• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2001년도 추계학술발표대회 논문개요집
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• pp.7-11
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• 2001

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.40-42
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• 2005

• 한국정밀공학회지
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• 제23권8호
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• pp.27-32
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• 2006

• 디지털콘텐츠학회 논문지
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• 제9권2호
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• pp.363-369
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• 2008

본 논문에서는 superquadric과 Z-버퍼 (Z-buffer) CSG (Constructive Solid Geometry) 렌더링 알고리즘을 이용한 3차원 물체 형상 모델링의 방법을 제안하였다. Superquadric은 몇 개의 계수만으로 다양한 형태의 3차원 모델을 얻을 수 있다. 그리고 CSG 트리 (tree)를 이루는 각각의 기본소 (primitive)는 superquadric과 변형된 superquadric을 가지고 표현하였다. CSG 트리를 구성하는 기본소들간의 집합 연산은 Z-버퍼 알고리즘과 스텐실 버퍼 (stencil buffer)를 사용하여 효과적으로 정의하였다. 본 논문에서 제안한 알고리즘은 단순히 물체의 깊이정보를 비교하여 표현하기 때문에 기존의 implicit 함수를 이용한 물체 표현법에서 각각의 물체의 좌표계를 고려해야 하는 문제점을 해결할 수 있다.

• 한국항공우주학회지
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• 제30권4호
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• pp.18-27
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• 2002

비정렬 격자계에서 continuous adjoint 방정식을 사용하여 비점성 압축성 유동장에서의 이차원 날개꼴에 대한 공력 형상 최적설계를 수행하였다. 정확한 민감도를 구하기 위한 재구성 기법으로는 Laplacian averaging을 사용하였으며, extended stencil을 사용한 최소자승법으로 유동변수의 미분을 구하였다. 또한 유동장과 adjoint 방정식의 적절한 수렴 조건에 대해서 알아보았으며, 이를 이용하여 천음속 비점성 유동장에서 RAE2822 및 NACA0012 날개꼴에 대해서 조파항력 최소화 설계를 수행하였다. 설계된 날개꼴에서 다시 충격파를 복원하는 역설계문제를 적용하여 본 연구에서 사용된 최적설계 기법을 검증하였다.

• 한국생산제조학회지
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• 제21권3호
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• pp.408-414
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• 2012

Screen printing is a printing method that uses a woven mesh to support an ink-blocking stencil by transferring ink or other printable materials in order to form an image onto a substrate. Recently, the screen printing method has applied to micro-electronic packaging by using solder paste as a printable material. For the screen printing of solder paste, metal masks containing a number of micro-holes are used as a stencil material. The metal mask undergoes deformation when it is installed in the screen printing machine, which results in the deformation of micro-holes. In the present study, finite element (FE) analysis was performed to predict the amount of deformation of a metal mask. For an efficient calculation of the micro-holes of the metal mask, the sub-domain analysis method was applied to perform FE analyses connecting the global domain (the metal mask) and the local domain (micro-holes). The FE analyses were then performed to evaluate the effects of slot designs on the deformation characteristics, from which more uniform and adjustable deformation of the metal mask can be obtained.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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• pp.179-212
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• 2006

1. $Welco^{(R)}$ Ultra fine solder powders are suitable for wafer bumping applications; mass production of ultra fine powders with high quality and high yield. - UFP based pastes for wafer bumping by stencil printing ($60-80{\mu}m$ pitch) are now available - Residue free solder flux was developed; meets voids specification of 20%. - F645 type 5 paste is suitable for components 01005

• Journal of the Korean Society for Industrial and Applied Mathematics
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• 제3권2호
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• pp.51-67
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• 1999

The numerical solution of the Navier-Stokes equations in a constricted stepped channel problem has been obtained using a fourth order numerical method. Transformations are made to have a fine grid near the sharp corner and a long channel downstream. The derivatives in the Navier-Stokes equations are replaced by fourth order central differences which result a 29-point computational stencil. A procedure is used to avoid extra numerical boundary conditions near the solid walls. Results have been obtained for Reynolds numbers up to 1000.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.1462-1465
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• 2004

A new method to fabricate metal electrodes on side wall of the microchannel is presented. Coulter counter allows to count the number of cell passing through the microchannel by detecting impedance variation between two electrodes. The relative position of two electrodes is important for sensitivity of impedance measurement. 100nm thick Al electrodes are deposited on the channel side wall by means of shadow evaporation.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2006년도 추계 학술대회논문집
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• pp.74-75
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• 2006

Recently much attention has been drawn to meshfree method since conventional methods such as FDM, FVM and FEM have suffered from difficulty with mesh generation for complex geometry and deformable bodies. In this paper, an upwind point collocation meshfree method developed by the authors is applied to two shock wave diffraction problems. One is the shock diffraction over a 90-degree corner and the other is the single Mach reflection on a ramp. The scheme showed stability and the results showed accuracy.