• Journal of the Institute of Electronics Engineers of Korea TC
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• v.42 no.5 s.335
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• pp.23-28
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• 2005

Recently, new concept, NP(Network Processor) was emerged into communication systems to cope with the various service requirements from Internet users. NP is an unique promising technique to capable of implementing of the packet processing in wire-speed and providing the flexibility for supporting the newly network services, having satisfied with implementation using hardware and software respectively in past, This paper deals with the implementation techniques and evaluation results of the line card capable to do packet forwarding function with packet processing power of wire-speed and applicable to various physical interfaces. There are several interfaces of POS, Gigabit ethernet and EPON in E-OLT(EPON Optical Line Terminal) system of PATH(Photonic Access To Home) network. Therefore, the E-OLT's packet forwarding engine have to support various subscriber's interface in wire speed. Our system is implemented the subscriber's card in daughter board and the setup procedure is done by system firmware based on the module's identifier acquired from installed physical board.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.11
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• pp.1144-1149
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• 2009

This paper deals with the time synchronization problem over SpaceWire links. SpaceWire is a standard for high-speed links and networks between spacecraft components, which was invented for better, cheaper, faster on-board data handling in spacecraft. The standard defines Time-Code for time distribution over SpaceWire network. When a Time-Code is transmitted, transmission delay and jitter is unavoidable. In this paper, a mechanism to remove Time-Code transmission delay and jitter over SpaceWire links is proposed and implemented with FPGA for validation. The proposed mechanism achieves high resolution clock synchronization over SpaceWire links, complies with the standard and can be easily adopted over SpaceWire network.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.4
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• pp.101-110
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• 2004

Flight and Qualification Models of Single Board Computer (SBC), called On-Board Computer (OBC), for HAUSAT-l picosatellite, which is scheduled to launch on September, 2004 by Russian "Dnepr" launch vehicle, have been developed. The OBC of HAUSAT-1 has been designed with some improved features compared to other picosatellites. A multifunctional controller and up-to-date SPI (Serial Peripheral Interface) and 1-Wire interface are implemented to simplify the harness routing and to minimize the mass and size of OBC. The improved fault-tolerant architecture design methodology is incorporated in the HAUSAT-1 OBC to protect against space radiation environment. The functions of the OBC were fully tested and verified by the Electrical Test Bed (ETB) model. This paper is also addressing the environmental test results, such as random vibration and thermal vacuum tests.

• Journal of Korean Tunnelling and Underground Space Association
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• v.19 no.3
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• pp.533-549
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• 2017

In this study, drainage systems were proposed to drain the leakage of groundwater in the existing underground concrete structures. The system consists of drainage board, wire mesh, fixed nail, and mortar with mineral. In order to increase constructability, the drainage board and wire mesh were attached on the surface of cement concrete using the air nailer and fixed nail. The mortar with 30% of blast furnace slag was sprayed on the drainage board and wire mesh using the spray mortar equipment. The field test construction was carried out in a conventional concrete lining tunnel and concrete retaining wall for performance verification of the drainage system in the field. There was no problem with performance degradation in the drainage system for three years after construction. The bond strength tests were performed on the sprayed mortar at 14 days and about 3 years after field test construction. In case of attaching the wire mesh on the drainage board, the bond strengths of the sprayed mortar were 1.04 MPa at 14 days and 1.46 MPa about 3 years. In case of the drainage board without the wire mesh, the bond strengths of the sprayed mortar were 1.13 MPa at 14 days and 0.89 MPa, less than 1 MPa of bond strength criteria, about 3 years.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.53-58
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• 2008

In this study, we fabricated embedded IC (Double Pole Double throw switch chip) polymer substrate and evaluate it for 2.4 GHz WiFi application. The switch chips were laminated using FR4 and ABF(Ajinomoto build up film) as dielectric layer. The embedded DPDT chip substrate were interconnected by laser via and Cu pattern plating process. DSC(Differenntial Scanning Calorimetry) analysis and SEM image was employed to calculate the amount of curing and examine surface roughness for optimization of chip embedding process. ABF showed maximum peel strength with Cu layer when the procuring was $80\sim90%$ completed and DPDT chip was laminated in a polymer substrate without void. An embedded chip substrate and wire-bonded chip on substrate were designed and fabricated. The characteristics of two modules were measured by s-parameters (S11; return loss and S21; insertion loss). Insertion loss is less than 0.55 dB in two presented embedded chip board and wire-bonded chip board. Return loss of an embedded chip board is better than 25 dB up to 6 GHz frequency range, whereas return loss of wire-bonding chip board is worse than 20 dB above 2.4 GHz frequency.

• Journal of the Korea Society of Computer and Information
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• v.21 no.3
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• pp.9-15
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• 2016

In this paper, DC-PLC typed one-wire controller was designed and manufactured especially for In-vehicle safe devices. One-wire by DC-PLC scheme is to be used as a power supply and ground to process the sensor data and to operate the vehicle actuators. To avoid complicate wires, we use the conventional wires without installing extra communication lines. The data collected from the sensors are transmitted to the main controller, processed by programming, and run the actuators corresponding to the commands sending to vehicle control board. The proposed method shows that only One-wire without requiring several wires make In-vehicle control devices simple and reduce the damage due to the loss of the wiring.

• Journal of the Korean Wood Science and Technology
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• v.18 no.4
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• pp.9-17
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• 1990

When manufacturing beam by laminating particleboards, the mechanical properties of particleboad-laminated beam would be also improved if the properties, especially mechanical properties of particleboad be reinforced. In this study, steel wires were used to reinforce particleboard. This study was carried out to obtain the basic mechanical properties of the board composed of wood particle and steel wires, focusing on bending strength which is the important factors in laminated beam and it was tried to estimate the relationship between the properties of the particleboard-laminated beam. and the proportion of steel wires to wood particles in particleboards. The result obtained can be summarized as follows: 1. The more steel wires used in boards, the higher value of modulus of rupture in bending was obtained, For example. the density 5 board composed of 14 numbers of steel wires showing 55% improved value than control board. 2. The board with lower density was also made better in higher value of elasticity, the density 0.5 board with 14 numbers of steel wires improved by 170%, the density 0.6 board by 86%, the 0.7 board by 37% and the 0.8 board by 26%. 3. The work to maximum load was improved with more steel wires. for example, the density 0.8 board with 14 numbers of steel wires improved by 31%.

• Design & Manufacturing
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• v.10 no.1
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• pp.19-25
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• 2016

Connectors are very important components that transmit electric signals to different parts. It must maintain intensity of the connector to prevent defects from impact and maintain contact to transmit electric signals. Most of the external parts of the connector, which act as the main framework, are formed by injection molding. However, bend deformation occurs for injection molded products due to the residual stress left inside the product after product molding. When the bend deformation is large, it does not come into complete contact when being assembled with other parts, which leads to connector contact intensity not being properly maintained. In result, the main role of the connector, which is to transmit electric signals, cannot be performed. In order to address this problem, this study conducted bend deformation cause analysis through bend deformation analysis to predict and prevent bend deformation of housings and wafers, which are injection molded products of pressure welded connectors that are normally applied in compact mobile and display products. Bend deformation analysis was carried out by checking the charging time, pressure distribution and temperature distribution through wire to board connector wafer and housing injection molding analysis. Based on the results of the bend deformation analysis results, the cause of the bend deformation was analyzed through deformation resulting from disproportional cooling, deformation resulting from disproportional contraction, and deformation resulting from ingredient orientation. In result, it was judged that the effects for bend deformation were biggest due to disproportional contraction for both the pressure welded connector wafer and housing.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.5-8
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• 1999

In this paper, we suggest a way of implementing ISDN S-Interface through two-wire premises telephone networks instead of using four wires as in the existing ISDN systems. This will help many developing or underdeveloped countries in the world to introduce ISDN services, where they have only two or low wires as in-building telephone networks. We suggest new physical-layer specifications for two-wire S-interface similar to that in ITU-T recommendations I.430 for four-wire systems, design a tranceiver according to the suggested specifications, and implement it using an FPGA We build a test board with the chip on it and succeed in connecting to Internet.

• Journal of The Institute of Information and Telecommunication Facilities Engineering
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• v.8 no.1
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• pp.36-39
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• 2009

In this paper, we propose a 4-wire type driving circuit for resistive touch panel which was manufactured at the lab. The circuit is designed by using the touch panel controller ADS7846 and AVR microcontroller board. The test result shows that the designed circuit can give and transmit the position information of touch panel to the computer.