• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.5
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• pp.803-807
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• 2008

A making process of DSC(dye sensitized solar cell) was presented. In general, Photo electrodes of DSC was made by using colloid paste of nano $TiO_2$ and processing of Doctor-blade printing and high temperature sintering for porous structure. These methods lead to cracks on $TiO_2$ surface and ununiform of $TiO_2$ thickness. This phenomenon is one factor that makes low efficiency to cells. After $TiO_2$ printing on TCO glass, a physical vibration was adapted for reducing ununiform of $TiO_2$ thickness. And a thermal treatment at low temperature(under $75^{\circ}C$) was adapted for reducing cracks on $TiO_2$ surface. In this paper, we have designed and manufactured an ultrasonic circuit (100W, frequency and duty variable) and a thermal equipment. Then, we have optimized forcing time, frequency and duty of ultrasonic irradiation and thermal heating for surface treatment of photo-electrode of DSC. In I-V characteristic test of DSC, ultrasonic and thermal treated DSC shows 19% improved its efficiency against monolithic DSC. And it shows stability of light-harvesting from drastically change of light irradiation test.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2004.03a
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• pp.854-860
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• 2004

"Research and Development of Melt-Growth Composite (MGC) Ultra High Efficiency Gas Turbine System Technology" program has been started in JFY2001. The main objective of the program is to establish basic component technologies to apply MGC material to an efficient gas turbine system successfully. It is known that MGC material maintains its mechanical strength at room temperature up to about 2000 K, which is ideal for the high temperature gas turbine. The purposes of the present study are to develop the cooling structure of the gas turbine combustor liner where MGC material is applied as the heat shield panel, also to develop the low NOx combustion system for a 1970 K (1700 deg.C) class gas turbine combustor. To start with, basic heat transfer characteristics were investigated by one-dimensional calculation and heat transfer experiment for the cooling structure. Axially staged configuration and fuel preparation were investigated by CFD calculation and experiments for the low NOx combustor.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.4
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• pp.367-370
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• 2004

We fabricated SiGe BiCMOS devices, which are important for ultra high speed RF IC chips, by employing $0.35\mu{m}$ CMOS process. To meet with the requirement of low noise level with linear base leakage current at low VBE region, we try to minimize polysilicon/ silicon interface traps by optimizing capping silicon thickness and EDR(emitter drive-in RTA) temperature. We employed $200\AA$and $300\AA$-thick capping silicon, and varied the EDR process condition at temperature of $900-1000^\circ{C}$, and time of 0-30 sec at a given capping silicon thickness. We investigated current gain behavior at each process condition. We suggest that optimum EDR process condition would be $975^\circ{C}$-30 sec with $300\AA$-thick capping silicon for proposed $0.35\mu{m}$-SiGe HBT devices.

• YAKHAK HOEJI
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• v.59 no.2
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• pp.70-76
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• 2015

A Softgel is an oral dosage form for medicine similar to capsules and softgel dosage form offers several advantages over other oral dosage forms, such as delivering a liquid matrix designed to solubilize and improve the oral bioavailability of a poorly soluble compound as a unit dose solid dosage form, delivering low and ultra-low doses of a compound. This study aimed to qualify a proprietary vegetable soft capsule which contains modified starch and carrageenan as capsule shell components compare to the conventional gelatin softgel. Four kinds of samples were prepared with vegetable and gelatin capsule shell, respectively. Morphology of capsule shell, mechanical strength of capsule, and hygroscopic properties were studied for comparing the quality attributes of softgel. Short-term stability against heat and moisture was also investigated in this study. Vegetable capsule shell showed better mechanical strength, physical stability and disintegration time for temperature and humidity than those of conventional gelatin capsule shell with four different filling materials used frequently as soft capsule form. Conclusively, this vegetable capsule shell polymer system can replace easily gelatin-shell systems and additionally allows encapsulation of lipid fills at high temperatures that are semisolid or solid-like at room temperature.

• Korean Journal of Metals and Materials
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• v.48 no.3
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• pp.187-193
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• 2010

The solute carbon content in ferrite is one of the important factors to obtain good formability in low carbon steels. Although most of the carbons are consumed by the formation of grain boundary cementite during coiling after hot-rolling, the carbon content after coiling is normally observed much more than that of equilibrium. In this study, a classical nucleation and growth model is used to simulate the precipitation kinetics of the grain boundary cementite from coiling temperature (CT) to room temperature (RT). The predicted precipitation behaviors depending on the initial carbon content and the cooling rate are compared with the reported. As a result, the lateral growth of thickening of cementite is a major factor for the sluggish reaction of grain boundary cementite. The reduction of solute carbon content after coiling is divided into three regions: a) increase due to no cementite precipitation, b) decrease due to the fast length-wise growth of cementite, c) increase due to the slow thickness-wise growth of cementite.

• Journal of Dairy Science and Biotechnology
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• v.34 no.4
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• pp.271-278
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• 2016

The main purpose of milk heat-treatment is to improve milk safety for consumer by destroying foodborne pathogens. Secondly, heat-treatment of milk is to increase maintaining milk quality by inactivating spoilage microorganisms and enzymes. Pasteurization is defined by the International Dairy Federation (IDF, 1986) as a process applied with the aim of avoiding public health hazards arising from pathogens associated with milk, by heat treatment which is consistent with minimal chemical, physical and organoleptic changes in the product. Milk pasteurization were adjusted to $63{\sim}65^{\circ}C$ for 30 minutes (Low temperature long time, LTLT) or $72{\sim}75^{\circ}C$ for 15 seconds (High temperature short time, HTST) to inactivate the pathogens such as Mycobacterium bovis, the organism responsible for tuberculosis. Ultra-high temperature processing (UHT) sterilizes food by heating it above $135^{\circ}C$ ($275^{\circ}F$) - the temperature required to destroy the all microorganisms and spores in milk - for few seconds. The first LTLT system (batch pasteurization) was introduced in Germany in 1895 and in the USA in 1907. Then, HTST continuous processes were developed between 1920 and 1927. UHT milk was first developed in the 1960s and became generally available for consumption in the 1970s. At present, UHT is most commonly used in milk production.

• Journal of Dairy Science and Biotechnology
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• v.36 no.1
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• pp.49-71
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• 2018

Heat treatment is the most popular processing technique in the dairy industry. Its main purpose is to destroy the pathogenic and spoilage bacteria in order to ensure that the milk is safe throughout its shelf life. The protease and lipase that are present in raw milk might reduce the quality of milk. Plasmin and protease, which are produced by psychrotrophic bacteria, are recognized as the main causes of the deterioration in milk flavor and taste during storage. The enzymes in raw milk can be inactivated by heat treatment. However, the temperature of inactivation varies according to the type of enzyme. For example, some Pseudomonas spp. produce heat-resistant proteolytic and lipolytic enzymes that may not be fully inactivated by the low temperature and long time (LTLT) treatment. These types of enzymes are inhibited only by the high temperature and short time (HTST) or ultra-high temperature (UHT) treatment of milk.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.8
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• pp.1749-1753
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• 2005

In this paper, we have investigated electrical characteristics by action temperature of double gate structure that have main gate and side gate. Could know current-voltage characteristic is superior in ultra low temperature (77 K) as well as in room temperature (300 K). Also, conditions of most suitable for get superior DG MOSFET's dynamic characteristics are main gate length of 50nm and side gate length of 70nm and could know that should be approved more than voltage 2V. Also, this DG MOSFET usefully use may as digital device because on-off characteristic is superior.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.77-80
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• 2001

Crystallographic and magnetic characteristics of CoCr-based magnetic thin film for perpendicular magnetic recording media were influenced on preparing conditions. In these, there is that substrate temperature was parameter that increases perpendicular coercivity of CoCrTa magnetic layer using recording layer. While preparation of CoCr-based doublelayer, by optimizing substrate temperature, we expect to increase perpendicular anisotropy of CoCr magnetic layer and prepare ferromagnetic recording layer with a good quality by epitaxial growth. CoCrTa/Si doublelayer showed a good dispersion angle of c-axis orientation $\Delta$$\theta$$_{50}$ caused by inserting amorphous Si underlayer which prepared at underlayer substrate temperature 250C. Perpendicular coercivity was constant, in-plane coercivity was controlled a low value about 2000e. This result implied that Si underlayer could restrain growth of initial layer of CoCrTa thin film, which showed bad magnetic properties effectively without participating magnetization patterns of magnetic layer. In case of CoCrTa/Si that prepared with ultra thin underlayer, crystalline orientation of CoCrTa was improved rather underlayer thickness 1nm, it was expected that amorphous Si layer played a important role in not only underlayer but also seed layer.t also seed layer.r.

• Journal of the Korean institute of surface engineering
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• v.54 no.5
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• pp.207-212
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• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.