• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.80-81
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• 2008

Schottky barrier thin film transistors (SB-TFT) on polycrystalline silicon(poly-Si) are fabricated by platinum silicided source/drain for p-type SB-TFT. High quality poly-Si film were obtained by crystallizing the amorphous Si film with excimer laser annealing (ELA) or solid phase crystallization (SPC) method. The fabricated poly-Si SB-TFTs showed low leakage current level and a large on/off current ratio larger than $10^5$. Significant improvement of electrical characteristics were obtained by the additional forming gas annealing in 2% $H_2/N_2$ ambient, which is attributed to the termination of dangling bond at the poly-Si grain boundaries as well as the reduction of interface trap states at gate oxide/poly-Si channel.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.5
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• pp.38-45
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• 1989

We have studied the electrical characteristics of the hydrogenated amorphous silicon (a-Si:H) ambiploar thin film transistors (TET'S)using 100ppm boron-doped a-Si:H as an active layer. The enhancement of drain current due to the double injection behavior has been observed in the p-channel operation of the TFT. The drain current decreases with time in streched exponential form when the gate voltage is positive. The result indicates that the dangling bonds created by electron accumulation show identical time dependence as the diffusion of hydrogen in the film. We observed the experimental evidence that the doping efficiency changes either when the gate bias is applied or when the light is illuminated on boron-doped a-Si:H.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.3
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• pp.213-225
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• 2002

Metal-Ferroelectric- Insulator- Silicon (MFIS) structured field effect transistor (FET) device was fabricated and characterized. Important issues to realize ferroelectric gate field effect transistor device were summarized in three sections. The choice of interlayer dielectric was made in the consideration of device functionality and chemical reaction between ferroelectric materials and silicon surface during fabrication process. Also, various ferroelectric thin film materials were taken into account to meet desired memory window and process compatibility. Finally, MFIS structured FET device was fabricated and important characteristics were discussed. For feasible integration of current device as random access memory array cell address schemes were also suggested.

• Journal of Sensor Science and Technology
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• v.14 no.6
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• pp.374-380
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• 2005

Vibration sensors have a wide scope of applications in the field of monitoring systems that needs to perceive an undesirable physical vibration before a critical failure occurs in a system, and then costly unplanned repairs can be avoided. The conventional vibration sensors developed so far have many disadvantages, such as complex manufacturing process, bulkiness, high cost, less reliability and so on. This paper reports a simple-structured vibration sensor, which has been developed using a commercialized conductive ball and silicon bulk-micromachining technology. The sensor consists of a conductive ball placed in $600{\mu}m$-deep micromachined silicon groove, in which Au thin film has been patterned using a shadow mask technique. Prior to the formation of the Au thin film, the sharp convex corner was rounded for smooth meatl deposition on the non-planar surface at the edge of the groove. The measurement results of the fabricated vibration sensor demonstrate a stable response characteristic to low-frequency vibration range ($1{\sim}30{\;}Hz$).

• Journal of the Korean Society for Precision Engineering
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• v.29 no.11
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• pp.1164-1169
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• 2012

This paper presents a study of an integrated infrared (IR) photo sensor for display application. We fabricated hydrogenated amorphous silicon thin film transistor (a-Si:H TFT) and hydrogenated amorphous silicon germanium thin film transistor (a-SiGe:H TFT) which were bottom gate structure. We investigated the dependence of a-SiGe:H TFT characteristics on incident wavelengths. We proposed photo sensor which responded to wavelengths of IR region. Proposed pixel circuit of photo sensor was consists of switch TFT and photo TFT, and one capacitor. We developed integrated photo sensor circuit and investigated the performance of the proposed sensor circuit according to the input wavelengths. The developed photo sensor circuit with a-SiGe:H TFT was suitable for IR.

• KSTLE International Journal
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• v.7 no.1
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• pp.14-17
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• 2006

In this paper, we report on the replication of surface topography of natural leaf of Lotus onto thin polymeric films using a capillarity-directed soft lithographic technique. PDMS molds were used to replicate the surface. The replication was carried out on poly(methyl methacrylate) (PMMA) film coated on silicon wafer. The patterns so obtained were investigated for their friction properties at micro-scale using a ball-on-flat type micro-tribo tester, under reciprocating motion. Soda lime balls (1 mm diameter) were used as counterface sliders. Friction tests were conducted at a constant applied normal load of $3000{\mu}N$ and speed of 1mm/s. All experiments were conducted at ambient temperature ($24{\pm}1^{\circ}C$) and relative humidity ($45{\pm}5%$). Results showed that the patterned samples exhibited superior tribological properties when compared to the silicon wafer and non patterned sample (PMMA thin film). The reduced real area of contact projected by the surfaces was the main reason for their enhanced friction property.

• Bulletin of the Korean Chemical Society
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• v.28 no.4
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• pp.533-537
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• 2007

This paper describes the heteroepitaxial growth of single-crystalline 3C-SiC (cubic silicon carbide) thin films on Si (100) wafers by atmospheric pressure chemical vapor deposition (APCVD) at 1350 oC for micro/nanoelectromechanical system (M/NEMS) applications, in which hexamethyldisilane (HMDS, Si2(CH3)6) was used as a safe organosilane single-source precursor. The HMDS flow rate was 0.5 sccm and the H2 carrier gas flow rate was 2.5 slm. The HMDS flow rate was important in obtaing a mirror-like crystalline surface. The growth rate of the 3C-SiC film in this work was 4.3 μm/h. A 3C-SiC epitaxial film grown on the Si (100) substrate was characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), reflection high energy electron diffraction (RHEED), atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and Raman scattering, respectively. These results show that the main chemical components of the grown film were single-crystalline 3C-SiC layers. The 3C-SiC film had a very good crystal quality without twins, defects or dislocations, and a very low residual stress.

• Journal of Korea Foundry Society
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• v.32 no.6
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• pp.261-268
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• 2012

The effects of thickness, base element and additive to inoculant on the number of eutectic cells and chill depth of thin-section gray cast iron were investigated. Meanwhile the number of eutectic cells increased by inoculation, chill depth decreased. The former decreased and the latter increased by holding the melt at the temperature range between 1,450 and $1,500^{\circ}C$. The former was more for the thinner casting with the thickness of 5 mm than the other. The result of thermal analysis coincided well with the change of macrostructure. The former increased and the latter decreased with the increased contents of carbon, silicon and the silicon content by inoculation. The former decreased and the latter increased with increased manganese content. The number of eutectic cells decreased as the amounts of rare earth and the bismuth added to this inoculant increased. With the addition of sulfur of 0.10 wt% of the weight of this inoculant, the maximum number of eutectic cells was obtained.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.181-186
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• 2005

We fabricated thin films of polystyrene-block-poly(methyl methacrylate)(PS -b-PMMA) on the self-assembled monolayers(SAM) of 3-(p-methoxyphenyl)propyltrichlorosilane(MPTS) on silicon wafers. Cylindrical nanodomains of PMMA or PS were oriented perpendicular to the surface of silicon wafers due to the neutral affinity of the SAM to PS and PMMA blocks. By selective removal of the PMMA block with UV irradiation and washing, nanoporous films and nanorod assemblies were produced. The nanoporous film can be used for a nanolithographical mask.

• Journal of the Korean Ceramic Society
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• v.43 no.8 s.291
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• pp.492-497
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• 2006

SiC coating has been introduced as protective layer in TRISO nuclear fuel particle of High Temperature Gas cooled Reactor (HTGR) due to excellent mechanical stability at high temperature. In order to inhibit the failure of the TRISO particles, it is important to evaluate the fracture strength of the SiC coating layer. ]n present work, thin silicon carbide coating was fabricated using chemical vapor deposition process with different microstructures and thicknesses. Processing condition and surface status of substrate.affect on the microstructure of SiC coating layer. Sphere indentation method on trilayer configuration was conducted to measure the fracture strength of the SiC film. The fracture strength of SiC film with different microstructure and thickness were characterized by trilayer strength measurement method nanoindentation technique was also used to characterize the elastic modulus and th ε hardness of the SiC film. Relationships between microstructure and mechanical properties of CVD SiC thin film were discussed.