Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Thermo-ompression Process for High Power LEDs

High Power LED 열압착 공정 특성 연구

  • Han, Jun-Mo (Dept. of Mechanical Engineering, Hanyang Univ.) ;
  • Seo, In-Jae (Dept. of Mechanical Engineering, Hanyang Univ.) ;
  • Ahn, Yoomin (Dept. of Mechanical Engineering, Hanyang Univ.) ;
  • Ko, Youn-Sung (Dept. of Mechanical Engineering Team, PROTEC CO., LTD.) ;
  • Kim, Tae-Heon (Dept. of Mechanical Engineering Team, PROTEC CO., LTD.)
  • Received : 2014.02.18
  • Accepted : 2014.07.11
  • Published : 2014.08.15
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Abstract

Recently, the use of LED is increasing. This paper presents the new package process of thermal compression bonding using metal layered LED chip for the high power LED device. Effective thermal dissipation, which is required in the high power LED device, is achieved by eutectic/flip chip bonding method using metal bond layer on a LED chip. In this study, the process condition for the LED eutectic die bonder system is proposed by using the analysis program, and some experimental results are compared with those obtained using a DST (Die Shear Tester) to illustrate the reliability of the proposed process condition. The cause of bonding failures in the proposed process is also investigated experimentally.

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References

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