• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.190-195
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• 2005

The hearing aid chip described in this paper is an analog & digital mixed system. The design focuses on the$\mu$DSP core. This $\mu$DSP core includes internal time delays to two inputs from front and rear microphones. The paper consists of two parts; one is the composure and signal processing algorithm of digital hearing aids and the other is Verilog HDL codes for$\mu$DSP cores. All digital modules in the design were coded and synthesized by Verilog HDL codes which were verified by Mentor Graphics and Synopsis semiconductor chip design tools.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.3
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• pp.198-206
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• 2011

This paper presents a new programmable compensation circuit (PCC) for a System-on-Chip (SoC). The PCC is integrated with $0.18-{\mu}m$ BiCMOS SiGe technology. It consists of RF Design-for-Testability (DFT) circuit, Resistor Array Bank (RAB) and digital signal processor (DSP). To verify performance of the PCC we built a 5-GHz low noise amplifier (LNA) with an on-chip RAB using the same technology. Proposed circuit helps it to provide DC output voltages, hence, making the RF system chain automatic. It automatically adjusts performance of an LNA with the processor in the SoC when it goes out of the normal range of operation. The PCC also compensates abnormal operation due to the unusual PVT (Process, Voltage and Thermal) variations in RF circuits.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.1
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• pp.86-93
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• 2010

A system-on-chip (SoC) includes more functions and requires rapidly increased data bandwidth as the development of semiconductor process technology and SoC design methodology. As a result, the data bandwidth of on-chip-networks in SoCs becomes a key factor of the system performance, and the research on the on-chip-network is performed actively. Either AXI or OCP is considered to a substitute of the AHB which has been the most popular on-chip-network. However, they have much increased number of signal wires, which make it difficult to design the interface logic and the network hardware. The compatibility of the protocols with other protocols is not so good. In this paper, we propose a new interface protocol for on-chip-networks to improve the problems mentioned above. The proposed protocol uses less number of signal wires than that of the AHB and considers the compatibility with other interface protocols such as the AXI. According the analysis results, the performance of the proposed protocol per wire is much better than that of the AXI although the absolute performance is slightly inferior.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.116-121
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• 2009

Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this research, two kinds of study are performed. The first is the new design of the clamp and the second is the effect of tolerance parameters to the performance of the system. The clamp with a bent shape is newly designed to hold the nodal point of the flip chip. The second is the effect of the design parameters on the vibration amplitude and planarity at the end of the shank. The variation of the tolerance parameters changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have peat effect on the amplitude of the system.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.832-841
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• 2016

The voltage-frequency island (VFI) design paradigm has strong potential for achieving high energy efficiency in communication centric manycore system-on-chip (SoC) design called network-on-chip (NoC). However, because of the diminished scaling of wire-dimension and supply voltage as well as threshold voltage in modern CMOS technology, the vulnerability to link failure in VFI NoC is becoming a crucial challenge. In this paper, we propose an energy-optimized topology generation technique for VFI NoC to cope with permanent link failures. Based on the energy consumption model, we exploit the on-chip communication traffic patterns and characteristics of link failures in the early design stage to accommodate diverse applications and architectures. Experimental results using a number of multimedia application benchmarks show the effectiveness of the proposed three-step custom topology generation method in terms of energy consumption and latency without any degradation in the fault coverage metric.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.1-10
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• 2020

This paper reviews the recent development of electronic textile technology, mainly focusing on chip-textile bonding. Before the chip-textile bonding, a circuit on the textile should be prepared to supply the electrical power and signal to the chip mounted on the fabrics. Either embroidery with conductive yarn or screen-printing with the conductive paste can be applied to implement the circuit on the fabrics depending on the circuit density and resolution. Next, chip-textile bonding can be performed. There are two choices for chip-textile bonding: fixed connection methods such as soldering, ACF/NCA, embroidery, crimping, and secondly removable connection methods like a hook, magnet, zipper. Following the chip-textile bonding process, the chip on the textile is generally encapsulated using PDMS to ensure reliability like water-proof.

• Design & Manufacturing
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• v.6 no.2
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• pp.74-78
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• 2012

A multi-cavity injection mold system of protein chip for point-of-care with cavity temperature and pressure sensors was proposed in this work. In advance of manufacturing for the multi-cavity injection mold system, a single cavity injection mold system to mold protein chip was considered. Injection molding analysis for the presented system was performed to optimize the process of the molding and suggest guides to design. On the basis of the results for the single cavity system, a multi-cavity injection mold system for protein chip was analyzed, designed and manufactured with cavity temperature and pressure sensors. Results of balanced filling for protein chip models were obtained from the presented mold system.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.7 s.349
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• pp.38-49
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• 2006

In this paper, a novel concept based on embedded processor and reconfigurable logic is proposed for efficient manufacturing test and design verification. Unlike traditional gap between design verification and manufacturing test, proposed concept is to combine both design verification and manufacturing test. The semiconductor chip which is using the proposed concept is named "SwToC" and SwToC stands for System with Test On a Chip. SwToC has two main features. First, it has functional verification function on a chip and this function could be made by using embedded processor, reconfigurable logic and memory. Second, it has internal ATE on a chip and this feature also could be made by the same architecture. To evaluate the proposed SwToC, we have implemented SwToC using commercial FPGA device with embedded processor. Experimental results showed that the proposed chip is possible for real application and could have faster verification time than traditional simulation method. Moreover, test could be done using low cost ATE.

• ETRI Journal
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• v.40 no.6
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• pp.759-773
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• 2018

Uncore components such as on-chip memory systems and on-chip interconnects consume a large amount of energy in emerging embedded applications. Few studies have focused on next-generation analytical models for future chip-multiprocessors (CMPs) that simultaneously consider the impacts of the power consumption of core and uncore components. In this paper, we propose a convex-optimization approach to design heterogeneous uncore architectures for embedded CMPs. Our convex approach optimizes the number and placement of memory banks with different technologies on the memory layer. In parallel with hybrid memory architecting, optimizing the number and placement of through silicon vias as a viable solution in building three-dimensional (3D) CMPs is another important target of the proposed approach. Experimental results show that the proposed method outperforms 3D CMP designs with hybrid and traditional memory architectures in terms of both energy delay products (EDPs) and performance parameters. The proposed method improves the EDPs by an average of about 43% compared with SRAM design. In addition, it improves the throughput by about 7% compared with dynamic RAM (DRAM) design.

• ETRI Journal
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• v.31 no.6
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• pp.732-740
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• 2009

This paper describes the implementation of a digital audio effect system-on-a-chip (SoC), which integrates an embedded digital signal processor (DSP) core, audio codec intellectual property, a number of peripheral blocks, and various audio effect algorithms. The audio effect SoC is developed using a software and hardware co-design method. In the design of the SoC, the embedded DSP and some dedicated hardware blocks are developed as a hardware design, while the audio effect algorithms are realized using a software centric method. Most of the audio effect algorithms are implemented using a C code with primitive functions that run on the embedded DSP, while the equalization effect, which requires a large amount of computation, is implemented using a dedicated hardware block with high flexibility. For the optimized implementation of audio effects, we exploit the primitive functions of the embedded DSP compiler, which is a very efficient way to reduce the code size and computation. The audio effect SoC was fabricated using a 0.18 ${\mu}m$ CMOS process and evaluated successfully on a real-time test board.