• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.204-205
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• 2007

Self-seed 층을 이용한 PLZT(9/65/35), 강유전체 박막을 Sol-Gel 법을 이용해 Pt/Ti/$SiO_2$/Si 기판 위에 증착한 후, Self-seed 층에 의한 PLZT(9/65/35) 박막의 구조적, 전기적 특성을 고찰하였다. Seed 층을 도입하지 않은 PLZT 박막의 경우 다결정 상으로 형성되는 것을 알 수 있었으며, seed 층을 도입한 PLZT 박막은 (110) 방향으로 우선 배향됨을 알 수 있었다. 증착된 PLZT(9/65/35) 박막의 유전율 및 유전손살은 10kHz에서 유전율 205, 유전손살 0.029 이었으며, Self-seed layer를 도입한 PLZT 박막의 경우 seed layer를 도입하지 않은 PLZT 박막보다 낮은 온도에서 결정화 되는 것을 관찰 할 수 있었다. Self-seed layer가 도입된 PLZT(9/65/35) 박막의 경우 잔류분극 ($P_r$) 값은 $9.1{\mu}C/cm^2$, 항전계($E_c$)는 47 kV/cm을 나타내었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• Korean Journal of Metals and Materials
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• v.50 no.2
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• pp.152-158
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• 2012

The effect of current waveform on Cu filling into TSV (through-silicon via) and the bottom-up ratio of Cu were investigated for three dimensional (3D) Si chip stacking. The TSV was prepared on an Si wafer by DRIE (deep reactive ion etching); and its diameter and depth were 30 and $60{\mu}m$, respectively. $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. The current waveform was varied like a pulse, PPR (periodic pulse reverse) and 3-step PPR. As experimental results, the bottom-up ratio by the pulsed current decreased with increasing current density, and showed a value of 0.38 on average. The bottom-up ratio by the PPR current showed a value of 1.4 at a current density of $-5.85mA/cm^2$, and a value of 0.91 on average. The bottom-up ratio by the 3-step PPR current increased from 1.73 to 5.88 with time. The Cu filling by the 3-step PPR demonstrated a typical bottom-up filling, and gave a sound filling in a short time.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.6
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• pp.445-449
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• 2020

Non-volatile memory is approaching its fundamental limits with the Si₃N₄ storage layer, necessitating the use of alternative materials to achieve a higher programming/erasing speed, larger storage window, and better data retention at lower operating voltage. This limitation has restricted the development of the charge-trap memory, but can be addressed by using high-k dielectrics. The paper reviews the doping of nitrogen, titanium, and yttrium on high-k dielectrics as a storage layer by comparing MONOS devices with different storage layers. The results show that nitrogen doping increases the storage window of the Gd₂O₃ storage layer and improves its charge retention. Titanium doping can increase the charge capture rate of HfO₂ storage layer. Yttrium doping increases the storage window of the BaTiO₃ storage layer and improves its fatigue characteristics. Parameters such as the dielectric constant, leakage current, and speed of the memory device can be controlled by maintaining a suitable amount of external impurities in the device.

• Journal of the Korean Electrochemical Society
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• v.18 no.2
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• pp.45-50
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• 2015

In the present work, to increase the chemical stability of the lithium-ion-conducting ceramic electrolyte ($Li_{1+x+y}Al_xTi_{2-x}Si_yP_{3-y}O_{12}$, LATP) in the strong alkaline solution, the surface of LATP was modified by the nitridation process. The surface and structural properties of nitride LATP solid electrolyte were characterized by X-ray diffraction, X-ray photoelectron spectrometer and scanning electron microscopy and ac-impedance spectroscopy, which were correlated to the chemical stability and electrochemical performance of LATP. The nitrided LATP immersed in the alkaline solution for 30 days exhibits the enhanced chemical stability than the pristine LATP. Moreover, a rechargeable hybrid Li-air battery constructed with the nitrided LATP solid electrolyte shows considerably reduced discharge-charge voltage gaps (enhanced the round-trip efficiency) in comparison to the cell constructed with pristine LATP, which indicate that the surface nitridation process can be the efficient way to improve the chemical stability of solid electrolyte in alkaline media.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.05a
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• pp.14-14
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• 2003

Silicon carbide (SiC)는 높은 power 영역과 높은 온도영역에서도 작동 가능한 우수한 반도체 물질이다. 또한 우수한 열적 화학적, 안정성을 가지고 있어 가흑한 조건에서의 소자로써도 사용 가능하다. 현재 SiC 적용분야로는 우수한 전기적, 기계적 성질을 이용한 미세소자(MEMS)와 GaN 와 거의 유사한 격자상수를 가지는 것을 이용한 GaN epitaxial 성장의 기판으로도 사용되어진다. 그러나 SiC 는 기존의 습식식각 용매에 대해 화학적 안정성을 가지고 있기 때문에 전자소자의 제작에 있어서 플라즈마를 이용한 건식식각의 중요성이 대두되어지고 있다. 소자제작에 있어 이러한 건식식각시 식각 단면의 제어, 이온에 의한 낮은 손상 정도, 매끄러운 식각 표면, 그리고 고속의 식각 속도둥이 요구되어진다. 본 실험에서는 식각 속도의 증가와 수직한 식각 단면둥을 획득하기 위하여 SF6 플라즈마에서 Source power, dc bias voltage, 그리고 외부에서 인가되는 자속의 세기를 변화시쳐가며 식각 속도, 식각 마스크와의 식각 션택비, 식각 단면둥과 같은 SiC 의 식각 특성을 관찰하였다. 식각 후 식각 단면은 주사전자 현미경(SEM)을 통해 관찰하였다. 본 실험에서의 가장 높은 식각 속도는 분당 1850n 로써 이때의 공정조건은 1400W 의 inductive power, -600V 의 dc bias voltage, 20G 의 외부자속 세기이었다. 또한, 높은 inductive power 조건과 낮은 dc bias voltage 조건에서 Cu는 $SF_6$ 플라즈마 내에서 식각부산물의 증착으로 인해 SiC 와 무한대의 식각선택비를 보였다. 이러한 Cu 마스크를 사용한 SiC 의 식각에서는 식각 후 수직한 식각 단변을 관찰할 수 있었다. 것올 알 수 있다. 따라서, 기존의 pve 보다 세라믹 기판의 경우가 수분 흡수율이 높아 더 오랫동안 전류를 흐르게 하여 방식성이 개선된 것으로 판단된다.을 통해 경도가 증가한 시편의 경우 석출상의 크기가 5nm 이하로 매우 작고 대체로 기지와 연속적인 계면을 형성하나, 열처리가 진행될수록 석 출상의 크기가 커지고 임계크기 이상에 이르면 연속적인 계면은 거의 발견되지 않고, 대부 분 불연속적이고 확연한 계면을 형성함을 관찰 할 수 있었다. 알루미나(${\alpha}-Al_2O_3$) 기판 위에 증착한 $(Ti_{1-x}AI_{x})N$ 피막은 마찬가지로 (200) 우선 방위를 나타내었으나, 그 입자의 크기가 수십 nm로 고속도강위에 증착한 피막에 비해 상당히 크게 형성되었다. 또한 열처리 후에 AIN의 석출이 진행됨에도 불구하고 경도 증가는 나타나지 않고, 열처리가 진행됨에 따라 경도가 감소하는 양상만을 나타내었다. 결국 $(Ti_{1-x}AI_{x})N$ 피막이 열처리 전후에 보아는 기계적 특성의 변화 양상은 열역학적으로 안정한 Wurzite-AlN의 석출에 따른 것으로 AlN 석출상의 크기에 의존하며, 또한 이러한 영향은 $(Ti_{1-x}AI_{x})N$ 피막에 존재하는 AI의 함량이 높고, 초기에 증착된 막의 업자 크기가 작을 수록 클 것으로 여겨진다. 그리고 환경의 의미의 차이에 따라 경관의 미학적 평가가 달라진 것으로 나타났다.corner$적 의도에 의한 경관구성의 일면을 확인할수 있지만 엄밀히 생각하여 보면 이러한 예의 경우도 최락의 총체적인 외형은 마찬가지로 $\ulcorner$순응$\lrcorner$의 범위를 벗어나지 않는다. 그렇기 때문에

• Korean Journal of Metals and Materials
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• v.48 no.7
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• pp.667-673
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• 2010

Copper filling into TSV (through-silicon-via) and reduction of the filling time for the three dimensional chip stacking were investigated in this study. A Si wafer with straight vias - $30\;{\mu}m$ in diameter and $60\;{\mu}m$ in depth with $200\;{\mu}m$ pitch - where the vias were drilled by DRIE (Deep Reactive Ion Etching) process, was prepared as a substrate. $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. In order to reduce the time required complete the Cu filling into the TSV, the PPR (periodic pulse reverse) wave current was applied to the cathode of a Si chip during electroplating, and the PR (pulse-reverse) wave current was also applied for a comparison. The experimental results showed 100% filling rate into the TSV in one hour was achieved by the PPR electroplating process. At the interface between the Cu filling and Ti/ Au functional layers, no defect, such as a void, was found. Meanwhile, the electroplating by the PR current showed maximum 43% filling ratio into the TSV in an hour. The applied PPR wave form was confirmed to be effective to fill the TSV in a short time.

• Journal of Korean Society for Atmospheric Environment
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• v.17 no.E1
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• pp.1-7
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• 2001

The elemental characteristics of atmospheric aerosols were investigated as a function of particle size and water solubility. The aerosol particles were samples at 12 individual size ranges between 0.01 and 30㎛. Collected aerosol particles were separated into both soluble and insoluble components. The concentrations of 15 elements in both components were determined by a PIXE analysis using a 2.0 MeV-proton beam. In general, the mass size distribution of particulate matter was represented as a bimodal distribution. The maximum rations of S in July and December were 5.5 and 3.8 %, and they appeared in the size range of 0.47∼1.17㎛(stage No. 6 or 7) . The ratios of a S at non-separated size were 3.1 and 2.2 % in July and December, respectively, On the other hand, the maximum rations of Si in July and December were 7.0 and 5.4% and they appeared in the size range of 5.1∼30㎛(stage No. 0∼2). The ratios of Si at the non-separated size were 2.1 and 1.8% in July and December, respectively, The mass diameter of 12 elements ranged between 0.59㎛ of S and 3.20 of Fe. More than 90% of atmospheric aerosols consisted of the light elements such as C, N, O, H and Al. The soluble component was dominant in the smaller size range and the insoluble component in the larger size range. Large portions of Si. Ti and Fe existed in insoluble state. By contrast, S, Cl, Ca, Zn and Br were dissolved in water.

• Bulletin of the Korean Chemical Society
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• v.31 no.5
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• pp.1275-1279
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• 2010

We have carried out the surface modification of photocatalytic $TiO_2$ with triethoxysilane through dehydrogenation reaction and characterized the modified photocatalyst by spectroscopic methods, such as FT-IR, solid-state $^{29}Si$ MAS NMR, XPS, and XRF, etc. We also examined photocatalytic activity of the immobilized photocatalytic titanium dioxide with triethoxysilane by decolorization reaction of dyes such as cong red and methylene blue under visible light. Dispersion test showed that the photocatalytic titanium dioxide immobilized with triethoxysilane group has kept higher dispersibility than titanium dioxide itself. No appreciable precipitation takes place even after standing for 24 h in the 4:6 mixture ratio of ethanol and water.

• Economic and Environmental Geology
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• v.16 no.1
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• pp.19-36
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• 1983

The study revealed that the sequence of volcanism in Ulrung island can be classified into 5 stages, and the volcanic history is summerized as follow: 1st stage: Eruption of basaltic agglomerates, tuffs and lavas, 2nd stage: Eruption of trachytic and trachyandesitic agglomerates and tuffs, 3rd stage: Eruption of trachyte lavas and their lapilli tuffs, 4th stage: Eruption of trachyte lavas and nepheline phonolites, 5th stage: Eruption of pumice, trachytic ash and lapilli, and plutonic ejecta (fragments of alkali gabbro, monzonite and alkali feldspar syenite) and a subsequent caldera formation. Finally, a small scale eruption of leucite bearing trachyandesite lava in the caldera. Several evidences show that there have been long erosional intervals between the 1st and 2nd stages and between the 4th and 5th stages. A K-Ar age for trachybasalt lava of the 1st stage was determined to be 1.8 Ma, and a $C^{14}$ age, 9300Y. (Machida, 1981) is available for these volcanic events. Therefore, it is considered that volcanic activity of the island above sea level began at least in early Pleistocene, and continued to until 9300 years ago exploding large amount of pumice, prior to pouring out of leucite bearing trachyandesite from the inner caldera. Using solidification index (SI) of Kuno, microscopic texture and mineral composition as criteria of the classification, the volcanic rocks are classified into alkali basalt, trachybasalt, trachyandesite, trachyte and phonolite. These are mostly prophyritic in texture. Main constituent minerals of alkali basalt and trachybasalt are plagioclase, olivine, Ti-augite and magnetite. Principal minerals of trachyandesite are plagioclase, anorthoclase, clinopyroxenes, kaersutite, biotite and magnetite. Trachyte and phonolite consist mainly of anorthoclase, clinopyroxene and magnetite, showing typical trachytic texture in groundmass. In solidification index, alkali basalt ranges from 39 to 27, trachybasalt 17 to 14, trachyandesite 12 to 9 and trachyte 8.15 to 0.72. A trend of compositional variation showing a typical alkali volcanic rock series is revealed on $SiO_2$-oxides and SI-oxides diagrams. In $SiO_2$-total alkali diagram, alkali lime index and An-Ab'-Or diagram, the samples fall into the fields of potassic series of the alkali volcanic rock series, whereas in A-F-M diagram show a trend toward the alkali enrichment with a curve approaching toward the iron apex. In particular, trachybasalt lavas in this island have higher total iron contents which is comparable to alkali rocks in other areas, e. g. as Gough and Tristan volcanic islands located near the Mid-Oceanic ridge in South Atlantic Ocean.