• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.145-148
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• 2003

Recently, the recycle of CMP (chemical mechanical polishing) slurries have been positively considered in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in CMP process. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are one of the most important components. Especially, the abrasive particles of slurry are needed in order to achieve a good removal rate. However, the cost of abrasives, is still very high. In this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slury, As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• Transactions on Electrical and Electronic Materials
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• v.7 no.3
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• pp.112-117
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• 2006

In this paper we present that the effects of polymer adsorption on stabilities and CMP performance of ceria abrasive particles. Characterization of ceria abrasive particles in the presence of poly(vinyl pyrrolidone) (PVP) was performed by the measurements of adsorbed amounts of PVP, average sizes, and the back scattering intensities of the ceria abrasive particles as functions of PVP molecular weight and PVP concentration. The ceria abrasive particles in the presence of PVP were used to polish $SiO_2\;and\;Si_3N_4$ films deposited on Si wafers in order to understand the effect of PVP adsorption on chemical mechanical polishing (CMP) performance, together with ceria abrasive particles without PVP. Adsorption of PVP on the ceria abrasive particles enhanced the stability of ceria abrasive particles due to steric stabilization of the thick adsorbed layer of PVP. Removal rates of the deposited $SiO_2\;and\;Si_3N_4$ films by the ceria abrasive particles in the presence of PVP were much lower than those in the absence of PVP and their magnitudes were decreased with an increase in the concentration of free PVP chains in the dispersion media. This suggests that the CMP performance in the presence of PVP could be mainly controlled by the hydrodynamic interactions between the adsorbed PVP chains and the free ones. Moreover, the molecular weight dependence of PVP on the removal rates of the deposited films was hardly observed. On the other hand, high removal rate selectivity between the deposited films in the presence of PVP was not observed.

• Journal of the Korean Society of Safety
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• v.26 no.2
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• pp.13-19
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• 2011

The magnetic polishing is the useful method to finish using magnetic power of magnet. That method is one of precision polishing techniques and has an aim of the clean technology using for the pure of gas and inside of the clean pipe. The magnetic abrasive polishing method is not so common for machine that it is not spreaded widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper deals with development of the magnetic abrasive using Sr-Ferrite. In this development, abrasive grain GC used to resin bond fabricated low temperature. And Sr-Ferrite of magnetic abrasive powder fabricated that Sr-Ferrite was crused into 200 mesh. The XRD analysis result show that only GC abrasive and Sr-Ferrite crystal peaks detected which explains resin bond was not any more chemical reaction. From SEM analysis it is found that GC abrasive and Sr-Ferrite were strong bonding with each other by bond. The magnetic polishing is performed by polishing the surface of pipe by attracting magnetic abrasives with magnetic fields. This can be widely applied for finishing machinery fabrications such as various pipes and for other safety processes. In this paper, we could have investigated in to the changes of the movement of magnetic abrasive grain. In reference to this result, we could have made the experiment which is set under the condition of the magnetic flux density, polishing velocity according to the form of magnetic brush.

• Journal of Biosystems Engineering
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• v.34 no.6
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• pp.439-445
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• 2009

This study was performed to investigate the optimum abrasive and friction milling ratio. This was accomplished by determining changes in the quality, such as whiteness, moisture content, broken kernel, unstripped embryo rate, and surface characteristics or milling difference, during an abrasive and friction based milling process. When only abrasive was milled, the increase of whiteness was fast in the first milling, whereas the increasing rate of whiteness was small in the latter milling. The decreasing rate of moisture content and broken kernel increased as the friction milling ratio was increased. Combining with the friction milling was considered a suitable method because the unstripped embryo rate was high only when abrasive milling was used. In the case of a high abrasive milling ratio, a significant milling difference was observed in the initial milling. This indicated that the milling difference was not completely eliminated despite using friction milling in the latter milling. Consequently, it was necessary to minimize the milling difference in the initial milling. When milling quality was synthetically considered, the abrasive milling ratio was varied from 20~50%. When the abrasive milling ratio was greater than 40%, the external quality of the rice milled deteriorated since holes and defects generated on the surface in the initial milling were not removed. Due to this deterioration in surface characteristics, an abrasive milling ratio of 30% was identified as a suitable level.

• Tribology and Lubricants
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• v.27 no.1
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• pp.34-39
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• 2011

In this study, finite element analysis of particle-surface collision using 2-dimensional elements was performed to observe the effects of abrasive size and impact angle. The result of the simulation on the change in abrasive size revealed that larger abrasive particle induced larger contact stress due to force transfer through slurry fluid as the particle moved and pushed the fluid. This observation brought an important finding that the slurry fluid could make the workpiece surface soften and then change the mechanical properties of the surface layer such as elastic modulus and yield strength. As for the impact angle, it was found that the contact stress increased with the angle of impact and jumped up at a specific angle. Such result would be attributed to the complex effects of the impact velocity and angle.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.199-200
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• 2002

Three-body abrasive wear resistance of mild steel, low alloy steel (Bisalloy) and 27%Cr white cast iron was investigated using a ball-cratering test. Glass beads, silica sand, quartz and alumina abrasive particles with sizes larger than $100{\mu}m$ were used to make slurries. It was found that the wear rates of all three materials tested increased with time when angular abrasive particles were used and were rather constant when round particles were used. This increase in wear rates was mainly due to the gradual increase in ball surface roughness with testing time. Abrasive particles with higher angularity caused higher ball surface roughness. Mild steel and Bisalloy were more affected by this ball surface roughness changes than the hard white cast iron. Generally, three-body rolling wear dominated. The contribution of two-body grooving wear increased when the ball roughness was significant. More grooves were found when round particles were used or the size of the particles was decreased.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.7
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• pp.569-573
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• 2012

We investigated the speed change of the diamond spherical abrasive during the substrate surface polishing under the pad compression by using classical molecular dynamics modeling. We performed three-dimensional molecular dynamics simulations using the Morse potential functions for the copper substrate and the Tersoff potential function for the diamond abrasive. As the compressive pressure increased, the indented depth of the diamond abrasive increased and then, the speed of the diamond abrasive along the direction of the pad moving was decreased. Molecular simulation result such as the abrasive speed decreasing due to the pad pressure increasing gave important information for the chemical mechanical polishing including the mechanical removal rate with both the pad speed and the pad compressive pressure.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.11
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• pp.551-555
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• 2004

In this paper, in order to reduce the high COO (cost of ownership) and COC (cost of consumables), we have collected the silica abrasive powders by filtering method after subsequent CMP (chemical mechanical polishing) process for the purpose of abrasives recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size distribution and FE-SEM (field emission-scanning electron microscope) measurements of abrasive powders. It was annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable rate of removal and good planarity with commercial products. Consequently we can expect the saving of high cost slurry.

• Nuclear Engineering and Technology
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• v.43 no.5
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• pp.469-476
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• 2011

The inner surfaces of bundled inconel tubes from steam generators in South Korean nuclear power plants are contaminated with cobalt and abrasive blasting equipment has been developed to efficiently remove the cobalt. The principal parameters related to the efficient removal using this equipment are the type of abrasive, the distance from the nozzle, and the blasting time. Preliminary tests were performed using oxidized inconel samples which enabled the simulation of cobalt removal from the radioactive inconel samples. The oxygen in the oxidized samples and the cobalt in the radioactive inconel were removed more effectively using the blasting distance, blasting time, and a silicon carbide abrasive. Using the developed abrasive blasting equipment, the optimum decontamination conditions for radioactive inconel samples were blasting for more than 6 minutes using silicon carbides under 5 atmospheric pressures.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.22-29
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• 2004

As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.