• Journal of the Korean Electrochemical Society
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• v.11 no.1
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• pp.47-50
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• 2008

A new anode composition material comprising of SiO and Graphite has been prepared by adopting High energy ball milling (HEBM) technique. The anode material shows high initial charge and discharge capacity values of 1139 and 568 mAh/g, respectively. The electrode sustains reversible discharge capacity value of 719 mAh/g at 30th cycle with a high coulombic efficiency${\sim}99%$. Since the materials formed during initial charge process the nano silicon/$Li_4SiO_3$ and $Li_2O$ remains as interdependent, it may be expected that the composite exhibiting higher amount of irreversibility$(Li_2O)$ will deliver higher reversible capacity. In this study, constant current-constant voltage (CC-CV) charge method was employed in place of usual constant current (CC) method in order to convert efficiently all the SiO particles which resulted high initial discharge capacity at the first cycle. We improved considerably the initial discharge specific capacity of SiO/G composite by pretreatment(CC-CV).

• Journal of the Korean Magnetics Society
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• v.7 no.1
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• pp.13-18
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• 1997

The effects of the various raw material composition and sintered temperature on the physical properties of Ni-Zn ferrite have been investigated. They turned out to be spinel structure by X-ray diffraction and the size of grain from microscope was from 6 ${\mu}{\textrm}{m}$ to 16 ${\mu}{\textrm}{m}$. As the sintering temperature was increased from 1030 $^{\circ}C$ to 1070 $^{\circ}C$, the initial permeability and magnetic induction has increased and the both of Q factor and coercive force has decreased. The coercive force and curie temperature were almost the same at each specimen. Their values were about 0.20 Oe and 220 $^{\circ}C$. The frequency of specimen will used in the range from 400 kHz to 20 MHz. The basic composition of $Ni_{0.14}Zn_{0.64}Cu_{0.22}Fe_2O_4$ (specimen B) sintered at 1050 $^{\circ}C$ shows the best results at magnetic induction($B_r & B_m$).

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.306-306
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• 2008

기계적 에너지를 전기적 에너지로 변환하는 에너지 변환소자인 압전 세라믹스는 액추에이터, 변압기, 초음파모터, 초음파 소자 및 각종 센서로 응용되고 있으며, 그 응용분야는 크게 증가하고 있다. 최근에는 이러한 압전 소자를 앞으로 도래하는 ubiquitous, 무선 모바일 시대의 휴대용 전자제품, robotics, MEMS 분야 등의 대체 에너지원으로 응용하기 위한 연구가 진행되고 있다. 특히 인간의 걷기 운동 등과 같은 일상적인 동작으로 필요한 전력을 얻을 수 있고, 세라믹 소자를 이용하기 때문에 전자노이즈가 발생되지 않을 뿐 아니라 반영구적으로 사용할 수 가 있어서, 기존 이차전지를 대체 또는 보완 할 수 있는 방안도 검토되고 있다. PZT계 세라믹스는 높은 유전상수와 우수한 압전특성으로 전자세라믹스 분야에서 가장 널리 사용되어지고 있지만 $1200^{\circ}C$ 이상의 높은 소결온도 때문에 $1000^{\circ}C$ 부근에서 급격히 휘발되는 PbO로 인한 환경오염과 기본조성의 변화로 인한 압전 특성의 저하가 문제시 되고 있다. 또한 적층 세라믹스의 제작 시 구조적 특성상 내부전극이 도포된 상태에서 동시 소결이 필요한데, 융점이 낮은 Ag전극 대신 값비싼 Pd나 Pt가 다량 함유된 Ag/Pd, Ag/Pt 전극이 사용되고 있어 경제성이 떨어지는 단점을 갖게 된다. 순수 Ag 전극을 사용하거나 Ag의 비율이 높은 내부전극을 사용하기 위해서는 $900^{\circ}C$ 이하에서 소결되고 우수한 전기적 특성을 보이는 압전 세라믹스를 개발 하는 것이 필요하다. 따라서 본 연구에서는 압전특성이 우수한 $(Pb_{1-x}Cd_x)(Ni_{1/3}/Nb_{2/3})_{0.25}(Zr_{0.35}/Ti_{0.4})O_3$ 계의 조성을 설계하고, 소걸온도를 낮추기 위해서 2 단계 하소법을 이용하였다. 또한 $MnCO_3$, $SiO_2$, $Pb_3O_4$ 등을 소량 첨가하여 액상 소결 특성을 부여하여 소결 온도를 감소시키려는 시도도 하였다. 분말을 볼 밀링 (ball milling)을 통해 24시간 동안 혼합하고, 혼합된 분말은 $800^{\circ}C$에서 2시간 동안 하소하였다. 하소한 분말을 다시 72시간 동안 볼 밀링 하여 최종 분말을 얻었다. 최종 분말에 PVB를 첨가하여 직경 15mm의 디스크 형태로 성형한 후, 850~$975^{\circ}C$ 범위에서 온도를 변화시키면서 소결을 하였다. 최종 분말 및 소결된 시편을 XRD분석을 통하여 상을 확인하였고, SEM을 이용하여 미세조직을 관찰 하였다. 전기적 특성을 평가하기 위하여 두께를 1mm로 연마한 시편에 Ag 전극을 도포하여 $650^{\circ}C$에서 열처리한 후, 분극처리 하였다. 압전특성은 $d_{33}$-meter로 측정하였고, impedance analyzer를 이용하여 압전 특성 (전기기계결합계수 및 기계적품질계수)을 측정 하였다. 또한 강유전체 특성 평가 장치 (Precision-LC)를 이용하여 분극-전계 특성을 평가하였다. 이상의 연구를 통하여 소결 온도가 $900^{\circ}C$인 경우에서도 양호한 압전 특성을 확보 할 수 있었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.346-346
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• 2007

압전세라믹 재료는 현재 압전 변압기, actuator, transducer, sensor, speaker 등에 광범위하게 이용이 되고 있다. 이 중에서 압전세라믹 소결체를 이용한 스피커의 제조는 가공이 까다롭고, 대형의 크기로 제작 시 소자가 깨지는 등의 많은 제약을 받고 있으며, 저음 특성이 떨어져 응용 범위가 한정되어 있다. 따라서 최근에는 이러한 단점을 극복하기 위하여 세라믹/고분자 복합체를 이용한 필름 스피커를 제작하고자 시도하고 있다. 이러한 세라믹/고분자 0-3형 압전 복합체를 이용할 경우, 제품의 경량화를 실현할 수 있고, 크기나 환경의 영향을 거의 받지 않으므로, 고기능성 스피커로의 응용에 적합할 것으로 보인다. 따라서 본 연구에서는 PZT계의 세라믹와 PVDF, PVDF-TrFE, Polyester, acrylic resin 등의 여러 고분자 물질과의 복합체를 제조하여 압전특성을 평가하였다. 본 실험은 먼저 $(Pb_{1-a-b}Ba_aCd_b)(Zr_xTi_{1-x})_{1-c-d}(Ni_{1/3}Nb_{2/3})_c(Zn_{1/3}Nb_{2/3})_dO_3$ (이하 PZT라 표기)의 최적화 조성을 선택하여, $1050^{\circ}C$에서 소결된 분말을 48시간 ball milling방법 로 약 $1{\mu}m$ 크기로 분쇄하였다. 고분자 물질들은 알맞은 용제들을 선택하여 녹였다. 그 다음 소결된 PZT분말과 고분자를 50:50, 60:40, 65:35, 70:30등의 무게 분율로 혼합하고, 분산제, 소포제 등을 첨가하여 3단 roll mill을 이용하여 충분히 분산시켜 페이스트 (Paste)를 제조하였다. 제조된 페이스트를 ITO가 코팅된 PET필름 위에 스크린 프린팅 법을 사용하여 인쇄하여 $120^{\circ}C$에서 5분간 건조하였다. 코팅된 복합체의 두께는 약 $80{\mu}m$ 정도로 측정되었다. Ag 페이스트를 이용한 상부 전극 형성에도 스크린 프린팅 법을 적용하였다. 이를 $120^{\circ}C$에서 4 kV/mm의 DC 전계로 분극 공정을 수행한 후 전기적 특성을 평가하였다. 유전특성을 조사하기 위해서 LCR meter (EDC-1620)를 사용하였고, 시편의 결정구조는 XRD (Rigaku; D/MAX-2500H)을 통해 분석하였으며, 전자현미경(SEM)을 이용하여 미세구조를 분석하였다. 압전 전하상수$(d_{33})$ 값은 APC 8000 모델을 이용하여 측정하였다. PZT의 혼합비가 증가할수록 비유전율 및 압전 전하 상수 등의 전기적 특성이 증가되었다. 또 여러 고분자 물질 중에서 PVDF-TrFE 수지가 가장 우수한 특성을 보였다. 이는 PVDF-TrFE 수지가 압전성을 나타내기 때문인 것으로 판단되었다.

• Korean Journal of Materials Research
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• v.31 no.2
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• pp.75-83
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• 2021

To cope with automobile exhaust gas regulations, ISG (Idling Stop & Go) and charging control systems are applied to HEVs (Hybrid Electric Vehicle) for the purpose of improving fuel economy. These systems require quick charge/discharge performance at high current. To satisfy this characteristic, improvement of the positive electrode plate is studied to improve the charge/discharge process and performance of AGM(Absorbent Glass Mat) lead-acid batteries applied to ISG automotive systems. The bonding between grid and A.M (Active Material) can be improved by applying the Sand-Blasting method to provide roughness to the surface of the positive grid. When the Sand-Blasting method is applied with conditions of ball speed 1,000 rpm and conveyor speed 5 M/min, ideal bonding is achieved between grid and A.M. The positive plate of each condition is applied to the AGM LAB (Absorbent Glass Mat Lead Acid Battery); then, the performance and ISG life characteristics are tested by the vehicle battery test method. In CCA, which evaluates the starting performance at -18 ℃ and 30 ℃ with high current, the advanced AGM LAB improves about 25 %. At 0 ℃ CA (Charge Acceptance), the initial charging current of the advanced AGM LAB increases about 25 %. Improving the bonding between the grid and A.M. by roughening the grid surface improves the flow of current and lowers the resistance, which is considered to have a significant effect on the high current charging/discharging area. In a Standard of Battery Association of Japan (SBA) S0101 test, after 300 A discharge, the voltage of the advanced AGM LAB with the Sand-Blasting method grid was 0.059 V higher than that of untreated grid. As the cycle progresses, the gap widens to 0.13 V at the point of 10,800 cycles. As the bonding between grid and A.M. increases through the Sand Blasting method, the slope of the discharge voltage declines gradually as the cycle progresses, showing excellent battery life characteristics. It is believed that system will exhibit excellent characteristics in the vehicle environment of the ISG system, in which charge/discharge occurs over a short time.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.5
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• pp.191-198
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• 2022

Zirconia and titanium alloys, which are mainly used for dental implant materials, have poor osseointegration and osteogenesis abilities due to their bioinertness with low bioactivity on surface. In order to improve their surface bioinertness, surface modification with a bioactive material is an easy and simple method. In this study, akermanite (Ca₂MgSi₂O₇), a silicate-based bioceramic material with excellent bone bonding ability, was synthesized by a solid-state reaction and investigated its bioactivity from the analysis of surface dissolution and precipitation of hydroxyapatite particles in SBF solution. Calcium carbonate (CaCO₃), magnesium carbonate (MgCO₃), and silicon dioxide (SiO₂) were used as starting materials. After homogeneous mixing of starting materials by ball milling and the drying of at oven, uniaxial pressing was performed to form a compacted disk, and then heat-treated at high temperature to induce the solid-state reaction to akermanite. Bioactivity of synthesized akermanite disk was evaluated with the reaction temperature from the immersion test in SBF solution. The higher the reaction temperature, the more pronounced the akermanite phase and the less the surface dissolution at particle surface. It resulted that synthesized akermanite particles had high bioactivity on particle surface, but it depended on reacted temperature and phase composition. Moderate dissolution occurred at particle surfaces and observed the new precipitated hydroxyapatite particles in synthetic akermanite with solid-state reaction at 1100℃.

• Clean Technology
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• v.29 no.3
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• pp.178-184
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• 2023

Transition metal chalcogenides have garnered significant attention as anode materials for sodium-ion batteries due to their high theoretical capacity. Nevertheless, their practical application is impeded by their limited lifespan resulting from substantial volume expansion during cycling and their low electrical conductivity. To tackle these issues, this study devised a solution by synthesizing a nanostructured anode material composed of porous CNT (carbon nanotube) spheres and (Ni,Co)Se₂ nanocrystals. By employing spray pyrolysis and subsequent heat treatments, a porous-structured (Ni,Co)Se₂-CNT composite microsphere was successfully synthesized, and its electrochemical properties as an anode for sodium-ion batteries were evaluated. The synthesized (Ni,Co)Se₂-CNT microsphere possesses a porous structure due to the nanovoids that formed as a result of the decomposition of the polystyrene (PS) nanobeads during spray pyrolysis. This porous structure can effectively accommodate the volume expansion that occurs during repeated cycling, while the CNT scaffold enhances electronic conductivity. Consequently, the (Ni,Co)Se₂-CNT anode exhibited an initial discharge capacity of 698 mA h g^-1 and maintained a high discharge capacity of 400 mA h g^-1 after 100 cycles at a current density of 0.2 A g^-1.

• Journal of the Korean Society of Food Culture
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• v.5 no.1
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• pp.59-75
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• 1990

The tzeam is the one of steaming cook that boiled the main material of poultry. meat and the sub-material of vegetables. It is always setted on the main-table in above seven chup ban sang and also kyoja sang. In this thesis, according to the kinds of tzeam in the main material of poultry, meat was to analysis reference frequency to them the materials, the measuring unit of materials, the terms of cooking and kitchen utensil by 47 books published in Korea from 1420 to 1987. 1. It was 37 kinds of tzeam in the main material of poultry, meat. 2. Materials were classified into the main-material, sub-materials, seasioning and decorations. 3. There were 43 kinds of measuring units, of them 18 kinds were for volume, 12 kinds were for quantity, 4 kinds were for length and the rest measuring units were 9 kinds. 4. There were 26 kinds of kitchen utensil for cooking. They were mainly used a hab 1 rice ball with lids, and castles (cast iron castle). 5. There were 27 kinds of cooking terms. The terms of them, 11 kinds were for heating methods, 16 terms of them were for the cutting process.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.