• 한국정밀공학회지
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• 제27권2호
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• pp.7-12
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• 2010

Due to the extremely short interaction time (< $10\times10^{-12}$sec) between laser pulse and material, which enables the minimization of heat affection, ultrafast laser micro-machining has rapidly widened its applications. In this paper, the characteristics of ultrafast laser micro-machining have been reviewed and experimentally demonstrated in laser drilling of silicon wafer and in laser cutting of rigid PCB.

• 한국정밀공학회지
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• 제27권6호
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• pp.7-16
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• 2010

Physical fundamentals of ultrashort femtosecond lasers are addressed along with emerging applications for precision manufacturing and metrology. Femtosecond lasers emit short pulses whose temporal width is in the range of less than a picosecond to a few femtoseconds, thereby enabling extremely high peak-power machining with less thermal damages. Besides, the broad spectral bandwidth of femtosecond lasers constructed in the form of frequency comb permits absolute distance measurements leading to ultraprecision positioning control and dimensional metrology.

• Journal of Mechanical Science and Technology
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• 제19권6호
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• pp.1378-1389
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• 2005

This work provides the fundamental knowledge of energy transport characteristics during very short-pulse laser heating of semiconductors from a microscopic viewpoint. Based on the self-consistent hydrodynamic equations, in-situ interactions between carriers, optical phonons, and acoustic phonons are simulated to figure out energy transport mechanism during ultrafast pulse laser heating of a silicon substrate through the detailed information on the time and spatial evolutions of each temperature for carriers, longitudinal optical (LO) phonons, acoustic phonons. It is found that nonequilibrium between LO phonons and acoustic phonons should be considered for ultrafast pulse laser heating problem, two-peak structures become apparently present for the subpicosecond pulses because of the Auger heating. A substantial increase in carrier temperature is observed for lasers with a few picosecond pulse duration, whereas the temperature rise of acoustic and phonon temperatures is relatively small with decreasing laser pulse widths. A slight lagging behavior is observed due to the differences in relaxation times and heat capacities between two different phonons. Moreover, the laser fluence has a significant effect on the decaying rate of the Auger recombination.

• 진공이야기
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• 제2권1호
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• pp.17-20
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• 2015

In this article, a historical and scientific review on the development of an ultrafast electron microscope is supplied, and the challenges in further improvement of time resolution under sub-picosecond or even sub-femtosecond scale is reviewed. By combining conventional scanning electron microscope and femtosecond laser technique, an ultrafast electron microscope was invented. To overcome its temporal resolution limit which originates from chromatic aberration and Coulomb repulsion between individual electrons, a generation of electron pulse via strong-field photoemission has been investigated thoroughly. Recent studies reveal that the field enhancement and field accumulation associated with the near-field formation at sharply etched metal nanoprobe enabled such field emission by ordinary femtosecond laser irradiation. Moreover, a considerable acceleration reaching 20 eV with near-infrared laser and up to 300 eV acceleration with mid-infrared laser was observed, and the possibility to control the amount of acceleration by varying the incident laser pulse intensity and wavelength. Such findings are noteworthy because of the possibility of realizing a sub-femtosecond, few nanometer imaging of nanostructured sample.in silicon as thermoelectric materials.

• 한국광학회:학술대회논문집
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• 한국광학회 2005년도 제16회 정기총회 및 동계학술발표회
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• pp.10-11
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• 2005

• 한국정밀공학회지
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• 제29권6호
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• pp.640-647
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• 2012

Current electronic products are dominated by the laser processing and the application will be extended this time. Especially, demands for high precision laser processing with a large area has been increasing for a number of applications such as in solar cell battery, display parts, electronic component and automobile industry. In this paper we designed an on-the-fly system for ultrafast/high precision/large area laser processing. In addition, we have developed the path algorithm for large area. Expansion of the area in which laser processing is an important factor to handle the ultrafast/wide area processing, it will require a processing path. Processing path is path of 2- axis stage and stage of change in velocity can be smooth as possible. We proposed a path of the user concept using NURBS(Non-Uniform Rational B-Spline)method. Through our experiment with the chopper, was to prove the continuity of edge parts. Through basic shape experiments, we proved that large area can be processed using laser. We developed a simulation tool using Visual C++.

• 열처리공학회지
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• 제32권4호
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• pp.155-160
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• 2019

Diamond Like Carbon (DLC) is a metastable form of amorphous carbon that have superior material properties such as high mechanical hardness, chemical inertness, abrasion resistance, and biocompatibility. Furthermore, its material properties can be tuned by additional doping such as nitrogen or boron. However, either pure DLC or doped DLC show poor adhesion property that makes it difficult to apply contact processing technique. Therefore we propose ultrafast laser micromachining which is non-contact precision process without mechanical degradation. In this study, we developed precision machining process of DLC thin film using an ultrafast laser by investigating the process window in terms of laser fluence and laser wavelength. We have also demonstrated various patterns on the film without generating any microcracks and debris.

• 한국정밀공학회지
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• 제28권1호
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• pp.24-30
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• 2011

PC-TEMs (Polycarbonate Track-Etched membranes) were micro-drilled for biomedical applications by ultrafast pulsed laser. The ablation and damage characteristics were studied on PE-TEMs by assuming porous thin membranes. The experiments were conducted in the range of 2.02 $J/cm^2$ and 8.07$J/cm^2$. The ablation threshold and damage threshold were found to be 2.56$J/cm^2$ and 1.14$J/cm^2$, respectively. While a conical shaped drilled holes was made in lower fluence region, straight shaped holes were drilled in higher fluence region. Nanoholes made the membrane as porous material and ablation characteristics for both bulk and thin film membranes were compared.

• 한국진공학회지
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• 제16권1호
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• pp.74-78
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• 2007

전자 산업의 발달과 더불어 더욱 더 작은 구조물의 제작을 위한 새로운 물질공정 기술에 대한 수요가 증가하고 있다. 물질 고유의 물리적인 성질을 유지하면서 초미세 공정이 필용한 시점에서 기존의 전통적으로 사용하여 왔던 기계적인 방법과 레이저 공정은 공정 분해능의 한계와 물리화학적인 변형 때문에 최종 부품의 성능저하와 불량률을 증가시켜 많은 문제점을 내포하고 있다. 반면에 고출력 펨토초 레이저 기반물질 공정 기술은 기존 레이저 공정에 비해 열적 손상이 매우 작기 때문에 최근 많은 분야에서 큰 관심을 불러일으키고 있다. 본 해설 논문에서는 박형 실리콘 기판의 마이크로 패키징 및 게르마늄 표면 공정을 통한 나노구조체 형성에 대해 본 연구진에서 발표한 최근의 개발 내용을 중심으로 관련 연구 분야를 소개하고자 한다.

• 한국정밀공학회지
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• 제27권10호
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• pp.34-39
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• 2010

We developed a path algorithm for ultrafast/wide area laser processing. Demands for high precision laser processing with a wide area has been increasing for a number of applications such as in solar cell battery, display parts, electronic component and automobile industry. Expansion of the area in which laser processing is an important factor to handle the ultrafast/wide area processing, it will require a processing path. Processing path is path of 2- axis stage and stage of change in velocity can be smooth as possible. In this paper, we proposed a smoothingnurbs method of improved speed profile. This method creates soft path from edge part, it is main purpose that scan area ($50mm{\times}50mm$) inside processing path makes path of topology of possible straight line. We developed a simulation tool using Visual C++.