• 한국전기전자재료학회논문지
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• 제13권6호
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• pp.472-477
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• 2000

Oxides of the form Mn$_{4}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-NiO-ZnO present properties that make them useful as power NTC thermistor for current limited. Electrical properties of Mn$_{3}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-NiO-ZnO power NTC thermistor such as I-V characteristics tim constant activation energy and heat dissipation coefficient measured as a function of temperature and composition. In Mn$_{4}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-NiO-ZnO system with the 5wt% addition of Co$_{3}$/O$_{4}$ it can be seen that resistivity and B-constant were increased as the ratio of ZnO/Mn$_{3}$/O$_{4}$ was increased. Heat dissipation constant, I-V characteristics and time constant showed similar behaviour compared with those of conventional thermistors. In particular resistance change ratio ($\Delta$R) the important factor for reliability varied within $\pm$5% indicating the compositions of these products could be available for power thermistor.

• Tribology and Lubricants
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• 제35권1호
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• pp.1-8
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• 2019

Demand for plastic gears are increasing in many industries due to their low production cost, light weight, applicability without lubricant, corrosion resistance and high resilience. Despite these benefits, utilizing plastic gears is limited due to their poor material properties. In this work, DLC coating was applied to improve the tribological properties of polyamide66 gear. 0 V, 40 V, and 70 V of negative bias voltages were selected as a deposition parameter in DC magnetron sputtering system. Pin-on-disk experiment was performed in order to investigate the wear characteristics of the gears. The results of the pin-on-disk experiment showed that DLC coated polyamide66 with 40 V of negative bias voltage had the lowest friction coefficient value (0.134) and DLC coated PA66 with 0 V of negative bias voltage showed the best wear resistance ($9.83{\times}10^{-10}mm^3/N{\cdot}mm$) among all the specimens. Based on these results, durability tests were conducted for DLC coated polyamide66 gears with 0 V of negative bias voltage. The tests showed that the temperature of the uncoated polyamide66 gear increased to about $37^{\circ}C$ while the DLC coated gear saturated at about $25^{\circ}C$. Also, the power transmission efficiency of the DLC coated gear increased by about 6% compared to those without coating. Weight loss of the polyamide66 gears were reduced by about 73%.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• 수산해양기술연구
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• 제40권4호
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• pp.337-343
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• 2004

탄소 섬유강화 에폭시기지 복합재의 경면 가공한 스테인레스 강 상대재와 마찰과 마모에 바탕을 둔 연구에서 다음과 같은 결론을 얻었다. (1) 일방향 탄소섬유 강화 복합재의 마모 거동에 미치는 미끄럼 방향의 효과는 다르며 작용하는 마모 메커니즘의 형태에 의존한다. (2) 상온에서 경면 가공한 스테인리스 스틸에 대하여 미끄럼이 일어나면 AP 방향에서 높은 마모 저항과 낮은 마찰계수가 관찰되었다. (3) 복합재의 비마모율은 미끄럼 속도가 증가하면 N방향과 P방향에서는 감소하는 경향을 보이며, AP 방향에서는 증가하다가 감소한다. 이것은 마모 메카니즘의 영향으로 속도가 증가하면 마모 이착막의 생성이 빨라져 이착막 속의 탄소섬유가 윤활제의 역할을 하기 때문이다. (4) 복합재의 마찰계수는 미끄럼 속도가 증가하면 3방향 모두 증가하다가 일정한 값에 수렴하면 N방향이 가장 크며, P방향과 AP방향 순이다. 이는 N방향에서 마찰초반에 발생한 섬유의 쟁기질에 의한 상대재 표면의 손상과 돌기변형에 따른 것이며, AP방향의 마찰계수가 가장 낮다.

• 콘크리트학회논문집
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• 제16권4호
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• pp.485-492
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• 2004

본 논문에서는 콘크리트의 염소이온에 대한 저항성을 평가하기 위한 대표적인 전기적 촉진시험인 ASTM C 1202 방법을 혼화재를 사용한 콘크리트에 적용하면 콘크리트내의 $OH^-$ 농도의 저하에 따른 영향으로 통과전하량을 낮게 평가할 수 있다는 문제점을 지적하고 이에 해결방안으로 증류수를 사용하는 보정방법을 검토하였다. 실험결과 보정방법 사용시 $OH^-$ 이온과 온도상승에 의한 영향을 배제시킬 수 있었고 NaCl 용액에 장기침지실험을 통해 구한 염화물 확산계수와의 비교시 ASTM C 1202 방법보다 상관성이 높게 나타나 혼화재를 사용한 콘크리트의 염소이온 침투저항성을 보다 정확하게 평가할 수 있는 방법이라 사료된다.

• 한국전기전자재료학회논문지
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• 제27권12호
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• pp.825-830
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• 2014

$[(Co_{1-x}Cu_x)_{0.2}(Ni_{0.3}Mn_{0.7})_{0.8}]_3O_4$ ($0{\leq}x{\leq}1$) thin films prepared by metal organic decomposition process were fabricated on SiN/Si substrate for infrared sensor application. Their structural and electrical properties were investigated with variation of Cu dopant. The $[(Co_{1-x}Cu_x)_{0.2}(Ni_{0.3}Mn_{0.7})_{0.8}]_3O_4$ (CCNMO) film annealed at $500^{\circ}C$ exhibited a dense microstructure and a homogeneous crystal structure with a cubic spinel phase. Their crystallinity was further enhanced with increasing doped Cu amount. The 120 nm-thick CCNMO (x=0.6) thin film had a low resistivity of $53{\Omega}{\cdot}cm$ at room temperature while the Co-free film (x=1) showed a significantly decreased resistivity of $5.9{\Omega}{\cdot}cm$. Furthermore, the negative temperature coefficient of resistance (NTCR) characteristics were lower than $-2%/^{\circ}C$ for all the specimens with $x{\geq}0.6$. These results imply that the CCNMO ($x{\geq}0.6$) thin films are a good candidate material for infrared sensor application.

• 한국전기전자재료학회논문지
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• 제31권5호
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• pp.307-312
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• 2018

Liquid phases in ZnO varistors cause more complex phase development and microstructure, which makes the control of electrical properties and reliability more difficult. Therefore, we have investigated 2 mol% $CaCO_3$ doped $ZnO-Co_3O_4-Cr_2O_3-La_2O_3$ (ZCCLCa) bulk ceramics as one of the compositions without liquid phase sintering additive. The results were as follows: when $CaCO_3$ is added to ZCCLCa ($644{\Omega}cm$) acting as a simple ohmic resistor, CaO does not form a secondary phase with ZnO but is mostly distributed in the grain boundary and has excellent varistor characteristics (high nonlinear coefficient ${\alpha}=78$, low leakage current of $0.06{\mu}A/cm^2$, and high insulation resistance of $1{\times}10^{11}{\Omega}cm$). The main defects $Zn_i^{{\cdot}{\cdot}}$ (AS: 0.16 eV, IS & MS: 0.20 eV) and $V_o^{\bullet}$ (AS: 0.29 eV, IS & MS: 0.37 eV) were found, and the grain boundaries had 1.1 eV with electrically single grain boundary. The resistance of each defect and grain boundary decreases exponentially with increasing the measurement temperature. However, the capacitance (0.2 nF) of the grain boundary was ~1/10 lower than that of the two defects (~3.8 nF, ~2.2 nF) and showed a tendency to decrease as the measurement temperature increased. Therefore, ZCCLCa varistors have high sintering temperature of $1,200^{\circ}C$ due to lack of liquid phase additives, but excellent varistor characteristics are exhibited, which means ZCCLCa is a good candidate for realizing chip type or disc type commercial varistor products with excellent performance.

• 마이크로전자및패키징학회지
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• 제9권2호
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• pp.49-54
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• 2002

Poly-Si/$SiO_2$/Si 하부기판구조 위에 Co 금속을 E-beam evaporation 방식으로 증착하고 급속 열처리 방식을 통해 프린터 heater용 코발트실리사이드 박막을 형성하였다. 급속열처리 온도 (600~$900^{\circ}C$)와 시간 (20~40초)을 변수로 하여 코발트실리사이드의 결정상 및 성분분포를 조사하였다. 또한 제작된 박막의 면저항과 결정특성 분석을 통해 고온에서의 열적 안정성을 확인하였다. $800^{\circ}C$ 온도에서 20초간 급속열처리한 경우 면저항이 약 $0.8 \Omega /\Box$ 인 안정한 $CoSi_2$ 결정상의 코발트실리사이드 박막이 얻어졌다. 그러나 $700^{\circ}C$ 이하의 온도에서는 결정상의 변화에 따라 코발트실리사이드 박막의 면저항이 급격히 증가하였다. 코발트실리사이드 박막의 온도저항계수는 약 $0.0014/^{\circ}C$ 값을 나타내었으며, 프린터 발열체로 응용가능함을 확인 할 수 있었다.

• 센서학회지
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• 제28권1호
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• pp.41-46
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• 2019

In order to develop novel thermal imaging materials for microbolometer applications, $[(Ni_{0.3}Mn_{0.7})_{1-x}Cu_x]_3O_4$ ($0.18{\leq}x{\leq}0.26$) thin films were fabricated using metal-organic decomposition. Effects of Cu content on the electrical properties of the annealed films were investigated. Spinel thin films with a thickness of approximately 100 nm were obtained from the $[(Ni_{0.3}Mn_{0.7})_{1-x}Cu_x]_3O_4$ films annealed at $380^{\circ}C$ for five hours. The resistivity (${\rho}$) of the annealed films was analyzed with respect to the small polaron hopping model. Based on the $Mn^{3+}/Mn^{4+}$ ratio values obtained through x-ray photoelectron spectroscopy analysis, the hopping mechanism between $Mn^{3+}$ and $Mn^{4+}$ cations discussed in the proposed study. The effects of $Cu^+$ and $Cu^{2+}$ cations on the hopping mechanism is also discussed. Obtained results indicate that $[(Ni_{0.3}Mn_{0.7})_{1-x}Cu_x]_3O_4$ thin films with low temperature annealing and superior electrical properties (${\rho}{\leq}54.83{\Omega}{\cdot}cm$, temperature coefficient of resistance > -2.62%/K) can be effectively employed in applications involving complementary metal-oxide semiconductor (CMOS) integrated microbolometer devices.

• 한국의류학회지
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• 제27권5호
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• pp.517-523
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• 2003

We studied the physical properties of silk fabrics after degumming, the dyeability and the color fastness of silk fabrics after degumming and sericin fixing. As the sericin was removed from silk fabrics, the rate of weight loss increased and both the abrasion resistance and the drape coefficient decreased. This means that the amount of the sericin remained in silk fabrics significantly affects the physical properties of silk fabrics. On the surface and the cross-section of silk fabrics, the silk fibers enclosed by the sericin seemed to be in a lump shape. Each fibroin strand, however, got scattered, as the process of degumming went through. The dyeability of silk fabrics degummed decreased at between 20$^{\circ}C$∼80$^{\circ}C$ the dyeing temperature, on the other hand, it significantly increased over 80$^{\circ}C$. The dyeability of the sericin-fixed silk fabrics was lower than that of the non-serin-fixed silk fabrics, to a little extent. The colorfastness of crocking in the dyed-silk fabrics was a little low and that of the sweat was much lower in a basic sweat. Especially, the colorfastness of the partially degummed silk fabrics was low, because the sericin was not stable in the condition of sweat. Therefore, the process of sericin fixing is essentially required, for the partially degummed silk fabrics and the process of degumming itself.