• 한국정보통신학회논문지
• /
• 제12권9호
• /
• pp.1615-1622
• /
• 2008

경사형 스페이서와 LDD 영역을 갖는 다결정 실리콘 TFT를 제작하였다. 소자 특성의 신뢰성을 위해 수소($H_2$)와 수소/플라즈마 처리 공정으로 수소 처리된 n-채널 다결정실리콘 TFT 소자를 제작하였다. 소자에 최대 누설전류의 게이트 전압 조건에서 소자에 스트레스를 인가시켰다. 게이트 전압 스트레스 조건에 의해 야기되는 열화 특성인자들인 드레인 전류, 문턱전압($V_{th}$), 부-문턱전압 기울기(S), 최대 전달 컨덕턴스($g_m$), 그리고 파워인자 값을 측정/추출하였으며, 수소처리 공정이 소자 특성의 열화 결과에 미치는 관계를 분석하였다. 특성 파라미터의 분석 결과, 수소화 처리시킨 n-채널 다결정 실리콘 박막 트랜지스터에서 열화특성의 원인들은 다결정실리콘/산화막의 계면과 다결정 실리콘의 그레인 경계에서 실리콘-수소 본드의 해리에 의한 현수 본드의 증가이었다. 따라서 새로 제안한 다결정 TFT의 구조는 제작 공정 단계가 간단하며, 소자 특성에서 누설전류가 드레인 영역 근처 감소된 수평 전계에 의해 감소되었다.

• Bulletin of the Korean Chemical Society
• /
• 제24권6호
• /
• pp.832-836
• /
• 2003

To extend the knowledge of triple bonding between group 6 transition metal and heavier group 14 elements, the structural and bonding aspects of ($η^5-C_5H_5$)$(CO)_2$M≡ER (M = Cr, Mo, W; E = Si, Ge, Sn, Pb) are investigated by hybrid density functional calculations at the B3PW91 level. Substituent effects are also investigated with R = H, Me, $SiH_3$, Ph, $C_6H_3-2,6-Ph_2$, $C_6H_3-2,6-(C_6H_2-2,4,6-Me_3)_2$, and $C_6H_3-2,6-(C_6H_2-2,4,6- iPr_3)_2$.

• 한국진공학회지
• /
• 제10권1호
• /
• pp.104-111
• /
• 2001

$SiH_4$, $CH_4$, $B_2H_6$ 혼합기체를 이용하여 플라즈마 화학증착법으로 비정질 탄화실리콘(a-SiC:H) 박막을 증착하였다. 기상 doping 농도를 0에서 $2.5\times10^{-2}$ 범위에서 변화시켜 얻은 박막의 물성을 SEM, XRD, Raman 분광법, FTIR, SIMS, 광흡수도와 전기전도도 분석을 통하여 살펴보았다. $B_2H_6$/($CH_4+SiH_4$) 기체유량비가 증가할수록 붕소의 도핑효율와 미세결정성은 감소하였다. 증착 중 $B_2H_6$ 기체가 첨가됨에 따라 비정질 탄화실리콘 박막의 Si-C-H 결합기의 강도는 감소하였으며, 이의 영향으로 박막내의 수소함량은 $B_2H_6/(SiH_4+CH_4$) 기체 유량비가 증가함에 따라 16.5%에서 7.5%로 단조감소하였다. $B_2H_6(CH_4+SiH_4$) 기체유량비가 증가할수록 a-SiC:H 박막의 광학적 밴드갭과 전기활성화 에너지는 감소하였고, 전기전도도는 증가하였다.

• 한국세라믹학회지
• /
• 제46권4호
• /
• pp.425-428
• /
• 2009

We performed a density functional theory study to investigate the interaction of DEMS (diethoxymethylsilane) with the H-terminated Si (001) surface. The optimum structure of DEMS was first calculated by a first principles study. The dissociation probability of the O-C bond of DEMS was higher than the other seven bonds based on the bond energy calculation. When the fragmented DEMS groups reacted with the H-terminated Si (001) surface, it was the most favorable among the eight reactions to form a bond between the Si atom on the surface and the O atom of a fragmented DEMS group (($C_2H_5O$)Si($CH_3$)(H)-O-) by forming a $C_2H_6$ as by-product.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1997년도 추계학술대회 논문집 학회본부
• /
• pp.336-338
• /
• 1997

The anneal behavior of ArF excimer Laser CVD SiON films has been studied using FT-IR absorption spectroscopy. The anneal temperature range was $400{\sim}800^{\circ}C$ Abundant hydrogen effusion from thes layers was observed as anneal temperature increased. The coexistence of both Si-H am N-H bonds offers the possibility for cross linking am evidence for the occurrence of cross lingking was found in the IR spectrum. The electrical properties were also obtained that tire films have low leakage currents am good TZDB properties.

• 대한전기학회논문지
• /
• 제41권5호
• /
• pp.483-491
• /
• 1992

Plasma silicon oxynitride film has been applied as a final passivation layer for semiconductor devices, because it has high resistance to humidity and prevents from alkali ion's penetration, and has low film stress. Structure properties of plasma silicon oxynitride film have been studied experimentally by the use of FT-IR, AES, stress gauge and ellipsometry. In this experiment,Si-N bonds increase as NS12TO/(NS12TO+NHS13T) gas ratio increases. Peaks of Si-N bond, Si-H bond and N-H bond were shifted to high wavenumber according to NS12TO/(NS12TO+NHS13T) gas ratio increase. Absorption peaks of Si-H bond were decreased by furnace anneal at 90$0^{\circ}C$. The atomic composition of film represents that oxygen atoms increase as NS12TO/(NS12TO+NHS13T) gas ratio increases, to the contrary, nitrogen atoms decrease.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
• /
• pp.71-71
• /
• 2012

As the critical dimensions of integrated circuits are scaled down, the line width and spacing between the metal interconnects are made smaller. The dielectric film used as insulation between the metal lines contributes to the resistance-capacitance (RC) time constant that governs the device speed. If the RC time delay, cross talk and lowering the power dissipation are to be reduced, the intermetal dielectric (IMD) films should have a low dielectric constant. The introduction of Cu and low-k dielectrics has incrementally improved the situation as compared to the conventional $Al/SiO_2$ technology by reducing both the resistivity and the capacitance between interconnects. Some of the potential candidate materials to be used as an ILD are organic and inorganic precursors such as hydrogensilsequioxane (HSQ), silsesquioxane (SSQ), methylsilsisequioxane (MSQ) and carbon doped silicon oxide (SiOCH), It has been shown that organic functional groups can dramatically decrease dielectric constant by increasing the free volume of films. Recently, various inorganic precursors have been used to prepare the SiOCH films. The k value of the material depends on the number of $CH_3$ groups built into the structure since they lower both polarity and density of the material by steric hindrance, which the replacement of Si-O bonds with Si-$CH_3$ (methyl group) bonds causes bulk porosity due to the formation of nano-sized voids within the silicon oxide matrix. In this talk, we will be introduce some properties of SiOC(-H) thin films deposited with the dimethyldimethoxysilane (DMDMS: $C_4H_{12}O_2Si$) and oxygen as precursors by using plasma-enhanced chemical vapor deposition with and without ultraviolet (UV) irradiation.

• 통합자연과학논문집
• /
• 제3권4호
• /
• pp.219-225
• /
• 2010

On the surface of mesoporous silica thin films (MSTF) which were fabricated by sol-gel approach there are existences of water and three different silanol types including chained, germinal and isolated silanol. Their amounts changes as a function of aging time of used sol solution, as confirmed by FT-IR. The adsorbed water generates ionic carriers such as H+ and OH- and passivates the Si dangling bonds at the interface of silicon wafer-MSTF. The ionic carriers can not only transport across the thickness of thin film to enhance the leakage current but also diffuse toward the silicon wafer-MSTF interface to depassivate Si dangling bonds. On the other hand, chained silanols or germinal silanols promote the moisture adsorption of MSTF and tend to form strongly hydrogen bonded systems with adsorbed water molecules resulting in very high dielectric constant. Isolated silanol, on the contrary, affects less on electrical properties of thin film.

• 대한화학회지
• /
• 제50권4호
• /
• pp.281-290
• /
• 2006

Hybrid DFT 계산 방법을 이용하여 1H-Indene과 Mono-sila-1H-indene 분자의 구조와 특성에 관한 이론적 연구를 수행하였다. 이 분자들의 방향족성 특성 연구를 위하여 MO, 비등방성 자기 민감도 등을 계산하였다. 1H-Indene과 Mono-sila-1H-indene 분자들에 대한 X8-X9 결합의 상대적인 안정도와 특성을 이해하기 위하여 NBO 계산을 수행하였다. 그 결과, 8, 9 위치의 Si 원자들이 C 원자들로 치환되었을 때, p orbital의 기여도가 증가하였다. 이러한 결과는 X8-X9 결합 길이는 하이브리드 오비탈의 p 오비탈 기여도에 크게 영향받는 사실을 보여준다. NBO계산을 통하여 X8-X9로부터 *X8-X9 결합 오비탈로의 비편재화에 기인하는 정량적인 에너지 안정화 세기를 결정하였다. MO 분석 결과 연구 대상 분자들의 방향족성은 3개의 비편재화된 pMO와 2개의 비편재화된 sMO에 의해서 주로 영향 받는다는 사실을 알 수 있었다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
• /
• pp.170-171
• /
• 2006

The chemical shift of SiOC film was observed according to the flow rate ratio. SiOC film has the broad main band of $880{\sim}1190cm^{-1}$ and the sharp Si-$CH_3$ bond at $1252cm^{-1}$, and the infrared spectra in the Si-O-C bond moved to low frequency according to the increasing of an oxygen flow rate. The chemical shift affected the carbon content in the SiOC film, and the decreasing of carbon atoms elongated the C-H bonding length, relatively. The main bond without the sharp Si-$CH_3$ bond at $1252cm^{-1}$ consisted of Si-C, C-O and Si-O bonds, and became the bonding structure of the Si-O-C bond.