• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3322-3324
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• 1999

This paper studies on the design and fabrication of a micro in-plane positioning actuator integrated with a microlens. Proposed in-plane actuator is a micro XY-stage which is composed of two linear comb drive actuators being orthogonal to each other. In the fabrication of actuator, the single crystalline silicon substrate anodically bonded with a #7740 glass substrate is used because of simple release and passivation. The structure of actuator is formed on the silicon facet of bonded fixture by chlorine-based deep RIE and then released by isotropic wet etching of glass (#7740) in hydrofluoric acid solution. Fabricated actuator has a large travel range up to $30({\pm}15){\mu}m$ and high resolution less than 0.01f1l1l in each direction. Experimented resonant frequency of this actuator is 630Hz. The micro-Fresnel lens is fabricated on the square-shape glass structure prepared in the center of actuator.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3268-3270
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• 1999

This paper presents the fabrication of a micro electromagnetic flowmeter for liquid flow rate measurement. The flowmeter consists of a silicon flow channel with two electrodes and two permanent magnets. The micro flow channel and the detection electrodes are fabricated by the anisotropic etching of two silicon substrates and the metal evaporation process respectively. If conductive fluid passes through a magnet field, electromotive force is generated and detected by two electrodes. When the flow rate is 2.6 ml/sec, the measured output voltage is 7.4 mV.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1912-1913
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• 2003

This paper presents a variable optical attenuator (VOA) that is fabricated using bosch deep silicon etching process [1] with silicon-on- insulator (SOI) wafer. The VOA consists of driving electrode, ground electrode, actuating mirror, and mechanical slower. In this VOA, actuating mirror is driven by electrostatic force [2] and the pull-in voltage is close to 13V, 28 V, 46V come along with the spring width of $3{\mu}m,\;5{\mu}m,\;7{\mu}m$ respectively.

• KSTLE International Journal
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• v.8 no.2
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• pp.26-28
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• 2007

Si(100) surfaces were topographically modified i.e. the surfaces were patterned at micro-scale using photolithography and DRIE (Deep Reactive Ion Etching) fabrication techniques. The patterned shapes included micro-pillars and microchannels. After the fabrication of the patterns, the patterned surfaces were chemically modified by coating a thin DLC film. The surfaces were then evaluated for their friction behavior at micro-scale in comparison with those of bare Si(100) flat, DLC coated Si(100) flat and uncoated patterned surfaces. Experimental results showed that the chemically treated (DLC coated) patterned surfaces exhibited the lowest values of coefficient of friction when compared to the rest of the surfaces. This indicates that a combination of both the topographical and chemical modification is very effective in reducing the friction property. Combined surface treatments such as these could be useful for tribological applications in miniaturized devices such as Micro-Electro-Mechanical-Systems (MEMS).

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.116-117
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• 2009

식각 공정변화 즉 상부 ICP 파워, 반응기 압력, 실리콘 기판 온도변화에 따른 실리콘 딥 비어 (deep via) 의 형상 변화 메커니즘을 연구하였다. 메커니즘을 연구하기 위해 $SF_6/O_2$ 플라즈마에 노출된 실리콘 기판의 공정변화에 따른 표면 온도변화를 실시간으로 측정하여 플라즈마 내 positive ions의 거동을 분석하였다. 실리콘 기판의 표면온도를 상승시키는 주된 요인은 positive ions임을 확인할 수 있었으며 이는 기판에 적용된 negative voltage로 인하여 나타난 이온포격이 그 원인임을 알 수 있었다. 상대적으로 radical은 실리콘 표면온도 상승에 큰 역할을 하지 못하였다. 기판 표면온도가 상승 할수록 실리콘 딥 비어 구조에 undercut, local bowing과 같은 측벽 식각이 활성화됨을 확인할 수 있었으며 이는 기판에 들어오는 positive ions가 측벽식각을 유도하는 것으로 해석할 수 있었다.

• Journal of Korean Vacuum Science & Technology
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• v.3 no.2
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• pp.116-120
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• 1999

Possible role of hydrogen atoms on the formation of microcrystalline silicon films was schematically investigated using a plasma enhanced chemical vapor deposition system. A layer-by-layer technique that can alternate deposition of ${\alpha}$-Si thin film and then exposure of H2 plasma was used for this end. The experimental process was extensively carried out under different hydrogen plasma times (t2) at a fixed number of 20 cycles in the deposition. structural properties, such as crystalline volume fractions and grain shapes were analyzed by using a Raman spectroscopy and a scanning electron microscopy. Electrical transports were characterized by the temperature dependence of the dark conductivity that gives rise to the calculation of activation energy (Ea). Optical absorption was measured using an ultra violet spectrophotometer, resulting in the optical energy gap (Eopt). Our experimental results indicate that both of the hydrogen etching and the structural relaxation effects on the film surface seem to be responsible for the growth mechanism of the crystallites in the ${\mu}$c-si films.

• Proceedings of the Korean Vacuum Society Conference
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• 2009.08a
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• pp.227-227
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• 2009

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.134-134
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• 2006

• Proceedings of the Optical Society of Korea Conference
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• 2007.07a
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• pp.319-320
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• 2007

We report on the fabrication of two-dimensional Silicon On Insulator (SOI) photonic crystal (PhC) superprism. To optimize the design of 2-D SOI PhC superprism, the photonic band structures (TE-polarization) for triangular lattices and the dispersion surfaces were calculated and analyzed by the plane wave expansion method. Dense 2-D SOI PhC superprism nanostructures with taper input and output waveguide microstructures were successfully fabricated by nanoimprint lithography, followed by inductively coupled plasma (ICP) etching.

• Restorative Dentistry and Endodontics
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• v.30 no.6
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• pp.493-504
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• 2005

This study was performed to investigate the compatibility between 4 dentin adhesives and 4 resin luting cements. Dentin adhesives used in this study were All-Bond 2 (Bisco Inc., Schaumbrug, IL, USA), Clearfil SE-Bond (Kuraray Medical Inc, Osaka, Japan), Prompt L-Pop (3M Dental Products, St. Paul, MN, USA), One-Up Bond F (Tokuyama corp., Tokyo, Japan) Resin luting cements used in this study were Choice (Bisco Inc., Schaumbrug, IL, USA), Panavia F (Kuraray Medical Inc, Osaka, Japan), RelyX ARC (3M Dental Products, St. Paul, MN, USA) Bistite II DC (Tokuyama corp., Tokyo, Japan). Combination of each dentin adhesive and corresponding resin cement was made to 16 experimental groups. Flat dentin surfaces was created on mid-coronal dentin of extracted mandibular third molars, then dentin surface was polished with 320-grit silicon carbide abrasive papers. Indirect resin composite block (Tescera, Bisco) was fabricated. Its surface for bonding to tooth was polished with silicon carbide abrasive papers Each dentin adhesive was treated on tooth surface and resin composite overlay were luted with each resin cement. Each bonded specimen was poured in epoxy resin and sectioned occluso-gingivally into 1.0mm thick slab, then further sectioned into $1.0{\times}1.0mm^2$ composite-dentin beams. Microtensile bond strength was tested at a crosshead speed of 1.0mm/min. The data were analysed by one-way ANOVA and Duncan's multiple comparison tests The results of this study were as follows, 2-step self-etching dentin adhesive which has additional bonding resin is more comparison than tests. self-etching dentin adhesive.