• Transactions on Electrical and Electronic Materials
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• v.11 no.2
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• pp.54-60
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• 2010

Polymer-assisted deposition is a chemical solution route to high quality thin films. In this process, the polymer controls the viscosity and binds metal ions, resulting in a homogeneous distribution of metal precursors in the solution and the formation of crack-free and uniform films after thermal treatment. We review our recent effort to epitaxially grow metal-nitride thin films, such as hexagonal GaN, cubic TiN, AlN, NbN, and VN, mixed-nitride $Ti_{1-x}Al_xN$, ternary nitrides tetragonal $SrTiN_2$, $BaZrN_2$, and $BaHfN_2$, hexagonal $FeMoN_2$, and nanocomposite TiN-$BaZrN_2$.

• Journal of Welding and Joining
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• v.12 no.2
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• pp.87-96
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• 1994

Correlation between microstructural features and segregation of elements (Si, Mn, P and S) near the mid of thickness in the base metal and the synthetic HAZ was investigated. Furthermore, the relationship between the degree of center segregation and weld cold cracking susceptibility in the thickness direction was also conducted by evaluating the effect of P concentration on the critical applied stress. The results obtained are as follows: 1) Pearlite band, containing the MnS type inclusion and a locally transformed structure with a higher hardness, was observed in the center segregation region. 2) By the weld thermal cycle, center segregation region was transformed to the white band which had a higher hardness than that of base metal due to a greater hardenability of concentrated Mn, P etc.. 3) Weld cold cracking susceptibility in the thickness direction was mainly dependent on the concentration of impurity elements rather than on the number of the segregated particles near the mid of thickness. 4) During welding, the higher concentrated region was easily changed into white band. Therefore, it could be predicted that the initiation and propagation of a cold crack would be promoted by increasing the restraint stress and hydrogen content.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.31-36
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• 2002

The 2nd level solder joint reliability of 153 FC-BGA for high-speed SRAM (Static Random Access Memory) with the large chip on laminate substrate comparing to PBGA(Plastic Ball Grid Array) was studied in this paper. This work has been done to understand an influence as the mounting with single side or double sides, structure of package, properties of underfill, properties and thickness of substrate and size of solder ball on the thermal cycling test. It was confirmed that thickness of BT(bismaleimide tiazine) substrate increased from 0.95 mm to 1.20 mm and solder joint fatigue life improved about 30% in the underfill with the low young's modulus. And resistance against the solder ball crack became twice with an increase of the solder ball size from 0.76 mm to 0.89 mm in solder joints.

• The Korean Journal of Ceramics
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• v.3 no.1
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• pp.52-56
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• 1997

The Pt doped $TiO_2$ composite membranes were prepared by the sol-gel process. The Pt doped titania sol was peptized with hydrochloric acid in the pH range of 1.23 to 1.32 at 5$0^{\circ}C$. The average particle size of the Pt doped titania sol was shown to be below 15nm and well dispersed in the solution. XPS show the Pt elements continuous and homogeneous dispersed in the $TiO_2$ membrane. The mean particle size of the Pt doped $TiO_2$ composite membrane has smaller than that of the undoped $TiO_2$ composite membrane. The average pore size of the Pt doped $TiO_2$ composite membrane was increased from 58 to 193 $\AA$ with firing temperature changed from 550 to 85$0^{\circ}C$. It was observed that the Pt doped $TiO_2$ composite membranes showed crack-free and homogeneous microstructue as well as narrow particle size distribution up to above 75$0^{\circ}C$.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2019.05a
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• pp.145-146
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• 2019

In contemporary residential culture, apartment houses can form individual independent residential areas within narrow territory. By using various building materials compared to the past, apartment house is recognized as an aesthetic space by modern people. However, as the number of cases of tile defects in apartment complexes has surged recently, aesthetic factors and quality of life have been reduced, and hundreds of millions of defects have been charged to builders every year. The tile defects in the apartment complexes of 90 domestic complexes are cracked, lifted, damaged, and dropped off. Most of the tile defects are caused by poor construction, but the defect occurrence rate due to thermal stress mechanism is high. Therefore, this paper investigates the case of tile defects in apartment house and identifies the defects and examines the problems that should be improved to reduce the defects of tiles in the building interior.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.4
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• pp.1347-1355
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• 1996

The purpose of this paper is to evaluate the delamination and fracture integrity of the IC plastic package under hygrothermal loading by stress analysis and fracture mechanics approaches. The plastic SOJ package with a dimpled diepad under the reflow slodering process of IR heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal design values of variables to prevent the delamination and fracture of IC package are obtained. In this study, FDM program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.42.2-42.2
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• 2009

연속주조공정에서 용강의 통로, 산화방지 및 유체 흐름을 용이하게 하는 역할을 하는 다공성 노즐(porous nozzle)은 용강과의 직접적인 접촉으로 인한 화학 반응 및 용강의 침투현상을 방지하기 위해 불활성 가스를 주입하여 청정강을 제조하는데 이용된다. 공정 중 노즐 막힘으로 인한 배압상승과 열충격에 의한 크랙(crack) 발생이 문제되고 있으며 신뢰성 향상 연구가 요구되고 있다. 따라서 본 연구에서는 기공크기와 기공분포가 고온안정성 및 내열충격성에 미치는 영향을 알아보고, 내구성 시험 및 고장분석을 통하여 노즐의 신뢰성 향상 방안을 고찰 하였다. 기공을 제어한 시편을 제조하여 기공분포에 따른 고온안정성을 확인하기 위해 실제 사용 조건인 용강온도($1550^{\circ}C$)와 보다 높은 온도($1700^{\circ}C$)에서 각각 고온 시험을 수행하였다. 열충격을 스트레스 인자로 한 내구성 시험을 수행한 후 고장원인을 분석하였으며 열화정도를 확인하기 위해 열처리 온도에 따른 차압 및 굽힘 강도 변화를 비교하였다. 또한 결정상 분석을 통해 온도에 대한 상변화를 확인하였고, 시편의 표면 및 파단면의 미세구조 분석을 통해 크랙 발생여부를 확인하였다. 다공성 노즐의 기공분포가 균일 할수록 고온안정성 및 내열충격성이 향상됨을 확인하였고, 이를 통해 Porous Nozzle의 열화원인으로 판단되는 기공 크기 및 분포에 따른 크랙 발생에 대해 열응력 고찰을 수행하였다.

• Journal of the Korean Ceramic Society
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• v.37 no.8
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• pp.731-738
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• 2000

KLN(K3Li2Nb5O15) has attracted a great deal of attention for their potential usefulness in piezoelectric, electro-optic, nonlinear optic, and pyroelectirc devices. Especially, the KLN single crystal has been studied in the field of optics and electronics. However it is hard to produce good quality single crystals due to the crack propagation during crystal growing. One of the solutions of this problem is prepartion of thin film. But the intensive study has not been conducted so far. In this study, after the KLN thin film were prepared by R.F. magnetron Sputtering method on SiO2/Si substrate, the post-annealing methods of RTA(rapid thermal annealin) and IPA(insitu post annealing) were employed. The deposition condition of KLN thin film was RF power(100 W), Working pressure(100 mtorr). The commonness of both RAT and IPA was that the higher were deposition and post annealing temperature, the higher was the intensity of XRD but the less surface roughness. The difference of post-annealing methods affected XRD phase and surface condition very much. And in IPA process, the influence of O2 had much effect on the formation of KLN phase.

• Korean Journal of Materials Research
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• v.21 no.12
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• pp.650-654
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• 2011

In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.11-15
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• 2018

The parts of equipment for semiconductor are protected by anodic aluminum oxide film to prevent corrosion. This study investigated contamination particle and cracking behavior of anodic oxidation in sulfuric acid containing cerium salt. The insulating properties of the sample were evaluated by measuring the breakdown voltage. It was confirmed that the breakdown voltage was about 50% higher when the cerium salt was added, and that the breakdown voltage after the heat treatment was 55% and 35% higher at $300^{\circ}C$ and $400^{\circ}C$, respectively. After heating at $300^{\circ}C$ and $400^{\circ}C$, cracks were observed in non cerium and cerium 3mM, and more cracks occur at $400^{\circ}C$ than at $30^{\circ}C$. The amount of contamination particles generated in the plasma is about 45% less than that of non-cerium specimens.