• Transactions of Materials Processing
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• v.33 no.4
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• pp.277-284
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• 2024

Interest in remanufacturing of part has significantly increased to reduce used material and energy together. The directed energy deposition (DED) process has widely applied to remanufacturing of the part. An excessive residual stress takes place in the vicinity of the deposited region by the DED process due to rapid heating and rapid cooling (RHRC) phenomenon. The excessive residual stress decreases the reliability of the remanufactured part. Therefore, thermo-mechanical analysis for the remanufacturing of the part is needed to investigate heat transfer and residual stress characteristics in the vicinity of the deposited region. The thermo-mechanical analysis of a large volume deposition is significantly difficult to perform due to the requirement of a long computation time and a large computer memory. The goal of this paper is to investigate thermo-mechanical characteristics for remanufacturing of the ATC part using a DED process. The methodology of the thermo-mechanical analysis for a large volume deposition is proposed. From the results of analysis, heat transfer and residual stress characteristics during deposition and cooling stages are investigated. In addition, the proper deposition strategy from the viewpoint of the residual stress is discussed.

• Journal of Mechanical Science and Technology
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• v.17 no.2
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• pp.171-180
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• 2003

One of the most significant problems in the processing of composite materials is residual stress. The high residual stress may cause cracking in the matrix without external loads and degrade the integrity of composite structures. In this study, thermo-viscoelastic residual stresses occurred in an aluminum liner-inserted polymer composite cylinder are investigated. This type of the structure is used for rocket fuselage due to the convenience to attach payloads and equipment to the metal liner by machining. The time and degree of cure dependent thermo-viscoelastic constitutive equations are developed and coupled with a thermo-chemical process model. These equations are solved with the finite element method to predict the residual stresses in the composite cylinder and also in the interface between the liner and the composite during cure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.84-85
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• 2005

Dislocations are often found at Shallow Trench Isolation (STI) process after repeated thermal cycles. The residual stress after STI process often leads defect like dislocation by post STI thermo-mechanical stress. Thermo-mechanical stress induced by STI process is difficult to remove perfectly by plastic deformation at previous thermal cycles. Embedded flash memory process is very weak in terms of post STI thermo-mechanical stress, because it requires more oxidation steps than other devices. Therefore, dislocation-free flash process should be optimized.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.10
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.05a
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• pp.1061-1064
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• 2006

Optimal design of functionally graded plates is investigated considering stress and critical temperature. Material properties are assumed to be temperature dependent and varied continuously in the thickness direction. The effective material properties are obtained by applying linear rule of mixtures. The 3-D finite element model is adopted using an 18-node solid element to analyze more accurately the variation of material properties and temperature field in the thickness direction. For stress analysis, the tensile stress ratio and compressive stress ratio of the structure under mechanical load are investigated. In the thermo-mechanical buckling analysis, temperature at each node is obtained by solving the steady-state heat transfer problem and Newton-Raphson method is used for material nonlinear analysis. Finally, the optimal design of FGM plates is studied for stress reduction and improving thermo-mechanical buckling behavior, simultaneously.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.693-694
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• 2009

• Journal of Welding and Joining
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• v.29 no.1
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• pp.46-51
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• 2011

TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.3
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• pp.261-268
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• 2001

An investigation on nondestructive evaluation of thermal stress-nduced damage in the composite laminates (3mm in thickness and $[+45_6/-45_6]_s$ lay-up angles) has been performed using the thermo-acoustic emission technique. Reduction of thermo-AE events due to repetitive thermal load cycles showed a Kaiser effect. An analysis of the thermo-AE behavior determined the stress free temperature of composite laminates. Fiber fracture and matrix cracks were observed using the optical microscopy, scanning electron microscopy and ultrasonic C-sean. Short-Time Fourier Transform of thermo-AE signals offered the time-frequency characteristics which might classily the thermo-AE as three different types to estimate the damage processes of the composites.

• Journal of Mechanical Science and Technology
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• v.17 no.3
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• pp.391-399
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• 2003

The thermo-acoustic emission (AE) technique has been applied for nondestructive characterization of composite laminates subjected to cryogenic cooling. Thermo-AE events during heating and cooling cycles showed a Kaiser effect. An analysis of the thermo-AE behavior obtained during the 1st heating period suggested a method for determining the stress-free temperature of the composite laminates. Three different thermo-AE types classified by a short-time Fourier transform of AE signals enabled to offer a nondestructive estimation of the cryogenic damages of the composites, in that the different thermo-AE types corresponded to secondary microfracturing in the matrix contacting between crack surfaces and some abrasive contact between broken fiber ends during thermal load cycles.