10-10] zone axis using the two-beam technique. BPDs were two Shockley partial dislocations with a stacking fault (SF) between them. Shockley partial BPDs arrayed along the [0001] growth direction were observed in the investigated 4H-SiC. This arrayed configuration of Shockley partial BPDs cannot be recognized from the plan view TEM with the [0001] zone axis. The evaluated distances between the two Shockley partial dislocations for the investigated samples were similar to the equilibrium distance, with values of several hundreds of nanometers or even values as large as over a few micrometers.

• 한국재료학회지
• /
• 제11권4호
• /
• pp.278-282
• /
• 2001

사파이어($\alpha$-$Al_2$$O_3$) 단결정에 있어 basal slip (0001)1/3<1120>의 부분전위의 재결합거동을 알아보기 위해 prism plane (1120)의 사파이어 재료를 사용하여 4점 곡강도 시험을 행하였다. 이 굽힘시험은 온도 $1200^{\circ}C$~$1400^{\circ}C$에서 그리고 응력은 90MPa, 120MPa, 150MPa에서 행하여졌다 굽힘시험 동안 basal전위가 이동하기 위해 잠복기가 필요하였다. 실험온도 범위내에서 잠복기의 활성화에너지는 5.6-6.0eV이었으며, 이 잠복기는 자체-상승운동으로 분해된 부분전위들이 재결합하는데 필요한 시간인 것으로 추정되었다. 한편, 이 활성화에너지는 $Al_2$$O_3$에 있어 산소의 자체 확산을 위한 에너지 (대fir 6.3eV)와 거의 일치하였다. 이 결과를 통하여, 두 부분전위들의 재결합은 부분전위사이 적층결함으로 산소 자체확산에 의해 제어되는 것으로 여겨진다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1995년도 추계학술대회 논문집
• /
• pp.81-84
• /
• 1995

A reliable bonding between two silicon wafers, regularly grooved and non-grooved, was done by the direct boning technology, It is Presented that high structural duality was realized not only at the bended interface but in the bulk, commensurate with the filling of artificial grooves, which would be attributed to the dislocation-gettering capability of groove free-surfaces during annealing. The groove filling would be explained with mass-transport phenomena assisted by the dislocation movement from initial contact boundaries toward groove surfaces. Intrinsic voids can be easily removed by aid of the grooves. The proposed method yielded also an intimate bonding not only between {111} wafers strongly misoriented and slightly inclined to {111} basal plane but even between {111} and {100} orientation wafers.

• Applied Microscopy
• /
• 제36권3호
• /
• pp.155-163
• /
• 2006

합성 사파이어 기판 시료-GaN반도체의 성장기판으로 사용된-의 내재하는 결함 형태를 전통적인 투과식 전자현미경 조사기법 (TEM), LACBED, HAADF-STEM 방법으로 관찰 분석하였다. 이 시료에서 주로 발견된 결함들은 두께 ${\sim}2nm$에서 32nm를 가진(0001)면 미소 쌍정(basal microtwins), 모체 결정과의 계면 주위의 변형 결함, (0001)면 전위결함(basal dislocations), 그리고 {$2\bar{1}\bar{1}3$} 피라미드 미끄럼면 중 한 면에서 일어나는 복잡한 형태의 전위 결함들이다 이들(0001)면 및 {$2\bar{1}\bar{1}3$}면에 전위 결함들은 미소 쌍정과 강하게 관련되어 일어나는 것으로 보인다. 또한 전위결함 밀도는 매우 균일하지 않으며 수 ${\mu}m$의 크기의 결함 밀집 영역에서는 그 밀도가 ${\sim}10^{10}/cm^2정도만큼 높지만 시료 전체에서의 평균은 대체적으로 ${\sim}10^5/cm^2보다 작다. 이 값은 보통 합성되는 결정에서 평균적으로 예상되는 수치이다.

• 소성∙가공
• /
• 제17권1호
• /
• pp.13-18
• /
• 2008

Mg and Mg alloys are promising materials for light weight high strength applications. In this paper, grain refinement of pure Mg using severe plastic deformation was tried to enhance the mechanical properties of the hard-to-deform metallic material. The microstructure and the mechanical properties of Mg processed by equal channel angular pressing(ECAP) at various processing temperatures were investigated experimentally. ECAP with channel angle of $90^{\circ}$ and corner angle of $0^{\circ}$ was successful at $300^{\circ}C$ without fracture of the samples during the processing. The hardness of the ECAP processed Mg decreased with increasing ECAP processing temperature. The effect of temperature on the hardness and microstructure of the ECAP processed Mg were explained by the dislocation glide in the basal plane and non-basal slip systems and by the dynamic recrystallization and recovery.

• 대한금속재료학회지
• /
• 제49권6호
• /
• pp.454-461
• /
• 2011

In this study, the relationship between corrosion resistance and microstructural characteristics such as grain size reduction, preferred orientation, and homogenous distribution of elements and impurity by mechanical milling of magnesium powder was investigated. Mechanical milling of pure magnesium powder exhibited a complex path to grain refinement and growth together with preferred orientation reversal with milling time. It was also found that anisotropic formation of dislocation on the basal plane of magnesium was initially the dominant mechanism for grain size reduction. After 60 hrs of milling, grain coarsening was observed and interpreted as a result of the strain relaxation process through recrystallization. In spite of the finer grain size and strong (002) texture developed in the sample prepared by spark plasma sintering at $500^{\circ}C$ for 5 min after mechanical milling for 2hrs, the sample showed a higher corrosion rate. The results from this study will be helpful for better understanding of the controlling factor for corrosion resistance and behaviors of mechanical milled magnesium powders.