Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Bonding Technologies for Chip to Textile Interconnection

칩-섬유 배선을 위한 본딩 기술

  • Kang, Min-gyu (Dept. of Mechanical System Design Engineering, Seoul Nat'l Univ. of Science and Technology) ;
  • Kim, Sungdong (Dept. of Mechanical System Design Engineering, Seoul Nat'l Univ. of Science and Technology)
  • 강민규 (서울과학기술대학교 기계시스템디자인공학과) ;
  • 김성동 (서울과학기술대학교 기계시스템디자인공학과)
  • Received : 2020.12.18
  • Accepted : 2020.12.30
  • Published : 2020.12.30
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Abstract

This paper reviews the recent development of electronic textile technology, mainly focusing on chip-textile bonding. Before the chip-textile bonding, a circuit on the textile should be prepared to supply the electrical power and signal to the chip mounted on the fabrics. Either embroidery with conductive yarn or screen-printing with the conductive paste can be applied to implement the circuit on the fabrics depending on the circuit density and resolution. Next, chip-textile bonding can be performed. There are two choices for chip-textile bonding: fixed connection methods such as soldering, ACF/NCA, embroidery, crimping, and secondly removable connection methods like a hook, magnet, zipper. Following the chip-textile bonding process, the chip on the textile is generally encapsulated using PDMS to ensure reliability like water-proof.

웨어러블 소자를 구현하기 위한 칩-섬유 접합 기술을 중심으로 전자 섬유에 대한 기술 개발 동향을 소개한다. 전자 부품을 섬유에 접합하기 위해서는 먼저 전자 부품에 전원 공급 및 전기적 신호를 주고 받기 위한 회로를 섬유에 구성해야 하며, 회로의 해상도와 밀도에 따라 전도성 실을 이용하는 자수법 또는 전도성 페이스트 등을 이용한 프린트법을 통해 구현할 수 있다. 전자 부품과 섬유를 접합하기 위해서는 솔더링, ACF/NCA, 자수법, 크림핑 등의 방법을 이용하여 영구적으로 접합하거나 후크, 자석, 지퍼 등을 이용하여 탈부착이 가능하도록 접합하는 방법이 있으며, 접합 배선의 밀도 및 용도에 따라서 단독 또는 융합하여 사용한다. 접합 이후에는 방수 등 사용환경에서의 신뢰성을 확보하기 위해 encapsulation 작업을 수행해야 하며, 현재는 PDMS 등의 폴리머를 이용한 방법이 널리 쓰이고 있다.

Keywords

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