• 제목/요약/키워드: Silicon bipolar transistor

검색결과 35건 처리시간 0.023초

전력용 MOSFET의 특성 및 기술동향 (The Characteristics and Technical Trends of Power MOSFET)

  • 배진용;김용
    • 전기학회논문지
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    • 제58권7호
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    • pp.1363-1374
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    • 2009
  • This paper reviews the characteristics and technical trends in Power MOSFET technology that are leading to improvements in power loss for power electronic system. The silicon bipolar power transistor has been displaced by silicon power MOSFET's in low and high voltage system. The power electronic technology requires the marriage of power device technology with MOS-gated device and bipolar analog circuits. The technology challenges involved in combining power handling capability with finger gate, trench array, super junction structure, and SiC transistor are described, together with examples of solutions for telecommunications, motor control, and switch mode power supplies.

캐비티 동조에 의한 마이크로파 트란지스터 발진기 (Microwave Transistor Oscillator by Cavity Rexsonator)

  • 장익수;김병철
    • 대한전자공학회논문지
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    • 제19권5호
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    • pp.20-25
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    • 1982
  • 무조건 안정한 트란지스터를 요구하는 주파수에서 케비티 공진궤환 루우프를 이용하여 마이크로파 발진기를 설계하는 방법을 제시한다. 필요한 주파수로 공진하는 높은 Q의 공진기를 궤환 루우프로 걸어줌으로써 그 주파수에서만 트란지스터치 출력 임피던스의 실수부가 부저항 특성을 갖게 할 수 있으므로, 주파수가 안정한 발진기를 구성한다. 본 연구에서는 실리콘 바이폴라 TR HXTR 2101과 Q가 크며, 실제 크기가 작은 리엔트런트 캐비티를 이용하여 발진 주파수 2.33GHz, 발진출력 10mW의 발진기를 실현하여 보았다.

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전력용 MOSFET의 특성 (The Characteristics of Power MOSFET)

  • 배진용;김용;권순도;조규만;엄태민
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2009년도 춘계학술대회 논문집 에너지변화시스템부문
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    • pp.131-135
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    • 2009
  • This paper reviews the characteristics of Power MOSFET device technology that are leading to improvements in power loss for power electronic system. The silicon bipolar power transistor has been displaced by silicon power MOSFET's in low and high voltage system. The power electronic technology requires the marriage of power device technology with MOS-gated device and bipolar analog circuits.

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고온에서 제작된 n채널 다결정 실리콘 박막 트랜지스터의 단채널 효과 연구 (A Study on Short Channel Effects of n Channel Polycrystalline Silicon Thin Film Transistor Fabricated at High Temperature)

  • 이진민
    • 한국전기전자재료학회논문지
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    • 제24권5호
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    • pp.359-363
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    • 2011
  • To integrate the sensor driver and logic circuits, fabricating down scaled transistors has been main issue. At this research, short channel effects were analyzed after n channel polycrystalline silicon thin film transistor was fabricated at high temperature. As a result, on current, on/off current ratio and transconductance were increased but threshold voltage, electron mobility and s-slope were reduced with a decrease of channel length. When carriers that develop at grain boundary in activated polycrystalline silicon have no gate biased, on current was increased with punch through by drain current. Also, due to BJT effect (parallel bipolar effect) that developed under region of channel by increase of gate voltage on current was rapidly increased.

A Low Close-in Phase Noise 2.4 GHz RF Hybrid Oscillator using a Frequency Multiplier

  • 문현원
    • 한국산업정보학회논문지
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    • 제20권1호
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    • pp.49-55
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    • 2015
  • This paper proposes a 2.4 GHz RF oscillator with a very low close-in phase noise performance. This is composed of a low frequency crystal oscillator and three frequency multipliers such as two doubler (X2) and one tripler (X3). The proposed oscillator is implemented as a hybrid type circuit design using a discrete silicon bipolar transistor. The measurement results of the proposed oscillator structure show -115 dBc/Hz close-in phase noise at 10 kHz offset frequency, while only dissipating 5 mW from a 1-V supply. Its close-in phase noise level is very close to that of a low frequency crystal oscillator with little degradation of noise performance. The proposed structure which is consisted of a low frequency crystal oscillator and a frequency multiplier provides new method to implement a low power low close-in phase noise RF local oscillator.

Effects of Fast Neutron Irradiation on Switching of Silicon Bipolar Junction Transistor

  • Sung Ho Ahn;Gwang Min Sun
    • Journal of Radiation Protection and Research
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    • 제48권3호
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    • pp.124-130
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    • 2023
  • Background: When bipolar junction transistors (BJTs) are used as switches, their switching characteristics can be deteriorated because the recombination time of the minority carriers is long during turn-off transient. When BJTs operate as low frequency switches, the power dissipation in the on-state is large. However, when BJTs operate as high frequency switches, the power dissipation during switching transients increases rapidly. Materials and Methods: When silicon (Si) BJTs are irradiated by fast neutrons, defects occur in the Si bulk, shortening the lifetime of the minority carriers. Fast neutron irradiation mainly creates displacement damage in the Si bulk rather than a total ionization dose effect. Defects caused by fast neutron irradiation shorten the lifetime of minority carriers of BJTs. Furthermore, these defects change the switching characteristics of BJTs. Results and Discussion: In this study, experimental results on the switching characteristics of a pnp Si BJT before and after fast neutron irradiation are presented. The results show that the switching characteristics are improved by fast neutron irradiation, but power dissipation in the on-state is large when the fast neutrons are irradiated excessively. Conclusion: The switching characteristics of a pnp Si BJT were improved by fast neutron irradiation.

RC(Reverse Conduction) IGBT를 적용한 Inverter Module에 대한 연구 (The Study of Inverter Module with applying the RC(Reverse Conduction) IGBT)

  • 김재범;박시홍
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.359-359
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    • 2010
  • IGBT(Insulated Gate Bipolar Transistor) 란 MOS(Metal Oxide Silicon) 와 Bipolar 기술의 결정체로 낮은 순방향 손실(Low Saturation)과 빠른 Speed를 특징으로 기존의 Thyristor, BJT, MOSFET 등으로 실현 불가능한 분양의 응용처를 대상으로 적용이 확대 되고 있고, 300V 이상의 High Power Application 영역에서 널리 사용되고 있는 고효율, 고속의 전력 시스템에 있어서 필수적으로 이용되는 Power Device이다. IGBT는 출력 특성 면에서 Bipolar Transistor 이상의 전류 능력을 가지고 있고 입력 특성 면에서 MOSFET과 같이 Gate 구동 특성을 갖기 때문에 High Switching, High Power에 적용이 가능한 소자이다. 반면에, Conventional IGBT는 MOSFET과 달리 IGBT 내부에 Anti-Parallel Diode가 없기 때문에 Inductive Load Application 적용시에는 별도의 Free Wheeling Diode가 필요하다. 그래서, 본 논문에서 별도의 Anti-Parallel Diode의 추가 없이도 Inductive Load Application에 적용 가능한 RC IGBT를 적용하여 600V/15A급 Three Phase Inverter Module을 제안 하고자 한다.

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A Design of BJT-based ESD Protection Device combining SCR for High Voltage Power Clamps

  • Jung, Jin-Woo;Koo, Yong-Seo
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권3호
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    • pp.339-344
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    • 2014
  • This paper presents a novel bipolar junction transistor (BJT) based electrostatic discharge (ESD) protection device. This protection device was designed for 20V power clamps and fabricated by a process with Bipolar-CMOS-DMOS (BCD) $0.18{\mu}m$. The current-voltage characteristics of this protection device was verified by the transmission line pulse (TLP) system and the DC BV characteristic was verified by using a semiconductor parameter analyzer. From the experimental results, the proposed device has a trigger voltage of 29.1V, holding voltage of 22.4V and low on-resistance of approximately $1.6{\Omega}$. In addition, the test of ESD robustness showed that the ESD successfully passed through human body model (HBM) 8kV. In this paper, the operational mechanism of this protection device was investigated by structural analysis of the proposed device. In addition, the proposed device were obtained as stack structures and verified.

비정질 및 단결정 실리콘에서 10~50 keV 에너지로 주입된 안티몬 이온의 분포와 열적인 거동에 따른 연구 (A Study on Implanted and Annealed Antimony Profiles in Amorphous and Single Crystalline Silicon Using 10~50 keV Energy Bombardment)

  • 정원채
    • 한국전기전자재료학회논문지
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    • 제28권11호
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    • pp.683-689
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    • 2015
  • For the formation of $N^+$ doping, the antimony ions are mainly used for the fabrication of a BJT (bipolar junction transistor), CMOS (complementary metal oxide semiconductor), FET (field effect transistor) and BiCMOS (bipolar and complementary metal oxide semiconductor) process integration. Antimony is a heavy element and has relatively a low diffusion coefficient in silicon. Therefore, antimony is preferred as a candidate of ultra shallow junction for n type doping instead of arsenic implantation. Three-dimensional (3D) profiles of antimony are also compared one another from different tilt angles and incident energies under same dimensional conditions. The diffusion effect of antimony showed ORD (oxygen retarded diffusion) after thermal oxidation process. The interfacial effect of a $SiO_2/Si$ is influenced antimony diffusion and showed segregation effects during the oxidation process. The surface sputtering effect of antimony must be considered due to its heavy mass in the case of low energy and high dose conditions. The range of antimony implanted in amorphous and crystalline silicon are compared each other and its data and profiles also showed and explained after thermal annealing under inert $N_2$ gas and dry oxidation.

PMOS가 삽입된 SCR 기반의 ESD 보호 회로에 관한 연구 (A Study on SCR-Based ESD Protection Circuit with PMOS)

  • 곽재창
    • 전기전자학회논문지
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    • 제23권4호
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    • pp.1309-1313
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    • 2019
  • 본 논문에서는 Gate grounded NMOS(GGNMOS)와 Gate grounded Lateral insulated gate bipolar transistor(GGLIGBT), Silicon Controlled Rectifier(SCR), 그리고 제안된 ESD 보호 소자에 대한 전기적 특성을 비교 및 분석하였다. 우선 각 소자에 대한 I-V 특성 곡선을 시뮬레이션 함으로써 트리거 전압과 홀딩 전압을 확인하였다. 그 후에 각 소자에 대한 HBM 4k 시뮬레이션을 통해서 감내 특성을 확인하였다. HBM 4k 시뮬레이션 결과, 제안된 ESD 보호소자의 최대 온도가 GGNMOS와 GGLIGBT와 SCR에 비해서 낮기 때문에 그만큼 감내 특성이 개선되었다고 할 수 있으며, 이는 신뢰성 측면에서 우수한 ESD 보호소자임을 의미한다.