• Journal of Sensor Science and Technology
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• v.8 no.3
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• pp.283-290
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• 1999

The $n^+/p/p^+$ junction PERL solar cell of $0.1{\sim}2{\Omega}{\cdot}cm$ (100) p type silicon wafer was fabricated through the following steps; that is, wafer cutting, inverted pyramidally textured surfaces etching by KOH, phosphorus and boron diffusion, anti-reflection coating, grid formation and contact annealing. At this time, the optical characteristics of device surface and the efficiency of doping concentration for resistivity were investigated. And diffusion depth and doping concentration for n+ doping were simulated by silvaco program. Then their results were compared with measured results. Under the illumination of AM (air mass)1.5, $100\;mW/cm^2$ $I_{sc}$, $V_{oc}$, fill factor and the conversion efficiency were 43mA, 0.6 V, 0.62. and 16% respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.12
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• pp.1015-1020
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• 2012

Resistance of the front electrode is the highest proportion of the ingredients of the series resistance in crystalline silicon solar cell. While resistance of the front electrode is decreased with larger area, it induces the optical loss, causing the conversion efficiency drop. Therefore the front electrode with high aspect ratio increasing its height and decreasing is necessary for high-efficiency solar cell in considering shadowing loss and resistance of front electrode. In this paper, we used the screen printing method to form high aspect ratio electrode by multiple printing. Screen printing is the straightforward technology to establish the electrodes in silicon solar cell fabrication. The several printed front electrodes with Ag paste on silicon wafer showed the significantly increased height and slightly widen finger. As a result, the resistance of the front electrode was decreased with multiple printing even if it slightly increased the shadowing loss. We showed the improved electrical characteristics for c-Si solar cell with repeatedly printed front electrode by 0.5%. It lays a foundation for high efficiency solar cell with high aspect ratio electrode using screen printing.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.142.2-142.2
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• 2015

Plasma etch endpoint detection (EPD) of SiO2 and PR layer is demonstrated by plasma impedance monitoring in this work. Plasma etching process is the core process for making fine pattern devices in semiconductor fabrication, and the etching endpoint detection is one of the essential FDC (Fault Detection and Classification) for yield management and mass production. In general, Optical emission spectrocopy (OES) has been used to detect endpoint because OES can be a simple, non-invasive and real-time plasma monitoring tool. In OES, the trend of a few sensitive wavelengths is traced. However, in case of small-open area etch endpoint detection (ex. contact etch), it is at the boundary of the detection limit because of weak signal intensities of reaction reactants and products. Furthemore, the various materials covering the wafer such as photoresist (PR), dielectric materials, and metals make the analysis of OES signals complicated. In this study, full spectra of optical emission signals were collected and the data were analyzed by a data-mining approach, modified K-means cluster analysis. The K-means cluster analysis is modified suitably to analyze a thousand of wavelength variables from OES. This technique can improve the sensitivity of EPD for small area oxide layer etching processes: about 1.0 % oxide area. This technique is expected to be applied to various plasma monitoring applications including fault detections as well as EPD.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.30.1-30.1
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• 2009

정보화가 급속히 진전됨에 따라 보다 많은 양의 정보를 전송, 처리, 저장하게 되면서 이를 위해 대용량, 고속, 비휘발성의 특징을 갖는 차세대 메모리의 개발이 절실히 요구되고있다. 이 중 저항 변화 메모리(ReRAM)는 일반적으로 TiO2, Al2O3, NiO2, HfO2, ZrO2 등의 전이금속산화물을 이용한 MIM 구조로서 적당한 전기 신호를 가하면 저항이 높아서 전도되지 않는 상태(Offstate)에서 저항이 낮아져 전도가 가능한 상태(On state)로 바뀌는 메모리 특성을가진다. ReRAM은 비휘발성 메모리이며 종래의 비휘발성 기억소자인 Flash memory 보다 access time 이105 배 이상 빠르고, 5V 이하의 낮은 전압에서도 동작이 가능하다. 또한 구조가 간단하여 공정 단순화가 가능하고 소자의 집적화도 쉽다는 점 등 많은 장점들이 있어서 Flash memory를 대체할 수 있는 유력한 후보로 여겨지고 있다. 본연구에서는 DC-magnetron Sputtering 방법으로 전이금속 박막을 증착하고, Dry furnace로 산화시켜 전이금속산화물 박막을 제작한 후 저항변화 특성을 연구하였다. 두 개의 전이금속산화물 박막을 dual-layer로 형성시켜 저항변화특성을 관찰하였으며 또한, 전이금속산화물 박막의 조성을 달리 하여 저항변화를 관찰 하였다. 전이금속산화물 박막의 전기적 특성을 알아보기 위해 Si(100) wafer 위에 Pt를 이용 MIM 형태로 capacitor 시편을 제작 하여, probe station으로 I-V 측정을 하였고 조성 및 표면 분석을 위해서는 AES와 AFM을, 미세구조를 분석을 위해서는 TEM과 SEM 을 사용하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.2
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• pp.260-266
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• 2002

DLC films were deposited on Si wafer by RF plasma assisted CVD using CH4 gas. Tribological tests were conducted using rotating type ball on disk friction tester in dry air. Four kinds of mating balls were used. The mating balls were made with stainless steel but apply different annealing conditions to achieve different hardness conditions. Testing results in all load conditions showed that the harder the mating materials, the lower the friction coefficient among the three kind of martensite mating balls. In case of austenite balls, the friction coefficients were lower than fully annealed martensite ball. The high friction coefficient in soft martensite balls seems to be caused by the larger contact area between DLC film and ball. The wear tracks of DLC films and mating balls could have proven that effect. Measuring the wear track of both DLC films and mating balls have similar tendency comparing to the results of friction coefficients. Wear rate of austenite balls were also smaller than that of fully annealed martensite ball. The results of effect of applying load showed, the friction coefficients were become decrease when the applying loads exceed critical load conditions. The wear track of mating balls showed that some material transfer occurs from DLC film to mating ball during the high friction process. Raman spectra analysis showed that transferred material was a kind of graphite and contact surface of DLC film seems to undergo phase transition from carbon to graphite during the high friction process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.4
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• pp.467-473
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• 2013

In this study, two-dimensional finite element models were developed and experiments were conducted using an atomic force microscope to investigate the tribological characteristics of an SU-8 layer coated on a patterned wafer for microsystem applications. The results revealed that both the adhesion and the friction forces measured by the atomic force microscope were lower for the SU-8 coated surface than for the bare silicon surface. This is attributed to the hydrophobicity of SU-8. Another important result derived from the finite element analysis was the critical load required to fracture the SU-8 film with respect to the thickness. The critical loads for thicknesses of 200, 400, and 800 nm were approximately 13, 22, and 28 mN, respectively, which corresponded to a Hertzian contact pressure of 1.2-1.8 GPa. These results will aid in the design of a suitable SU-8 thickness for microsystem components that are in contact with one another.

• Journal of Sensor Science and Technology
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• v.13 no.4
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• pp.258-263
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• 2004

In this study, we carried out a basic study for the development of optical transcutaneous $pCO_{2}$ gas sensor and analyzer using non-invasive method. The basic principle of $pCO_{2}$ measurement is adapted Beer lambert's law and embodied the system using NDIR method. This measuring system was composed of a IR lamp, a optical filter, a optical reaction chamber, pyroelectric sensor and a signal process. We measured $EtCO_{2}'s$ concentration in basis step instead of $pCO_{2}$ gas that can collect by inflicting heat in outer skin. We minimize the size of optical reaction chamber which takes up the largest volume, to make the portable sensor. We made optical reaction chamber in Si wafer using MEMS technology and the optical reaction chamber was shortened to 2 mm and we carried out an experiment. When we injected the $EtCO_{2}$ to the inside of the optical reaction chamber, we could confirm change of 4.6 mV. The system response time was within 2 second that is fairly fast.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.5
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• pp.307-311
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• 2009

In this study, TiCrN films were deposited on STS 316 Land Si (100) wafer by inductively coupled plasma (ICP) assisted D.C. magnetron sputtering. The effect R.F. power for ICP discharge on the mechanical properties of TiCrN films was investigated. XRD, XPS and FE-SEM were used for the structure analysis. Also the Micro-Knoop hardness tester and profilometer were used for measuring hardness of coatings and film stress respectively. As increasing the R.F. power for ICP discharge, thickness of coating was decreased from 1633 nm to 1288 nm but hardness was increased about $Hk_{5g}$ 4200 at 400 W. All of the XRD patterns showed (111), (200) and (220) peaks of TiCrN films. Surface morphology was studied using the profilometer. FE-SEM was used to know morphology and cross-section of the films. Structure of the films was changed dense as increased ICP power.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.5
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• pp.267-274
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• 2009

Titanium Chromium Nitrided (TiCrN) coatings were deposited on stainless steel 316 L and Si (100) wafer by inductively coupled plasma assisted D.C. magnetron sputtering at the various sputtering power on Cr target and $N_2/Ar$ gas ratio. Increasing the sputtering power of Cr target, XRD patterns were changed from TiCrN to nitride $Cr_2Ti$. The maximum hardness was $Hk_{3g}$ 3900 at $0.3\;N_2/Ar$ gas ratio. The thickness of the TiCrN films increased as the Cr target power increased, and it showed over $Hk_{5g}3100$ hardness at 100 W, 150 W. TiCrN films were deposited by the ICP assisted DC magnetron sputtering shown good wear resistance as the $N_2/Ar$ gas ratio was 0.1, 0.3.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.179-179
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• 2016

희토류계 영구자석은 높은 보자력과 잔류 자화을 가지고 있어 자기기록저장매체, MEMS(엑츄에이터), 센서 등의 응용 분야에 적용시키기 위해 다양한 연구들이 진행되고 있다. 하지만 희토류계 원소의 수급 및 가격의 문제점으로 친환경자석으로의 전환 및 희토류나 중희토류를 사용하지 않는 비희토류계 영구자석을 개발하는 연구에 대한 필요성이 대두되고 있다. 이 중 Fe-N 계 자성 물질인 $Fe_{16}N_2$는 포화 자화 값이 현재까지의 자성물질 중 가장 높은 값(240emu/g)을 나타내며 상대적으로 높은 결정자기이방성 상수를 가지고 있어 비희토류계 영구자석 물질 중 하나로 주목받고 있다. 본 연구에서는 $Fe_{16}N_2$ 박막을 얻기 위해 DC Magnetron Sputtering 방법을 이용하여 Si wafer 위에 박막을 증착하고 증착공정 조건 중 질소 유량 및 Sputtering Power를 변수로 따른 박막의 성장, 조직변화, 자성 특성을 관찰을 통해 최적의 공정 조건을 찾고자 하였다. $N_2$ 가스 유량 변화에 따른 박막의 성장 속도는 거의 변화가 없었으며 $N_2$ 가스 유량의 증가에 따라 박막 내 Fe의 함유량은 감소하였다. 모든 공정 조건에서 $Fe_3N$, $Fe_4N$, $Fe_{16}N_2$ 상들이 섞여 성장하였으며 XRD를 통한 상분석과 더불어 VSM을 통한 자성 특성을 분석해본 결과 $Fe_{16}N_2$의 분율이 가장 높게 성장된 공정 조건은 Power는 200W, $N_2$ 가스 유량은 20sccm이었으며 이 조건에서 2.45T의 포화 자화 값과 1.4T의 잔류 자화 값을 얻을 수 있었다.