• Analytical Science and Technology
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• v.7 no.3
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• pp.293-299
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• 1994

Fifty ancient Korean coins originated in Choson period have been determined for 11 elements such as Sn, Fe, As, Au, Co, Sb, Ir, Os, Ru and Ni by destructive and non-destructive neutron activation analysis as well as for 3 elements such as Cu, Pb and Zn by atomic absorption spectroscopy. The multivariate data have been analyzed by principal component mapping method. The spread of sample points in the eigenvector polt has been attributed to common origins of some elements.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.481-486
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• 2010

ENIG (electroless Ni immersion gold) is one of surface finishing which has been most widely used in fine pitch SMT (surface mount technology) and BGA (ball grid array) packaging process. The reliability for package bondability is mainly affected by interfacial reaction between solder and surface finishing. Since the behavior of IMC (intermetallic compound), or the interfacial reaction between Ni and solder, affects to some product reliabilities such as solderability and bondability, understanding behavior of IMC should be important issue. Thus, we studied the properties of ENIG with P contents (9 wt% and 13 wt%), where the P contents is one of main factors in formation of IMC layer. The effect of P content was discussed using the results obtained from FE-SEM(field-emission scanning electron microscope), EPMA(electron probe micro analyzer), EDS(energy dispersive spectroscopy) and Dual-FIB(focused ion beam). Especially, we observed needle type irregular IMC layer with decreasing Ni contents under high P contents (13 wt%). Also, we found how IMC layer affects to bondability with forming continuous Kirkendall voids and thick P-rich layer.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.47-54
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• 2008

In this paper, we studied how and why did abnormal IMC growth at component affect on board level mechanical reliability. First, interfacial reactions between Sn2.5Ag0.5Cu solder and electrolytic Ni/Au UBM of component side were investigated with reflow times and thermal aging time. Also, to compare mechanical reliability of component level, shear energy was evaluated using the ball shear test conducted with variation of shear tip speed. Finally, to evaluate mechanical reliability of board level, we surface-mounted component fabricated with each condition on PCB side. After conducting of 3 point bending test and impact test, we confirmed solder joint crack mode using cross-sectioning and dye & pry penetration method.

• The Korean Journal of Mycology
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• v.14 no.3
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• pp.209-214
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• 1986

In order to study the trehalase (EC 3. 2. 1. 28) from mushroom, Agaricus bisporus Lange Sing., the crude trehalase preparation was separated by fractionation of mushroom extracts with ammonium sulfate between 0.4 and 1.0 saturation, and its properties were examined. Mushroom trehalase showed optimum pH 6.0, and optimum temperature $40^{\circ}C$. The enzyme was stable at pH range between 5.0 and 7.0, and at temperature below $50^{\circ}C$. The activities of crude trehalase had proportional relations with enzyme concentrations below 490.2 mg % of protein and with substrate concentration below $2.6{\times}10^{-3}M$, showing a Km value of 0.760 mM. The enzyme was inhibited by some metal ions such as $Sn^{2+}$, $Ca^{2+}$, $Hg^{2+}$, $Cd^{2+}$, $Cu^{2+}$, $Mn^{2+}$, $Zn^{2+}$, $Al^{3+}$, and $Fe^{3+}$, while $Ag^{+}$, $Ba^{2+}$, and $Mg^{2+}$ demonstrated remarkable increasing effects on the enzyme activity.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.81-81
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• 2009

최근 휴대폰, 노트북 등과 같은 소형 멀티미디어 기기의 사용이 증가함에 따라 전자 패키징 산업은 경박단소화를 요구하고 있습니다. 더불어 전기적 신호의 손실을 줄이기 위해 전기, 전자산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(Flexible Printed Circuit Board, FPCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(Rigid Printed Circuit Board, RPCB)의 전극간 접합에 많은 관심을 보이고 있습니다. 기존에 연성인쇄회로기판과 경성인쇄회로기판을 접합하는 방식으로는 connector를 이용한 체결법이 사용되고 있지만 완성품의 부피가 커지고 자동화 공정이 힘들며 I/O 개수가 제한적이어서 신호전달에 취약한 단점이 있습니다. 또한, 최근 FPCB를 RPCB에 접합하는데 interconnection으로 이방성 도전 필름(Anisotropic conductive film, ACF) 또는 비전도성 필름(Non-conductive film)이 널리 사용되고 있습니다. 하지만 필름의 가격이 비싸고, 낮은 전기 전도도를 보이며, 신뢰성 특성이 낮다는 단점을 가지고 있습니다. 본 실험에서는 기존의 connector 방식과 접착 필름을 이용한 방식을 대체하기 위하여 솔더를 interlayer로 이용하여 열과 압력으로 접합하는 방법에 대하여 연구하였습니다. 실험에 사용된 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)이고, RPCB와 FPCB의 표면처리는 ENIG로 하였습니다. 접합 온도와 접합 시간에 따라 최적의 접합 조건을 도출하고자 하였고, 접합된 시편을 가지고 신뢰성 테스트를 진행하였습니다. $85^{\circ}C$/85% 고온고습 시험과 고온 방치 시험을 통하여 접합부의 신뢰성을 테스트 하였고, 90도 Peel test로 기계적 접합 강도를 측정하였고, 파괴 단면을 Scanning Electron Microscopy (SEM), Energy-dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS)로 분석하였습니다.

• Korean Journal of Heritage: History & Science
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• v.49 no.3
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• pp.4-11
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• 2016

This study compares eight bronze spoons in the Goryeo Dynasty and analyzes their components and lead isotopes in order to confirm the relationship between their production sites and excavation sites. Most of the excavated spoons have elliptical heads, and their handles are categorized into two types. Bronze spoons are made of binary Cu-Sn alloys, but Pb is not added. The same artifacts can have different trace elements depending on location, and the spoons had high Ag content. According to an analysis of their lead isotopic ratio, they were made with raw materials produced in Zone 3 of the South Korean galena map. If the data of the trace elements in the raw ores of the bronze is accumulated, it can be used to indicate the provenance of the artifacts.

• Analytical Science and Technology
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• v.22 no.5
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• pp.422-431
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• 2009

The analytical results of wear metals such as Na, Mg, Al, Si, P, Ca, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Mo, Ag, Cd, Sn, Ba, Pb in oil samples are compared by portable and bench-top XRF methods as a basic study for the development of portable X-ray fluorescence spectrometer. The instrumental parameters such as measurement time of portable and bench-top XRF were optimized using certified reference materials of hydrocarbon oil with 20 wear metals in concentration range from 10 to 900 mg/kg. The analytical results of 20 wear metals in certified reference materials and new/used engine oil samples were compared by empirical and fundamental parameter methods.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.1
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• pp.1-8
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• 2017

Catalytic synthesis and properties of ${\beta}-Ga_2O_3$ nanowires grown by metal organic chemical vapor deposition are reported. Au, Ni and Cu catalysts were suitable for the growth of $Ga_2O_3$ nanowires under our experimental conditions. The $Ga_2O_3$ nanowires grown by using Au, Ni and Cu catalysts showed different growth rates and morphologies in each case. We found the $Ga_2O_3$ nanowires were grown by the Vapor-Solid (VS) process when Ni was used as a catalyst while the Vapor-Liquid-Solid (VLS) was a dominant process in case of Au and Cu catalysts. Also, we found nanowires showed different optical properties depend on catalytic metals. On the other hand, for the cases of Ti, Sn and Ag catalysts, nanowires could not be obtained under the same condition of Au, Cu and Ni catalytic synthesis. We found that these results are related to the different characteristics of each catalyst, such as, melting points and phase diagrams with gallium metal.

• Journal of Applied Reliability
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• v.5 no.3
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• pp.327-342
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• 2005

전자 패키지가 열을 받을 때 회로기판과 칩의 열팽창계수 차이에 의해 발생되는 응력은 솔더 조인트의 파손에 영향을 미친다. 본 연구에서는 이 영향을 정량적으로 규명하기 위하여 열충격시험기를 이용해 얻어진 솔더 조인트의 전기저항 변화와 수명과의 상관관계를 규명하였고, BGA솔더 조인트의 수명을 정량적으로 도출하였다. 또한 Sn-3.5Ag-0.5Cu 무연 솔더와 63Sn-37Pb 유연 솔더를 위의 실험에 동시에 적용시켜 건전성을 FORM(first-order reliability method)과 Weibull Function Model을 이용해 비교하였다.