• Proceedings of the KSME Conference
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• 2004.04a
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• pp.240-245
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• 2004

Tensile properties of hard coating material, TiN, were evaluated using micro-tensile testing system. TiN has been known as a hard coating material commonly used today. Micro-tensile testing system consisted of a micro tensile loading system and a micro-ESPI(Electronic Speckle Pattern Interferometry) system. Micro-tensile loading system had a maximum load capacity of 500mN and a resolution of 4.5 nm in stroke. TiN thin film $1{\mu}m$ thick was deposited on the Si wafer pre-deposited of $Si_3N_4$ film substrate by the closed field unbalanced magnetron sputtering (CFUBMS) process. Three kinds of micro-tensile specimen with the respective width of $50{\mu}m$, $100{\mu}m$ and $500{\mu}m$ were fabricated by MEMS process. The mechanical properties including tensile strength and elastic modulus were determined using the micro-tensile testing system and compared by those obtained by nano-indentation

• Journal of Electrical Engineering and information Science
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• v.2 no.5
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• pp.17-26
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• 1997

Interconnect characterization on a wafer level was performed. Test patterns for single, two-coupled, and triple-coupled lines ere designed by using 0.5$\mu\textrm{m}$ CMOS process. Then interconnect capacitances and resistances were experimentally extracted by using tow port network measurements, Particularly to eliminate parasitic effects, the Y-parameter de-embedding was performed with specially designed de-embedding patterns. Also, for the purpose of comparisons, capacitance matrices were calculated by using the existing CAD model and field-solver-based commercial simulator, METAL and MEDICI. This work experimentally verifies that existing CAD models or parameter extraction may have large deviation from real values. The signal transient simulation with the experimental data and other methodologies such as field-solver-based simulation and existing model was performed. as expected, the significantly affect on the signal delay and crosstalk. The signal delay due to interconnects dominates the sub-micron-based a gate delay (e.g., inverter). Particularly, coupling capacitance deviation is so large (about more than 45% in the worst case) that signal integrity cannot e guaranteed with the existing methodologies. The characterization methodologies of this paper can be very usefully employed for the signal integrity verification or he electrical design rule establishments of IC interconnects in the industry.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.12
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• pp.591-596
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• 2006

we have been developed on the ultra high concentration ozone generator system which is the core technology in the realization of the semiconductor photoresist strip process using the ozone-vapor chemistry. The proposed ozone generator system has the structure of the surface discharge type which adopt the high purity ceramic dielectric tube. We investigate the performance of the proposed ozone generator system experimentally and the results show that the system has very high ozone concentration characteristics of $19.7[wt%/O_2]$ at the flow rate of $0.3[{\ell}/min]$ of each discharge cell. As a result of the silicon wafer photoresist strip test, we obtained the strip rate of about 400[nm/min] at the ozone concentration of $16[wt%/O_2]$ and flow rate of $8[{\ell}/min]$. So, we confirmed that it's possible to use the proposed high concentration ozone generator system for the ozone-vapor photoresist strip process in the semiconductor and FPD industry.

• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.245-247
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• 2002

The paper represents the effects of the drive-in process parameters on the residual stress profile of the p+ silicon film. For the quantitative determination of the residual stress profiles, the test samples are doped via the fixed boron diffusion process and four types of the thermal oxidation processes and consecutively etched by the improved process. The residual stress measurement structures with the different thickness are simultaneously fabricated on the same silicon wafer. Since the residual stress profile is not uniform along the direction normal to the surface, the residual stress is assumed to be a polynomial function of the depth. All of the coefficients of the polynomial are determined from the deflections of cantilevers and the displacement of a rotating beam structure. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual tensile stress decreases. Also, near the surface of the p+ film the residual tensile stress is transformed into the residual compressive stress and its magnitude increases.

• Tribology and Lubricants
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• v.33 no.3
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• pp.92-97
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• 2017

The understanding of the friction characteristics of micro-textured surface is of great importance to enhance the tribological properties of nano- and micro-devices. We fabricate rectangular patterns with submicron-scale structures on a Si wafer surface with various pitches and heights by using a focused ion beam (FIB). In addition, we fabricate tilted rectangular patterns to identify the influence of the tilt angle ($45^{\circ}$ and $135^{\circ}$) on friction behaviour. We perform the friction test using lateral force microscopy (LFM) employing a colloidal probe. We fabricate the colloidal probe by attaching a $10{\pm}1-{\mu}m$-diameter borosilicate glass sphere to a tipless silicon cantilever by using a ultraviolet cure adhesive. The applied normal loads range between 200 nN and 1100 nN and the sliding speed was set to $12{\mu}m/s$. The test results show that the friction behavior varied depending on the pitch, height, and tilt angle of the microstructure. The friction forces were relatively lower for narrower and deeper pitches. The comparison of friction force between the sub-micro-structured surfaces and the original Si surface indicate an improvement of the friction property at a low load range. The current study provides a better understanding of the influence of pitch, height, and tilt angle of the microstructure on their tribological properties, enabling the design of sub-micro- and micro-structured Si surfaces to improve their mechanical durability.

• Journal of Biomedical Engineering Research
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• v.37 no.5
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• pp.168-177
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• 2016

In this paper we present an implantable pressure sensor to measure real-time blood pressure by monitoring mechanical movement of artery. Sensor is composed of inductors (L) and capacitors (C) which are formed by microfabrication and direct bonding on two biocompatible substrates (quartz). When electrical potential is applied to the sensor, the inductors and capacitors generates a LC resonance circuit and produce characteristic resonant frequencies. Real-time variation of the resonant frequency is monitored by an external measurement system using inductive coupling. Structural and electrical simulation was performed by Computer Aided Engineering (CAE) programs, ANSYS and HFSS, to optimize geometry of sensor. Ultrafast laser (femto-second) cutting and MEMS process were executed as sensor fabrication methods with consideration of brittleness of the substrate and small radial artery size. After whole fabrication processes, we got sensors of $3mm{\times}15mm{\times}0.5mm$. Resonant frequency of the sensor was around 90 MHz at atmosphere (760 mmHg), and the sensor has good linearity without any hysteresis. Longterm (5 years) stability of the sensor was verified by thermal acceleration testing with Arrhenius model. Moreover, in-vitro cytotoxicity test was done to show biocompatiblity of the sensor and validation of real-time blood pressure measurement was verified with animal test by implant of the sensor. By integration with development of external interrogation system, the proposed sensor system will be a promising method to measure real-time blood pressure.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.21 no.1
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• pp.223-228
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• 2017

In this paper, we are proposing an optimal design of wideband pulsed type gamma-ray sensors. These sensors were manufactured based on the design results and after word electrical properties were analyzed. The sensor input parameters were derived on the basis of pulsed gamma-ray spectrum and time-dependent energy rate, and the output current which were derived on the basis of the sensor sensitivity control circuit. Pulsed gamma-ray sensors were designed using the TCAD simulators. The design results show that the optimal Epi layer thickness is 45um with the applied voltage 3.3V and the diameter is 2.0mm. The doping concentrations are as follows : N-type is an Arsenic as $1{\times}10^{19}/cm^3$, P-type is a Boron as $1{\times}10^{19}/cm^3$ and Epi layer is Phosphorus as $3.4{\times}10^{12}/cm^3$. The fabricated sensor was a leakage current, 12pA at voltage -3.3V and fully depleted mode at voltage -5V. A test result of pulsed radiation shows that the sensor gives out the optimal photocurrent.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.30 no.5
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• pp.94-100
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• 2002

This paper is concerned with the development, and performance test of LIPCA (Lightweight Piezo-composite Curved Actuator) that is lighter than other conventional piezo-composite type actuators. LIPCA is composed of top fiber composite layers with a high modulus and low CTE (Coefficient of Thermal Expansion), a middle PZT cermaic wafer, and base layers with a high modulus and high CTE. The performance of each actuator was evaluated using an actuator test system consisting of an actuator supporting jig, a high voltage actuating power supplier, and a non-contact laser measuring system. The simply supported condition actuator was excited by the power supplier with 1.0Hz cycle and up to $100\sim400V_{pp}$. The displacement at the center point of actuator was measured with non-contact laser displacement measuring system, It has been shown that the LIPCA-C2 can 34% decrease in mass and 13% increase in displacement compared to THUNDER.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.449-449
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• 2011

We reported the direct effect of intrinsic surface energy of dry adhesive material to the Van der Waals and capillary forces contributions of the total adhesion force in an artificial gecko-inspired adhesion system. To mimic the gecko foot we fabricated tilted nanohairy structures using both lithography and ion beam treatment. The nanohairy structures were replicated from Si wafer mold using UV curable polymeric materials. The control of nanohairs slanting angles was based on the uniform linear argon ion irradiation to the nanohairy polymeric surface. The surface energy was studied utilizing subsequent conventional oxygen ion treatment on the nanohairy structures which resulted in gradient surface energy. Our shear adhesion test results were found in good agreement with the accepted Van der Waals and capillary forces theory in the gecko adhesion system. Surface energy would give a direct impact to the effective Hamaker constant in Van der Waals force and the filling angle (${\varphi}$) of water meniscus in capillary force contributions of gecko inspired adhesion system. With the increasing surface energy, the effective Hamaker constant also increased but the filling angle decreased, resulting in a competition between the two forces. Using a simple mathematical model, we compared our experimental results to show the quantitative contributions of Van der Waals and capillary forces in a single adhesion system on both hydrophobic and hydrophilic surfaces. We found that the Van der Waals force contributes about 82.75% and 89.97% to the total adhesion force on hydrophilic and hydrophobic test surfaces, respectively, while the remaining contribution was occupied by capillary force. We also showed that it is possible to design ultrahigh dry adhesive with adhesion strength of more than 10 times higher than apparent gecko adhesion force by controlling the surface energy and the slanting angle induced-contact line of dry adhesive the materials.

• Journal of the Korean institute of surface engineering
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• v.47 no.2
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• pp.75-80
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• 2014

Nanocrystalline diamond(NCD) films on steel(SKH51) has been investigated using SiC interlayer film. SiC was deposited on SKH51 or Si wafer by RF magnetron sputter. NCD was deposited on SiC at $600^{\circ}C$ for 0.5~4 h employing microwave plasma CVD. Film morphology was observed by FESEM and FIB. Film adherence was examined by Rockwell C adhesion test. The growth rate of NCD on SiC/Si substrate was much higher than that on SiC/SKH51. During particle coalescence, NCD growth rate was slow since overall rate was determined by the diffusion of carbon on SiC surface. After completion of particle coalescence, NCD growth became faster with the reaction of carbon on NCD film controlling the whole process. In the case of SiC/SKH51 substrate, a complete NCD film was not formed even after 4 h of deposition. The adhesion test of NCD/SiC/SKH51 samples revealed a delamination of film whereas that of SiC/SKH51 showed a good adhesion. Many voids of less than 0.1 ${\mu}m$ were detected on NCD/SiC interface. These voids were believed as the reason for the poor adhesion between NCD and SiC films. The origin of voids was due to the insufficient coalescence of diamond particles on SiC surface in the early stage of deposition.