• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.7
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• pp.3275-3284
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• 2012

This study analyzed a 3D hydrodynamic advection diffusion using the EFDC model (Environmental Fluid Dynamics Code) in the agriculture lake to prevent stratification when we install a water circulator. EFDC model was predicted the range of the water circulator and various operational parameters ware derived for minimize the impact of the internal lake. Through EFDC simulation, water circulation is started overall circulation after 30days and a lake overall circulation showed that it was possible operated the water circulator after about 100days. Also, advection diffusion concentration was low in a lake when water circulator operate intermittent condition than continuous condition. And the entire circulation was stable in this condition. The S/B (Surface/Bottom) ratio can reduce the impact of lake as the surface water mixing a lot of. When the same condition (S/B ratio(3:1)), Case 8 (50days operation: 50days stop) of condition were able to minimize the impact of lake.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.6
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• pp.633-640
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• 2011

In this study, the stabilization of an edge flame and the intensity variation of a diffusion branch were investigated using a multi-slot combustor under conditions of high temperature and small fuel-concentration gradient (FCG). The combustor consists of three narrow channels: a quartz channel and two side-heating combustors. For the accuracy of this experimental study, quantitative analysis was carried out for each boundary condition. Stable edge flames could be observed under high-temperature conditions by controlling the FCG and fuel dilution ratio. Moreover, it was found that the intensity of the diffusion flame was increased by increasing the temperature of the mixture. On the contrary, the intensity of the diffusion flame was decreased by increasing the dilution ratio. It was also found that a propane flame is more sensitively affected by these experimental parameters than a methane flame.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.8
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• pp.857-864
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• 2012

A linear stability analysis of a diffusion flame with radiation heat loss is performed to identify linearly unstable conditions for the Damk$\ddot{o}$hler number and radiation intensity. We adopt a counterflow diffusion flame with unity Lewis number as a model. Near the kinetic limit extinction regime, the growth rates of disturbances always have real eigenvalues, and a neutral stability condition perfectly falls into the quasi-steady extinction. However, near the radiative limit extinction regime, the eigenvalues are complex, which implies pulsating instability. A stable limit cycle occurs when the temperatures of the pulsating flame exceed the maximum temperature of the steady-state flame with real positive eigenvalues. If the instantaneous temperature of the pulsating flame is below the maximum temperature, the flame cannot recover and goes to extinction. The neutral stability curve of the radiation-induced instability is plotted over a broad range of radiation intensities.

• Korean Journal of Materials Research
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• v.9 no.5
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• pp.503-508
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• 1999

We have investigated the physical and diffusion barrier property of Ti-Si-N film for Cu metallization. The ternary compound was deposited by using reactive rf magnetron sputtering of a TiSi$_2$target in an Ar/$N_2$gas mixture. Resistivities of the films were in range of 358$\mu$$\Omega$-cm, to 307941$\mu$$\Omega$-cm, and tended to increase with increasing the $N_2$/Ar flow rate ratio. The crystallization of the Ti-Si-N compound started to occur at 100$0^{\circ}C$ with the phases of TiN and Si$_3$N$_4$identified by using XRD(X-ray Diffractometer). The degree of the crystallization was influenced by the $N_2$/Ar flow ratio. The diffusion barrier property of Ti-Si-N film for Cu metallization was determined by AES, XRD and etch pit by secco etching, revealing the failure temperature of 90$0^{\circ}C$ in 43~45at% of nitrogen content. In addition, the very thin compound (10nm) with 43~45at% nitrogen content remained stable up to $700^{\circ}C$. Furthermore, thermal treatment in vacuum at $600^{\circ}C$ improved the barrier property of the Ti-Si-N film deposited at the $N_2$(Ar+$N_2$) ratio of 0.05. The addition of Ti interlayer between Ti-Si-N films caused the drastic decrease of the resistivity with slight degradation of diffusion barrier properties of the compound.

• Journal of the Korean Magnetics Society
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• v.18 no.1
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• pp.32-35
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• 2008

Thermally stable diffusion barrier of tungsten carbon nitride(W-C-N) and of tungsten boron carbon nitride(W-B-C-N) thin films have studied to investigate the impurity behaviors of boron and nitrogen. In this paper we newly deposited tungsten boron carbon nitride(W-B-C-N) thin film for various $W_2B$ target power on silicon substrate. The impurities of the 100nm-thick W-C-N and W-B-C-N thin films provide stuffing effect for preventing the inter-diffusion between W-C-N or W-B-C-N thin films and silicon during the high temperature($700^{\circ}C{\sim}1000^{\circ}C$) annealing process.

• Journal of the Korean Electrochemical Society
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• v.11 no.4
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• pp.304-308
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• 2008

Noble Poly (lithium 2-acrylamido-2-methyl propane sulfonate) and its copolymer with N-vinyl formamide based on trihexyl (tetradecyl) phosphonium acetate [$(C_6H_{13})_3$ P ($C_{14}H_{29}$) $CH_3COO$; $P_{66614}$ $CH_3COO$] and trihexyl (tetradecyl)phosphonium bis(trifluoromethane sulfonyl) amide ([$(C_6H_{13})_3P(C_{14}H_{29})$] [TFSA];$P_{66614}TFSA$) were prepared and analyzed to determine their characteristics and properties. The ionic conductivity of a copolymer based $P_{66614}TFSA$ ionic liquid system exhibits a higher conductivity ($8.9{\times}10^{-5}Scm^{-1}$) than that of a copolymer based $P_{66614}CH_3COO$ system ($1.57{\times}10^{-5}Scm^{-1})$. The charge on the TFSA anion is spread very diffusely through the S-N-S core and particularly in the trifluoromethane groups, and this diffusion results in a decreased interaction between the cation and the anion. The viscosity of $P_{66614}TFSA$ (39 cP at 343 K) and $P_{66614}CH_3COO$ (124 cP at 343 K), which is very hydrophobic, was fairly high. High viscosity leads to a slow rate of diffusion of redox species. The ionic conductivity of copolymer of a phosphonium ionic liquid system also exhibits higher conductivity than that of a homopolymer system. Phosphonium ionic liquids were thermally stable at temperatures up to $400^{\circ}C$.

• Journal of the Korean Vacuum Society
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• v.7 no.2
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• pp.77-81
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• 1998

The eptiaxial growth of Ge on the clean and surfactant (Sn) adsorbed surface of Ge(111) was studied by the intensity oscillation of a RHEED specular spot. In the case of epitaxial growth without the adsorbed surfactant, the RHEED intensity oscillation was stable and periodic up to 24 ML at the substrate temperature of $200^{\circ}C$. Therefore the optimum temperature for the epitaxial growth of Ge on clean Ge(111) seems to be $200^{\circ}C$. However, in the case of epitaxial growth with the adsorbed surfactant, the irregular oscillations are observed in the early stage of the growth. The RHEED intensity osicillation was very stable and periodic up to 38 ML, and the d2$\times$2 structure was not charged with continued adsorption of Ge at the substrate temperature of 2002$\times$2. These results may be explained by the fact that the diffusion length of Ge atoms is increased by decreasing the activation energy of the Ge surface diffusion, resulted by segregation of Sn toward the growing surface.

• Corrosion Science and Technology
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• v.9 no.3
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• pp.129-136
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• 2010

The corrosion behaviors of 316L stainless steel were investigated in simulated anodic and cathodic environments for proton exchange membrane fuel cell (PEMFC) by using electrochemical measurement techniques. Interfacial contact resistance(ICR) between the stainless steel and gas diffusion layer(GDL) was also measured. The possibility of 316L was evaluated as a substitute material for the graphite bipolar plate of PEMFC. The value of ICR decreased with an increase in compaction stress(20 N/$cm^2$~220 N/$cm^2$) showing the higher values than the required value in PEMFC condition. Although 316L was spontaneously passivated in simulated cathodic environment, its passive state was unstable in simulated anodic environment. Potentiostatic and electrochemical impedance spectroscopy (EIS) measurement results showed that the corrosion resistance in cathodic condition was higher and more stable than that in anodic condition. Field emission scanning electron microscopy (FE-SEM), and inductively coupled plasma(ICP) were used to analyze the surface morphology and the metal ion concentration in electrolytes.

• Water for future
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• v.28 no.6
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• pp.119-131
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• 1995

Two-dimensional diffusion and kinematic hydrodynamic models have been studied for preparing the flood inundation map. The models have been tested by applying to one-dimensional dam-break problem. The results have good agreements compared with those of dynamic wave model. The diffusion wave model produces the mass conservation error close to zero. Floodwave analyses for two-dimensional floodplain with obstruction and channel-floodplain show both stable and efficient results. The model presented in this study can be used for flood inundation map and flood warning system.

• Korean Journal of Materials Research
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• v.13 no.5
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• pp.338-342
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• 2003

Adhesion between Cu and low-k films has been investigated. Low-k films deposited using a mixture of hexamethyldisilane(HMDS) and Para-xylene had a dielectric constant as low as 2.7, showing the thermally stable properties up to $400^{\circ}C$. In this study, Ti glue layer, boron dopant, and $N_2$plasma treatment were used to improve adhesion property of between Cu and low-k films. Ti glue layer slightly improved adhesion property. After $N_2$plasma treatment, the adhesion property was significantly improved due to the increased roughness and the formation of new binding states between Ti and plasma-treated PPpX : HMDS. However, $300^{\circ}C$ annealing of $N_2$plasma treated sample caused the diffusion of Cu into the PPpX : HMDS, degrading the low-k properties. In the case of Cu(B)/Ti/PPpX : HMDS, the adhesion was remarkably increased. This enhanced adhesion was attributed to formation of Ti-boride at the Cu-Ti interface. It is because the formed Ti-boride prevented the diffusion of Cu into the PPpX : HMDS and the Cu-Ti reaction at the Ti interface.