Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Effects of Underfills on the Dynamic Bending Reliability of Ball Grid Array Board Assembly

Ball Grid Array 보드 어셈블리의 동적굽힘 신뢰성에 미치는 언더필의 영향

  • Jang, Jae-Won (Advanced Welding & Joining Technology Center, KITECH) ;
  • Bang, Jung-Hwan (Advanced Welding & Joining Technology Center, KITECH) ;
  • Yoo, Se-Hoon (Advanced Welding & Joining Technology Center, KITECH) ;
  • Kim, Mok-Soon (School of Materials Science & Engineering, Inha University) ;
  • Kim, Jun-Ki (Advanced Welding & Joining Technology Center, KITECH)
  • 장재원 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 방정환 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 유세훈 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터) ;
  • 김목순 (인하대학교 금속공학과) ;
  • 김준기 (한국생산기술연구원 용접접합기술센터/마이크로조이닝센터)
  • 투고 : 2011.09.27
  • 심사 : 2011.11.07
  • 발행 : 2011.12.27
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초록

In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.

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