• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• Journal of the Korean Ceramic Society
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• v.30 no.6
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• pp.457-468
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• 1993

In oxide matrix-SiC(W) composites, instability and glassy phase formation due to oxidation at the high temperature and the diffusion of Si, respectively, cause brittle fracture and low reliability for ceramic materials. The mode of contribution in each mechanisms induced by matrix-whisker debonding, varies with the morphology of matrix-whisker interfaces. This work has described the dispersion behaviours and stabilization mechanisms in slip systems, and multiple toughening mechanisms by dint of two second phase different from each other when spherical ZrO2 and chemically stable Al2O3(W) is respectively added in Al2O3 matrix. To obtain complexshaped components, slip casted bodies were sintered at 1$600^{\circ}C$, 2hrs up to 98~99% R.D.. Multiple toughening mechanisms in comparison with theories reported until now will be discussed as a result of the phase analysis of ZrO2 by athermal behaviours and microstructural characterizations as well as measured mechanical properties.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.745-750
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• 2000

A warpage analysis program has been developed for fiber-reinforced injection molded parts. The warpage is Predicted from the residual stress and anisotropic thermo-mechanical properties coupled with fiber orientation in the integrated injection molding simulation. A simple elastic model is used for the calculation of thermally and pressure-induced residual stresses which are employed as the initial conditions in the structural analysis. To improve the reliability of warpage analysis, a new triangular flat shell element superimposing well-known efficient plate bending and membrane element is presented. The numerical examples address the neccesity to use anisotropic models for fiber-reinforced materials and show that predicted warpage is in good agreement with experimentally measured one.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.5
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• pp.137-142
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• 2018

With the development of the electronic-materials industry, multi-functional metal-composite materials with high thermal conductivity and low thermal expansion must be developed for high reliability and high life expectancy. This paper is a preliminary study on the manufacturing technology of gas reaction control composite material, focusing on the prediction of the equivalent thermal properties of Al-AlN composite materials. Numerical equivalent property values are obtained by using finite element analysis and compared with theoretical formulas. Al-AlN composite materials should become the optimal composite material when the proportion of the reinforcing phase is less than 0.5.

• Korean Chemical Engineering Research
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• v.49 no.2
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• pp.161-167
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• 2011

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservatives (OSP) in order to improve the stability and the reliability of final product. Since current OSPs have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to develop various thermo-stable OSPs based upon poly(vinyl pyridine-co- methylmethacrylate) and to evaluate their anti-oxidation property protecting Cu pad, thermo-stability and solubility to acid- or alcohol-containing aqueous solution during pos-fluxing. All OSPs showed not only good anti-oxidation property, thermo-stability and solubility but also more advantages like low cost, less odor, and less hygroscopic.

• Journal of Ocean Engineering and Technology
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• v.24 no.2
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• pp.62-66
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• 2010

The goal of this work is to establish the reliability of FCA welded joints for high strength EH36-TMCP ultra thick plate. For this, heat conduction and thermo elasto-plastic analyses have been conducted on a multi-pass, X-groove, butt-joint model to clarify the thermal and mechanical behavior (residual stresses, magnitude of the stresses, and their production and distribution mechanisms) of the weld joint. In addition, the results of the welding residual stress obtained from thermo elasto-plastic analysis was verified and compared with results obtained by XRD analysis.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.4
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• pp.355-360
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• 2014

Recently, the use of LED is increasing. This paper presents the new package process of thermal compression bonding using metal layered LED chip for the high power LED device. Effective thermal dissipation, which is required in the high power LED device, is achieved by eutectic/flip chip bonding method using metal bond layer on a LED chip. In this study, the process condition for the LED eutectic die bonder system is proposed by using the analysis program, and some experimental results are compared with those obtained using a DST (Die Shear Tester) to illustrate the reliability of the proposed process condition. The cause of bonding failures in the proposed process is also investigated experimentally.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.361-361
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• 2009

KEPCO High Temperature Superconducting (HTS) cable system rated with $3\Phi$, 22.9kV, 1250A was laid in 2006, and the long term test is in progress. The HTS cable system with the cooling system has been operated below cryogenic temperature. That environment exposes the system to the thermo-mechanical stress due to the significant temperature difference, and the cooling system has moving parts for the forced circulation of the coolant. Therefore the HTS cable system experiences thermal fatigue and moving part such as liquid nitrogen pump need a regular replacement every 5000 hours Building the assessment criterion, the maintenance procedure was established and regular preventive maintenance was done; improvement of the termination structure and the replacement of the bearing of liquid nitrogen pump. Following the proper process, the reliability assessment test including He leakage detection and the stability of flow rate was performed. This paper describes the process and result of the first regular maintenance of KEPCO HTS cable system

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.1-7
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• 2006

A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

• Polymer(Korea)
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• v.33 no.5
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• pp.446-451
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• 2009

Reliability evaluations of linear low density polyethylene (LLDPE) pipe with respect of thermal exposure time have been investigated in accordance with RS M 0042, which is a reliability standard for polymer pipe. As the thermal exposure time is prolonged, a progressive increase, until 250 days, in tensile strength and a slight increase in hardness are observed, while a proportional decrease in elongation at break is showed. These results can be explained by the increase of crystallinity, followed by the increase of crosslinking density, chain scission and the decrease in chain mobility, due to thermal oxidation as the exposure time increases. Long term hydrostatic pressure test result implies the existence of transition point from ductile to brittle fracture. Oxidation induction time (OIT) test is employed to monitor the thermo-oxidative degradation of LLDPE pipe. This result shows that after the exposure time is 250 days, the depletion of antioxidants added in LLDPE pipe occurs. An empirical equation as function of exposure time, under $100^{\circ}C$ thermal-degradation condition, is proposed to assess the remaining amount of antioxidants owing to thermo-oxidative degradation. Fourier transform infrared spectroscopy results show the increase of carbonyl (-C=O) and hydroxyl (O-H) function groups on the surface of thermally exposed LLDPE pipe. This result suggests that the hydrocarbon groups locally undergo the oxidation on the LLDPE surface due to thermal-degradation.