• Title/Summary/Keyword: Wet $SiO_2$

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Comparison of Etching Rate Uniformity of $SiO_2$ Film Using Various Wet Etching Method ($SiO_2$막의 습식식각 방법별 균일도 비교)

  • Ahn, Young-Ki;Kim, Hyun-Jong;Sung, Bo-Ram-Chan;Koo, Kyo-Woog;Cho, Jung-Keun
    • Journal of the Semiconductor & Display Technology
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    • v.5 no.2 s.15
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    • pp.41-46
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    • 2006
  • Wet etching process in recent semiconductor manufacturing is devided into batch and single wafer type. Batch type wet etching process provides more throughput with poor etching uniformity compared to single wafer type process. Single wafer process achieves better etching uniformity by boom-swing injected chemical on rotating wafer. In this study, etching characteristics of $SiO_2$ layer at room and elevated temperature is evaluated and compared. The difference in etching rate and uniformity of each condition is identified, and the temperature profile of injected chemical is theoretically calculated and compared to that of experimental result. Better etching uniformity is observed with single wafer tool with boom-swing injection compared to single wafer process without boom-swing or batch type tool.

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Fabrication of $BaTiO_3-PTCR$ Ceramic Resister Prepared by Direct Wet Process (습식 직접합성법을 이용한 PTCR 소자개발 연구)

  • 이경희;이병하;이희승
    • Journal of the Korean Ceramic Society
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    • v.22 no.4
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    • pp.61-65
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    • 1985
  • $BaTiO_3$ powders doped with $BaTiO_3$ and $Nb_2O_5$ at 9$0^{\circ}C$ for 1hr. were synthesized by Direct Wet Process. These powders were very homogeneous and fine particle size. To obtain the highe PTCR effect AST($1/3Al_2O_3$.$3/4SiO_2$.$1/4TiO_2$) and $MnO_2$ were added in the semiconduc-ting $BaTiO_3$. In this case $Bi_2O_3$ and $MnO_2$ were used in the form of $Bi(NO)_3$ and $MnCl_2$.$4H_2O$ solution for Direct Wet Process. $BaTiO_3$ doped Nb2O5 and $MnO_2$ demostrated greater PTCR effect than $BaTiO_3$ doped $Nn_2O_5$ only.

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Study of The SiC CMOS Gate Oxide (SiC CMOS 게이트 산화막에 관한 연구)

  • 최재승;이원선;신동현;김영석;이형규;박근형
    • Proceedings of the IEEK Conference
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    • 2001.06b
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    • pp.29-32
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    • 2001
  • In this paper, the thermal oxidation behaviors and the electrical characteristics of the thermal oxide grown on SiC are discussed. For these studies the oxide layers with various thickness were on SiC in wet $O_2$ or dry $O_2$ at l15$0^{\circ}C$ and the MOS capacitors using the 350$\AA$ gate oxide grown in wet $O_2$ were fabricated and electrically characterized. It was found from the experimental results that the oxidation rate of SiC with the Si-face and with the carbon-face were about 10% and 50% of oxidation rate of Si. The C-V measurement results of the SiC oxide showed abnormal hysterisis properties which had ever been not observed for the Si oxide. And the hysterisis behavior was seen more significant when initial bias voltage was more negative or more positive. The hysterisis property of the SiC oxide was believed to be due the substantial amount of the deep level traps to exist at the interface between the oxide and the SiC substrate. The leakage of the SiC oxide was found to be one order larger than the Si oxide, but the breakdown strength was almost equal to that of the Si oxide.

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Development of sacrificial layer wet etch process of TiNi for nano-electro-mechanical device application

  • Park, Byung Kyu;Choi, Woo Young;Cho, Eou Sik;Cho, Il Hwan
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.13 no.4
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    • pp.410-414
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    • 2013
  • We report the wet etching of titanium nickel (TiNi) films for the production of nano-electro-mechanical (NEM) device. $SiO_2$ and $Si_3N_4$ have been selected as sacrificial layers of TiNi metal and etched with polyethylene glycol and hydrofluoric acid (HF) mixed solution. Volume percentage of HF are varied from 10% to 35% and the etch rate of the $SiO_2$, $Si_3N_4$ and TiNi are reported here. Within the various experiment results, 15% HF mixed polyethylene glycol solution show highest etch ratio between sacrificial layer and TiNi metal. Especially $Si_3N_4$ films shows high etch ratio with TiNi films. Wet etching results are measured with SEM inspection. Therefore, this experiment provides a novel method for TiNi in the nano-electro-mechanical device.

Preparation and Structural Analysis of Cao-SiO2 Gel by Sol-Gel Method (졸 겔 법을 이용한 Cao-SiO2계 겔의 합성 및 구조분석)

  • Lee, Tae-Hyung;Lee, Su-Jeong;Hwang, Yeon;Kim, Ill-Young;Ohtsuki, Chikara;Cho, Sung-Baek
    • Journal of the Korean Ceramic Society
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    • v.45 no.10
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    • pp.644-650
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    • 2008
  • It has been proposed that the Cao-$SiO_2$ binary system can be good basic composition of bioactive glasses and glass-ceramics. In the present study, various kinds of Cao-$SiO_2$ gels were prepared by sol-gel method in order to control the microstructure which are related to their dissolution rate, induction period of apatite formation in body environment. Characterization of the gels were done by wet chemical analysis, SEM observation, FT-IR spectroscopy and XRD. The gelation time decreased with CaO content. However, the volume of all the dried gel decreased to 50% of the wet gels irrespective of increasement of CaO content. All the Cao-$SiO_2$ gels were amorphous and contained a large amount of silanol groups on their surfaces after heat treatment up to $800^{\circ}C$. The interconnected structure of the gel changed to agglomerated spherical powders when Ca content exceed to 20 mol%. Most of the Cao-$SiO_2$ gel showed amorphous when heat-treated up to $900^{\circ}C$. However, quartz and cristobalite was produced when heat-treated at $1000^{\circ}C$ and resultant microstructure of the gel contained microporous structure.

Effect of La and Si Addition on Thermal Stabilization of Alumina (La 및 Si 첨가에 의한 알루미나의 열안정화 효과)

  • Lee, Chae-Hyun;Lim, Dae-Young;Kim, Jong-Ock;Seo, Doo-Won;Han, Moon-Hee
    • The Journal of Engineering Research
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    • v.3 no.1
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    • pp.215-222
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    • 1998
  • The effect of La and Si addition of the thermal stabilization of $\gamma-alumina$ powers have been studied. Reagent grade $La(NO_3)_3{\cdot}6H_2O$ and $Si(OC_2H_5)_4$ were used as starting materials. These additives were introduced by wet impregnation method. Both La and Si additives suppressed the sintering of alumina and were found to be good thermal stabilizers of $\gamma-alumina$. Especially, Si drastically suppressed the phase transition of alumina at high temperatures. The major mechanisms for the thermal stabilization of alumina were seemed to be new phase formation and retardation of surface diffusion by addition of La or Si into alumina matrix.

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Effects of Gate Insulators on the Operation of ZnO-SnO2 Thin Film Transistors (ZnO-SnO2 투명박막트랜지스터의 동작에 미치는 게이트 절연층의 영향)

  • Cheon, Young Deok;Park, Ki Cheol;Ma, Tae Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.3
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    • pp.177-182
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    • 2013
  • Transparent thin film transistors (TTFT) were fabricated on $N^+$ Si wafers. $SiO_2$, $Si_3N_4/SiO_2$ and $Al_2O_3/SiO_2$ grown on the wafers were used as gate insulators. The rf magnetron sputtered zinc tin oxide (ZTO) films were adopted as active layers. $N^+$ Si wafers were wet-oxidized to grow $SiO_2$. $Si_3N_4$ and $Al_2O_3$ films were deposited on the $SiO_2$ by plasma enhanced chemical vapor deposition (PECVD) and atomic layer deposition (ALD), respectively. The mobility, $I_{on}/I_{off}$ and subthreshold swing (SS) were obtained from the transfer characteristics of TTFTs. The properties of gate insulators were analyzed by comparing the characteristics of TTFTs. The property variation of the ZTO TTFTs with time were observed.

The Effect of Surface Roughness on SiC by Wet Chemical Etching (SiC 표면 거칠기에 미치는 습식식각의 영향)

  • Kim, Jae-Kwan;Jo, Young-Je;Han, Seung-Cheol;Lee, Hae-Yong;Lee, Ji-Myon
    • Korean Journal of Metals and Materials
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    • v.47 no.11
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    • pp.748-753
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    • 2009
  • The surface morphology and the surface roughness of n-type SiC induced by wet-treatment using 45% KOH and buffered oxide etchant (BOE-1HF : $6H_2O$) were investigated by atomic force microscopy (AFM). While Si-face of SiC could be etched by alkali solutions such as KOH, acidic solutions such as BOE were hardly able to etch SiC. When the rough SiC samples were used, the surface roughness of etched sample was decreased after wet-treatment regardless of etchant, due to the planarization the of surface by widening of scratches formed by mechanical polishing. It was observed that the initial etching was affected by the energetically unstable sites, such as dangling bond and steps. However, when a relatively smooth sample was used, the surface roughness was rapidly increased after treatment at $180^{\circ}C$ for 1 hr and at room temperature for 4 hr by using KOH solution, resulting from the nano-sized structures such as pores and bumps. This indicates that porous SiC surface can be achieved by using purely chemical treatment.

SiO2 Doped Sapphire single Crystal Growth by Verneuil Method (Verneuil법에 의한 $SiO_2$를 첨가한 Sapphire 단결정 성장)

  • Cho, H.;Orr, K.K.;Choi, J.K.;Park, H.S.
    • Journal of the Korean Ceramic Society
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    • v.29 no.10
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    • pp.822-826
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    • 1992
  • SiO2 doped sapphire single crystals were grown by Verneuil method using feed material which prepared by adding SiO2 in Al2O3. Crystal growing were attempted with varing doping amount of SiO2 from 0.01 to 1.0 wt% and when the doping amount of SiO2 were 0.01~0.04 wt%, single crystals could be attained. Starting materials for feed powder were 99.99% purity alumina and extra pure SiO2 powder. Mixing these two materials by wet milling for 24 hours and drying the mixture and then was calcined at 900~110$0^{\circ}C$ for 2~4 hours. The grown crystals had yellowish color and were somewhat transparent. During growing process the flow range of oxygen was 5~7.5ι/min and of hydrogen was 13~25ι/min, the average growth rate was 7.0~11 mm/hr. The pressure of gases were fixed at 5psi. The color of crystal was appeared and mechanical property of sapphire was developed by doping of SiO2.

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