• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.4
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• pp.175-178
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• 2018

Copper is a well know material for use as heat sink or heat exchanger. However, copper has a considerable low tensile strength and temperature limit. A material that has a good thermal conductivity, low cost, but also excellent mechanical properties are desired. In order to identify the mechanism for the material properties of cast Cu-Fe alloys, $Cu_{50}-Fe_{50}$ (wt.%) alloy was produced by using a high-frequency induction furnace, a typical metal casting process. The Cu-Fe alloy consists of Cu, ${\alpha}$-Fe, ${\gamma}$-Fe with dendrite structures. The crystal structure and microstructure of the prepared $Cu_{50}-Fe_{50}$ alloy were systematically examined using XRD, FE-SEM, EDS and XRF for electrical devices.

• Economic and Environmental Geology
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• v.52 no.6
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• pp.595-604
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• 2019

The purpose of this study was simply to obtain gold through a microwave-nitric acid experiment of invisible gold concentrate with the use of filter paper. For the purpose, this study conducted a microwave-nitric acid leaching experiment and examined nitric acid concentration. As a result of the experiment, this study discovered that Fe, Te and Ag were completely leached in the leaching solution whereas Au was not determined in all of the nitric acid conditions. The leaching solution was filtered with three filter papers and then these filter papers were analyzed with SEM/EDS. As a result of the EDS analysis, Au was detected in all of the surface and cross-section of the 1st, 2nd and 3rd filter papers. As the three filter papers containing solid-residue were analysed in the lead-fire assay, gold particles were found in all of the nitric acid conditions. In the lead-fire assay, maximum gold(452.50g/t) was recovered when nitric acid concentration was 6M and microwave leaching time was 12mins.

• Korean Journal of Materials Research
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• v.8 no.9
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• pp.807-812
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• 1998

Interfacial reaction and mechanical properties between Sn-Bi-X ternary alloys(X : 2Cu. 2Sb 5In) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 60days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3mm $\textrm{min}^{-1}$ to measure strength and elongation. According to the result of EDS, it is supposed that the soldered interfacial zone was composed of $\textrm{Cu}_{3}\textrm{Sn}$ and $\textrm{Cu}_{6}\textrm{Sn}_{5}$. According to the tensile test of Cu/solder joint, joint strength was decreased by aging treatment. Fractographs of Cu/Sn-Bi solder detailed the effect of aging on fracture behavior. When intermetallic was thin, the fracture occurred through the solder. But as the interfacial intermetallic is thickened, the fracture propagated along the intermetallic/solder interface.

• Journal of Technologic Dentistry
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• v.34 no.3
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• pp.227-235
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• 2012

Purpose: This study compared the surface hardness (Vickers) and microstructural characteristics between a type IV stone with and without die hardening treatment, a polyurethane die material. Methods: Materials used were a type IV stone(MG Crystal Rock), two die hardeners (Hardening bath, Epox-it), and a polyurethane resin material(Polyluck). Six specimens per group were prepared according to manufacturer's directions. The prepared specimens were tested by means of hardness test, one-way ANOVA analysis, scanning electron microscopic(SEM) observations and energy dispersive spectroscopic(EDS) analysis. Results: In the hardness test and its statistical analysis, there was no significant difference in the surface hardness between a type IV stone and type IV stone with die hardener coating, type IV stone mixed with an epoxy like material instead of water. In contrast, polyurethane resin material exhibited significantly greater surface hardness than other specimen groups (p<0.05). Conclusion: By considering the results of the hardness test, SEM observations and EDS analysis, although the die hardeners on type IV stone did not show remarkable improvement in surface hardness, the die hardener coating on the surface of type IV stone material did show decrease of microporous and improvement of surface defects.

• Korean Journal of Materials Research
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• v.11 no.4
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• pp.324-328
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• 2001

CrN films were deposited onto STD61 steel substrates using an arc-ion plating apparatus, with and without ion-nitriding pretreatment, and their oxidation was studied between 700 and $900^{\circ}C$ for 40hr in air. The oxidation behavior was examined by thermogravimetric analyses, X-ray diffraction. EDS and SEM. The deposited CrN films consisted of CrN and $Cr_2$N phases. The CrN films increased the oxidation resistance of the substrate by forming a protective $Cr_2$$O_3$ layer. The ion-nitriding pretreatment has not affected the oxidation resistance of the CrN film.

• Bulletin of the Korean Chemical Society
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• v.31 no.10
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• pp.2835-2840
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• 2010

A series of $MoO_3/CeO_2-ZrO_2$ catalysts with different Mo content (8 - 20 wt %) were prepared by simple co-precipitation followed by impregnation method and were characterized by X-ray diffraction (XRD), infrared spectroscopy (IR), scanning electron microscopy (SEM), energy dispersive spectroscopic (EDS) techniques. The prepared materials were tested for catalytic activity by the synthesis of benzimidazole derivatives using condensation of aromatic aldehydes and o-phenylenediamine by conventional and microwave method. Obtained results reveal that the catalytic activity increases with increase in Mo wt % loading. The best catalytic activity was obtained with 20 wt % $MoO_3/CeO_2-ZrO_2$. The particle size or crystallite size was estimated using Debye-Scherrer equation. After completion of reaction, the catalyst can be recovered efficiently and reused with consistent activity.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.1-9
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• 2002

The intermetallic formation between Sn-Ag-(Cu) solders and metal pads in a real BGA package was characterized using SEM, EDS, and XRD. The intermetallic phase formed in the interface between Sn-Ag-Cu and Au/Ni/Cu pad is likely to be ternary compound of $(Cu,Ni)_6Sn_5$ from EDS analysis High concentration of Cu was observed in the solder/Ni interface. XRD analysis confirmed that $\eta -Cu_6 Sn_5$ type was intermetallic phase formed in the interface between Cu containing solders and Ni substrates and $Ni_3$Sn_4$ intermetallic was formed in the Sn-Ag solder/Ni interface. The thickness of intermetallic phase increased with the reflow times and Cu concentration in solder.

• Journal of the Korean Chemical Society
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• v.55 no.3
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• pp.430-435
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• 2011

Coal fly ash of thermal power plants converted into mesoporous materials MCM-41. The synthesized material was characterized by XRD, FT-IR, SEM, and EDS techniques. The catalytic activity of prepared material was studied for the synthesis of 5-arylindene malononitriles via Knoevenagel condensation of aromatic aldehydes and malonontrile is described. The features of present method are easy handling, stability, reusability, and eco-friendliness of catalyst, high yields, short reaction time, simple experimental and work up procedure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.576-577
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• 2005

In this paper, the oxidization characteristics were analyzed according to the shapes of Residual Current Protective Device(RCD) contacts. RCD is an electrical safety device specially designed to immediately switch the electricity off when electric leakage is detected at a level harmful to a person using electrical equipment. The shapes of RCD contacts are a little bit different according to the models. When RCD is turned on, stationary and moving contact do not fit together. So, it can cause the increase of contact resistance. To discover the deterioration characteristics of RCD contacts by switching repetition, the contacts were analyzed by stereo microscope, Scanning Electron Microscope(SEM) and Energy Dispersive X-ray Spectrometer(EDS).

• Mass Spectrometry Letters
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• v.4 no.3
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• pp.51-54
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• 2013

Isotopic analysis using thermal ionization mass spectrometry coupled with scanning electron microscopy (SEM-TIMS) was performed to determine the isotopic ratios of uranium contained in micro-particles in the 6th Nuclear Signatures Interlaboratory Measurement Evaluation Programme (NUSIMEP-6) sample. Elemental analysis by energy dispersive X-ray spectroscopy (EDS) was conducted on uranium-bearing mirco-particles, which were transferred to rhenium filaments for TIMS loading using a micromanipulation system in a SEM. A multi-ion-counter system was utilized to detect the ion signals of the four isotopes of uranium simultaneously. The isotope ratios of uranium corrected by bracketing using a reference material showed excellent agreement with the certified values. The measurement accuracy for $n(^{234}U)/n(^{238}U)$ and (b) $n(^{235}U)/n(^{238}U)$ was 10% and 1%, respectively, which met the requirements for qalification for the NetWork of Analytical Laboratories (NWAL).