• Title/Summary/Keyword: bare

Search Result 1,486, Processing Time 0.024 seconds

A study on the behavior of frost formation according to surface characteristics in the fin-tube heat exchanger (핀-관 열교환기의 표면특성에 따른 착상 거동에 관한 연구)

  • 류수길;이관수
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
    • /
    • v.11 no.3
    • /
    • pp.377-383
    • /
    • 1999
  • In this study, the behavior of frost formation according to surface characteristics in the fin-tube heat exchanger has been examined experimentally. The results show that the thickness of the frost which is attached to the hydrophilic heat exchanger becomes thin and the air pressure drop is smaller than that of bare aluminium heat exchanger However, the frost mass of hydrophilic heat exchanger is more than the bare one. Hence, high density frost is attached to hydrophilic heat exchanger. The sensible and latent heat flux of hydrophilic heat exchanger is bigger than that of bare one, but the increasing amount is very small and the improvement of thermal performance is also very small. The variation of fin-pitch of heat exchanger shows little influence on frost formation and hydrophilic heat exchanger loses its surface characteristics rapidly with increasing relative humidity.

  • PDF

Characteristic of Heat and Mass Transfer on Inner Ribbed Notched Fin Tube Absorber (내면가공 핀튜브 흡수기의 열 및 물질전달특성)

  • 설원실;권오경;문춘근;정용옥;윤정인
    • Journal of Advanced Marine Engineering and Technology
    • /
    • v.24 no.4
    • /
    • pp.478-485
    • /
    • 2000
  • An experimental study of the absorption process of water vapor into lithium bromide solution was performed. For the purpose of development of high performance absorption chiller-heater utilizing Lithium Bromide solution as working fluid, the absorber is the most effective to improve the performance of an absorber because it requires the largest heat transfer area in an absorption chiller-heater system. This paper introduces bare tube and inner ribbed notched fin tube for the absorber of absorption chiller-heaters. Inner ribbed notched fin tube has about 10∼20% higher heat and mass transfer performance than bare tube conventionally used in absorbers and the it is expected to perform high heat and mass transfer. This paper will provide important information on the selection of absorber tubes in commercial absorption chill-heaters.

  • PDF

A study of defrosting behavior according to surface characteristics in a fin-tube heat exchanger (표면 특성에 따른 휜-관 열교환기의 제상 거동에 관한 연구)

  • Lee, Kwan-Soo;Kim, Jun-Mo;Ji, Sung
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
    • /
    • v.11 no.6
    • /
    • pp.921-927
    • /
    • 1999
  • In this study, the defrosting behaviors according to the surface characteristics in the fin-tube heat exchanger is experimentally examined. It is found that the draining rate of the hydrophilic and hydrophobic heat exchangers are evenly dispersed during defrosting, compared with that of the bare one. It is caused by the high density frost for the hydrophilic heat exchanger, and surface characteristic for the hydrophobic heat exchanger, respectively. The rest period of the hydrophilic and hydrophobic heat exchangers are shorter and their weight of residual water are smaller than those of the bare heat exchanger The hydrophilic and hydrophobic heat exchangers are more effective than the bare one in terms of defrosting efficiency, and the hydrophobic heat exchanger is better than the hydrophilic one.

  • PDF

Fabrication Processes of Interconnection Systems for Bare Chip Burn-In Tests Using Epitaxial Layer Growth and Etching Techniques of Silicon (실리콘 에피층 성장과 실리콘 에칭기술을 이용한 Bare Chip Burn-In 테스트용 인터컨넥션 시스템의 제조공정)

  • 권오경;김준배
    • Journal of the Korean institute of surface engineering
    • /
    • v.28 no.3
    • /
    • pp.174-181
    • /
    • 1995
  • Multilayered silicon cantilever beams as interconnection systems for bare chip burn-in socket applications have been designed, fabricated and characterized. Fabrication processes of the beam are employing standard semiconductor processes such as thin film processes and epitaxial layer growth and silicon wet etching techniques. We investigated silicon etch rate in 1-3-10 etchant as functions of doping concentration, surface mechanical stress and crystal defects. The experimental results indicate that silicon etch rate in 1-3-10 etchant is strong functions of doping concentration and crystal defect density rather than surface mechanical stress. We suggested the new fabrication processes of multilayered silicon cantilever beams.

  • PDF

A Theoretical Study on the Low Transition Temperature of VO2 Metamaterials in the THz Regime

  • Kyoung, Jisoo
    • Current Optics and Photonics
    • /
    • v.6 no.6
    • /
    • pp.583-589
    • /
    • 2022
  • Vanadium dioxide (VO2) is a well-known material that undergoes insulator-to-metal phase transition near room temperature. Since the conductivity of VO2 changes several orders of magnitude in the terahertz (THz) spectral range during the phase transition, VO2-based active metamaterials have been extensively studied. Experimentally, it is reported that the metal nanostructures on the VO2 thin film lowers the critical temperature significantly compared to the bare film. Here, we theoretically studied such early transition phenomena by developing an analytical model. Unlike experimental work that only measures transmission, we calculate the reflection and absorption and demonstrate that the role of absorption is quite different for bare and patterned samples; the absorption gradually increases for bare film during the phase transition, while an absorption peak is observed at the critical temperature for the metamaterials. In addition, we also discuss the gap width and VO2 thickness effects on the transition temperatures.

Wind-lens turbine design for low wind speed

  • Takeyeldein, Mohamed M.;Ishak, I.S.;Lazim, Tholudin M.
    • Wind and Structures
    • /
    • v.35 no.3
    • /
    • pp.147-155
    • /
    • 2022
  • This research proposes a wind-lens turbine design that can startup and operate at a low wind speed (< 5m/s). The performance of the wind-lens turbine was investigated using CFD and wind tunnel testing. The wind-lens turbine consists of a 3-bladed horizontal axis wind turbine with a diameter of 0.6m and a diffuser-shaped shroud that uses the suction side of the thin airfoil SD2030 as a cross-section profile. The performance of the 3-bladed wind-lens turbine was then compared to the two-bladed rotor configuration while keeping the blade geometry the same. The 3-bladed wind-lens turbine successfully startup at 1m/s and produced a torque of 66% higher than the bare turbine, while the two-bladed wind-lens turbine startup at less than 4m/s and produced a torque of 186 % higher than the two-bladed bare turbine at the design point. Findings testify that adding the wind-lens could improve the bare turbine's performance at low wind speed.

The Study on the Embedded Active Device for Ka-Band using the Component Embedding Process (부품 내장 공정을 이용한 5G용 내장형 능동소자에 관한 연구)

  • Jung, Jae-Woong;Park, Se-Hoon;Ryu, Jong-In
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.28 no.3
    • /
    • pp.1-7
    • /
    • 2021
  • In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (Pin) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.

Bare Wafer Inspection using a Knife-edge Test

  • Lee, Jun-Ho;Kim, Yong-Min;Kim, Jin-Seob;Yoo, Yeong-Eun
    • Journal of the Optical Society of Korea
    • /
    • v.11 no.4
    • /
    • pp.173-176
    • /
    • 2007
  • We present a very simple and efficient bare-wafer inspection method using a knife-edge test. The wafer front surface and inner structures are inspected simultaneously. The wafer front surface is inspected visually using a knife-edge test while the inner structure is simultaneously inspected by a camera in the infrared region with a single white-light source. This paper presents a laboratory implementation of the test method with some experimental results.

High Transmittance of the Glass Coated by the PMMA Mixed with Silica Gel

  • Bae, Hong-Sub;Park, Jong-Ku;Lee, H.R.;Kim, Do-Hyeong;Rhee, Il-Su
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2006.08a
    • /
    • pp.1390-1393
    • /
    • 2006
  • The transmittance of bare glass was enhanced up to about 20% by coating it with a PMMA (Poly Methyl Meta Acrylate) film mixed with silica gel. This lowrefractive- index film greatly reduces total reflection inevitable for bare glass, and thus will be useful for increasing the coupling-out efficiency of OLED.

  • PDF

Bare-ware inspection method using knife-edge optical test (칼날 측정법을 이용한 베어 웨이퍼 검사 방법)

  • Lee, Jun-Ho;Kim, Yong-Min;Kim, Jin-Seop;Hwang, Byeong-Mun
    • Proceedings of the Optical Society of Korea Conference
    • /
    • 2007.07a
    • /
    • pp.65-66
    • /
    • 2007
  • We present a new simple and fast bare-wafer inspection method. This method inspects the wafer front surface and inner structures simultaneously. The wafer surface is inspected using a knife-edge test in visible while the inner structure is inspected by a looking-through camera in infrared, at the same time and with a single white-light source. This paper presents a laboratory implementation of the test method with some experimental results.

  • PDF