• Title/Summary/Keyword: Silicon(IV)

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A Study on Laser Assisted Machining for Silicon Nitride Ceramics (IV) - Mechanism and Application of LAM for Silicon Nitride Ceramics - (질화규소 세라믹의 레이저 예열선삭에 관한 연구 (IV) - 질화규소 세라믹의 레이저예열선삭 메커니즘 및 적용 -)

  • Kim, Jong-Do;Lee, Su-Jin;Park, Seo-Jeong;Lee, Jae-Hoon
    • Journal of Welding and Joining
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    • v.28 no.6
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    • pp.40-44
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    • 2010
  • Laser assisted machining (LAM) has been researched in order to machine the silicon nitride ceramics economically and effectively. LAM is an effective machining method by local heating of the cutting part to the softening temperature of the silicon nitride using laser beam. When silicon nitride ceramics is heated using a laser beam, the surface of silicon nitride ceramic is softened, oxidized and decomposed. And then surface hardness is decreased. Through machining in low viscosity and hardness conditions, silicon nitride was machined effectively and the life span of tool was increased. The plastic deformation was occurred due to softening of amorphous YSiAlON above $ 1,000^{\circ}C$. Transgranular fracture of ${\beta}-Si_3N_4$ was occurred when YSiAlON was not softened, but mostly intergranular fracture was occurred by the plastic deformation of softened YSiAlON.

Modeling of Electrical Characteristics in Poly Silicon Thin Film Transistor with Process Parameter (다결정 실리콘 박막 트랜지스터에서 공정 파라미터에 따른 전기적 특성의 모델링)

  • Jung, Eun-Sik;Choi, Young-Sik;Lee, Yong-Jae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.201-204
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    • 2001
  • In this paper, for modeling of electrical characteristics in Poly Silicon Thin Film Transistors with process parameters set up optimum values, So, the I-V characteristics of poly silicon TFT parameters are examined and simulated in terms of the variations in process parameter. And these results compared and analyzed simulation values with examination value. The simulation program for characteristic analysis used SUPREM IV for processing, Matlab for modeling by mathematics, and SPICE for electric characteristic of devices. Input parameter for simulation characteristics is like condition of device process sequence, these electric characteristic of $I_D-V_D$ $I_D-V_G$, variations of grain size. The Gate oxide thickness of poly silicon are showed similar results between real device characteristics and simulation characteristics.

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Modeling of Electrical Characteristics in Poly Silicon Thin Film Transistor with Process Parameter (다결정 실리콘 박막 트랜지스터에서 공정 파라미터에 따른 전기적 특성의 모델링)

  • 정은식;최영식;이용재
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
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    • pp.201-204
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    • 2001
  • In this paper, for modeling of electrical characteristics in Poly Silicon Thin Film Transistors with process parameters set up optimum values. So, the I-V characteristics of poly silicon TFT parameters are examined and simulated in terms of the variations in process parameter. And these results compared and analyzed simulation values with examination value. The simulation program for characteristic analysis used SUPREM IV for processing, Matlab for modeling by mathematics, and SPICE for electric characteristic of devices. Input parameter for simulation characteristics is like condition of device process sequence, these electric characteristic of I$_{D}$-V$_{D}$, I$_{D}$-V$_{G}$, variations of grain size. The Gate oxide thickness of poly silicon are showed similar results between real device characteristics and simulation characteristics.ristics.

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Electrical characterization of 4H-SiC MOSFET with aluminum gate according to design parameters (Aluminium Gate를 적용한 4H-SiC MOSFET의 Design parameter에 따른 전기적 특성 분석)

  • Seung-Hwan Baek;Jeong-Min Lee;U-yeol Seo;Yong-Seo Koo
    • Journal of IKEEE
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    • v.27 no.4
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    • pp.630-635
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    • 2023
  • SiC is replacing the position of silicon in the power semiconductor field due to its superior resistance to adverse conditions such as high temperature and high voltage compared to silicon, which occupies the majority of existing industrial fields. In this paper, the gate of 4H-SiC Planar MOSFET, one of the power semiconductor devices, was formed with aluminium to make the contrast and parameter values consistent with polycrystalline Si gate, and the threshold voltage, breakdown voltage, and IV characteristics were studied by varying the channel doping concentration of SiC MOSFET.

Study of Light-induced Degradation in Thin Film Silicon Solar Cells: Hydrogenated Amorphous Silicon Solar Cell and Nano-quantum Dot Silicon Thin Film Solar Cell (박막 실리콘 태양전지의 광열화현상 연구: 비정질 실리콘 태양전지 및 나노양자점 실리콘 박막 태양전지)

  • Kim, Ka-Hyun
    • Journal of the Korean Solar Energy Society
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    • v.39 no.1
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    • pp.1-9
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    • 2019
  • Light induced degradation is one of the major research challenges of hydrogenated amorphous silicon related thin film silicon solar cells. Amorphous silicon shows creation of metastable defect states, originating from elevated concentration of dangling bonds during light exposure. The metastable defect states work as recombination centers, and mostly affects quality of intrinsic layer in solar cells. In this paper we present results of light induced degradation in thin film silicon solar cells and discussion on physical origin, mechanism and practical solutions of light induced degradation in thin film silicon solar cells. In-situ light-soaking IV measurement techniques are presented. We also present thin film silicon material with silicon nano-quantum dots embedded within amorphous matrix, which shows superior stability during light-soaking. Our results suggest that solar cell using silicon nano-quantum dots in abosrber layer shows superior stability under light soaking, compared to the conventional amorphous silicon solar cell.

Selective Adsorption of Si(IV) onto Hydrotalcite from Alkali Leaching Solution of Black Dross (블랙드로스 알칼리 침출용액으로부터 hydrotalcite에 의한 규소(IV)의 선택적 흡착)

  • Song, Si Jeong;Lee, Man Seung
    • Resources Recycling
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    • v.28 no.2
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    • pp.54-61
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    • 2019
  • In order to recover pure alumina from black dross, leaching of mechanically activated black dross with NaOH solution resulted in an aluminate solution containing a small amount of Si(IV). Selective adsorption of Si(IV) onto hydrotalcite was investigated from 5 M NaOH solution where the concentration of Al(III) and Si(IV) was 13000 and 150 mg/L, respectively. Only Si(IV) was selectively loaded onto hydrotalcite, while Al(III) remained in the solution. Effect of the calcination treatment of hydrotalcite and concentration of calcined hydrotalcite and NaOH on the loading of Si(IV) was investigated. Although the loading percentage of Si(IV) was low from 5 M NaOH solution, most of the Si(IV) was removed by adjusting the concentration of NaOH by 48 times dilution with water when the concentration of calcined hydrotalcite was higher than 4.5 g/L. The loading of Si(IV) onto calcined hydrotalcite followed Freundlich adsorption isotherm.

ONO Ruptures Caused by ONO Implantation in a SONOS Non-Volatile Memory Device

  • Kim, Sang-Yong;Kim, Il-Soo
    • Transactions on Electrical and Electronic Materials
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    • v.12 no.1
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    • pp.16-19
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    • 2011
  • The oxide-nitride-oxide (ONO) deposition process was added to the beginning of a 0.25 ${\mu}m$ embedded polysiliconoxide-nitride-oxide-silicon (SONOS) process before all of the logic well implantation processes in order to maintain the characteristics of basic CMOS(complementary metal-oxide semiconductor) logic technology. The system subsequently suffered severe ONO rupture failure. The damage was caused by the ONO implantation and was responsible for the ONO rupture failure in the embedded SONOS process. Furthermore, based on the experimental results as well as an implanted ion's energy loss model, processes primarily producing permanent displacement damages responsible for the ONO rupture failure were investigated for the embedded SONOS process.

Study on the influence of i/p interfacial properties on the cell performance of flexible nip microcrystalline silicon thin film solar cells (i/p 계면 특성에 따른 nip 플렉서블 미세결정질 실리콘 박막 태양전지의 특성 연구)

  • Jang, Eunseok;Baek, Sanghun;Jang, Byung Yeol;Lee, Jeong Chul;Park, Sang Hyun;Rhee, Young Woo;Cho, Jun-Sik
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.05a
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    • pp.128.2-128.2
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    • 2011
  • 스테인레스 스틸 유연기판 위에 플라즈마 화학기상 증착법 (plasma enhanced chemical vapor deposition)을 이용하여 nip 구조의 미세결정질 실리콘 박막 태양전지 (microcrystalline silicon thin film solar cell)를 제조하고 i ${\mu}c$-Si:H광 흡수층과 p ${\mu}c$-Si:H 사이에 i a-Si:H 버퍼 층을 삽입하여 i/p 계면특성을 개선하고 이에 따른 태양전지 성능특성 변화를 조사하였다. ${\mu}c$-Si:H 박막으로 이루어진 i/p 계면에서의 구조적, 전기적 결함은 태양전지 내에서 생성된 캐리어의 재결합과 shunt resistance 감소를 초래하여 개방전압 (open circuit voltage) 및 곡선 인자 (fill factor)를 감소시키는 것으로 알려졌다. 제조된 미세결정질 실리콘 박막 태양전지는 SUS/Ag/ZnO:Al/n ${\mu}c$-Si:H/i ${\mu}c$-Si:H/p ${\mu}c$-Si:H 구조로 제작되었으며 i/p 계면 사이의 i a-Si;H 버퍼층 두께를 변화시키고 이에 따른 태양전지의 특성을 조사하였다. 태양전지의 구조적, 전기적 특성 변화는 Scanning Electron Microscope (SEM), UV-visible-nIR spectrometry, Photo IV와 Dark IV를 통하여 조사하였다.

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Experimental Study for Nerve Regeneration Using Tubes Filled with Autogenous Skeletal Muscle in a Gap of Rabbit Sciatic Nerves (백색 가토 좌골 신경의 신경 결손부위에서 자가 골격근 충진 도관을 이용한 신경재생 연구)

  • Lee, Jun-Mo;Shin, Sung-Jin;Seo, Jeong-Hwan;Song, Chang-Ho
    • Archives of Reconstructive Microsurgery
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    • v.12 no.1
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    • pp.1-12
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    • 2003
  • The bridging of nerve gaps is still one of the major problems in peripheral nerve surgery. To evaluate the role of silicon tube in nerve regeneration, gaps were made by resection of tibial components of sciatic nerves of twenty-five New Zealand rabbits. The gaps were divided into five groups. In group I, the tibial components of sciatic nerves were isolated and the incision immediately closed. In group II, 1-cm segments of the nerve were removed and the silicon tubes filled with autogenous skeletal muscle were sutured in place. In group III, 1-cm segments of the nerve were removed and the silicon tubes filled without muscle were sutured in place. In group IV, 2-cm segments of the nerve were removed and the silicon tubes filled with autogenous skeletal muscle were sutured in place. In group V, 2-cm segments of the nerve were removed and the silicon tubes filled without muscle were sutured in place. At 16th week, the eletromyography, the light and transmission electron microscopy were performed. Nerve conduction study stimulating sciatic nerve proximal to the lesion and recording at gastrocnemius muscle showed that the compound muscle action potentials of the group II with 1 cm nerve defect filled with muscle were higher amplitudes than the group III without muscle. Compound muscle action potentials of the group IV with 2 cm defect filled with muscle showed similar results in comparison with the group V. The light and transmission electron microscpy showed that a good morphological pattern of nerve regeneration in 1 cm gap than 2 cm and in gap with muscle than gap without muscle.

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An Experimental Study on Developing Ultra-High Strength Powder Concrete Using Low-heat Portland Cement (저열 포틀랜드 시멘트를 사용한 초고강도 분체 콘크리트 개발에 관한 실험적 연구)

  • Jo, Byung-Wan;Yoon, Kwang-Won;Kim, Heoun;Park, Jin-Mo
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.13 no.6 s.58
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    • pp.135-147
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    • 2009
  • In order to develop the ultra high strength concrete over 400Mpa at 28 day, Low-heat portland cement, ferro-silicon, silica-fume and steel fiber were mixed and tested under the special autoclave curing conditions. Considering the influence of Ultra high strength concrete. normal concrete is used as a comparison with low water-cement ratio possible Low-heat portland cement. Additionally, as a substitution of aggregates, we analyzed the compressive strength of Ferro Silicon by making the states of mixed and curing conditions differently. In addition, SEM films testified the development of C-S-H hydrates of Type III & Type IV, and tobermolite, zonolite due to the high temperature, high pressure of autoclave curing. Fineness of aggregate, filler and reactive materials in concrete caused 420Mpa compressive strength at 28day successfully.