마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제9권2호
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- Pages.1-9
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- 2002
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
BGA 패키지에서 Sn-Ag계 솔더범프와 Ni pad 사이에 형성된 금속간화합물의 분석
Intermetallic Formation between Sn-Ag based Solder Bump and Ni Pad in BGA Package
- Yang, Seung-Taek (Dept. of Materials Engineering, Hanyang Univ.) ;
- Chung, Yoon (Dept. of Materials Engineering, Hanyang Univ.) ;
- Kim, Young-Ho (Dept. of Materials Engineering, Hanyang Univ.)
- 발행 : 2002.06.01
초록
실제 BGA패키지에서 Sn-Ag-(Cu) 솔더와 금속패드가 반응하여 생성된 금속간 화합물의 특성을 Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS)f) X-ray Diffractometer (XRD)를 사용하여 분석하였다. EDS로 분석한 결과를 보면 BGA 패키지에서 Sn-Ag-Cu 솔더와 Au/Ni/Cu 금속층간의 반응으로 생성된 금속간화합물은
The intermetallic formation between Sn-Ag-(Cu) solders and metal pads in a real BGA package was characterized using SEM, EDS, and XRD. The intermetallic phase formed in the interface between Sn-Ag-Cu and Au/Ni/Cu pad is likely to be ternary compound of