• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
• /
• pp.27-32
• /
• 2002

In this paper, global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. It was estimated by the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life of results was obtained at the thermal cycling testing condition of -65℃ ∼ 150℃. It was increased about 3.5 times in comparison with that of 0℃ ∼ 100℃. As the change of pad structure at the same other conditions, the fatigue life of SMD structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
• /
• pp.481-484
• /
• 2004

A form of measured temperature distribution to estimate condition of a electrical apparatus is a absolute reference for condition of the apparatus, time rate of transition, and difference between reference and currently temperature. Because passive thermography which has not injection of external thermal stimulation shows difference of temperature being on surface of a structure and temperature difference between the structure and back ground, the result could apply only to estimation or monitor for condition of terminal relaxation and overload related with temperature rising. However, a thermal flow in active thermography is differently generated by structure and condition of surface and subsurface. This paper presents the nondestructive testing using the properties and includes the results by heat injection and cooling to the apparatus. The buried discontinuity of subsurface could be detected by these techniques.

• Advances in materials Research
• /
• 제6권4호
• /
• pp.349-361
• /
• 2017

The nonlinear thermal buckling load parameter of the laminated composite panel structure is investigated numerically using the higher-order theory including the stretching effect through the thickness and presented in this research article. The large geometrical distortion of the curved panel structure due to the elevated thermal loading is modeled via Green-Lagrange strain field including all of the higher-order terms to achieve the required generality. The desired solutions are obtained numerically using the finite element steps in conjunction with the direct iterative method. The concurrence of the present nonlinear panel model has been established via adequate comparison study with available published data. Finally, the effect of different influential parameters which affect the nonlinear buckling strength of laminated composite structure are examined through numerous numerical examples and discussed in details.

• 한국측량학회지
• /
• 제39권2호
• /
• pp.73-79
• /
• 2021

Recently there are growing interests on the energy conservation and emission reduction. In the fields of architecture and civil engineering, the energy monitoring of structures is required to response the energy issues. In perspective of thermal monitoring, thermal images gains popularity for their rich visual information. With the rapid development of the drone platform, aerial thermal images acquired using drone can be used to monitor not only a part of structure, but wider coverage. In addition, the stereo photogrammetric process is expected to generate 3D point cloud with thermal information. However thermal images show very poor in resolution with narrow field of view that limit the use of drone-based thermal photogrammety. In the study, we aimed to generate 3D thermal point cloud using visible and thermal images. The visible images show high spatial resolution being able to generate precise and dense point clouds. Then we extract thermal information from thermal images to assign them onto the point clouds by precisely establishing photogrammetric collinearity between the point clouds and thermal images. From the experiment, we successfully generate dense 3D thermal point cloud showing 3D thermal distribution over the building structure.

• 한국전기전자재료학회논문지
• /
• 제21권1호
• /
• pp.18-22
• /
• 2008

In this paper, the Ni-Co alloy was used for thermal stability estimation comparison with Ni structure. The proposed Ni/Ni-Co structure exhibited wider range of rapid thermal process windows, lower sheet resistance in spite of high temperature annealing up to $700^{\circ}C$ for 30 min, more uniform interface via FE-SEM analysis, NiSi phase peak. Therefore, The proposed Ni/Ni-Co structure is highly promising for highly thermal immune Ni-silicide for nano-scale MOSFET technology.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1998년도 하계학술대회 논문집 D
• /
• pp.1401-1403
• /
• 1998

The composition, weight decrease, DTA, and surface structure of vinyl insulated wire with thermal treatment conditions have been investigated. The composition of Cu by EDX analysis indicates Cu, Cl, and O lines, and oxidation reaction results from thermal treatment. Thermal treated IV and HIV appeared chemical reaction at $269^{\circ}C$ and $265^{\circ}C$, respectively. SEM of thermal treated Cu at $250^{\circ}C$ disappears an elongation structure, and appears an original structure.

• Journal of Welding and Joining
• /
• 제17권6호
• /
• pp.78-83
• /
• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
• /
• pp.812-815
• /
• 2004

The molecular structure influences the thermal behavior of HTM. For OLED the glass transition temperature and evaporation temperature are critical. We report how changes in structure cause changes on both parameters. The results may be of interest for chemists when they design new molecule structures for OLED.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2010년도 추계학술대회 논문집
• /
• pp.361-362
• /
• 2010

• 한국콘크리트학회:학술대회논문집
• /
• 한국콘크리트학회 2002년도 가을 학술발표회 논문집
• /
• pp.421-424
• /
• 2002

Concrete roof in In-Chon LNG tank #15~18 is a very important structure. Precise control of quality is needed. This roof has 0.6~1.5m thickness, 36.23m radius, and, 12.7m height. So in this structure thermal crack caused by hydration heat should be controled. In this project belite cement plus LSP concrete is used. As a result of ambient temperature rising test and thermal analysis using FEM, this belite cement plus LSP concrete is expected to control the thermal crack well.